Periodic Mesoporous Organosilicas, Chang-Sik Ha; Sung Soo Park
Автор: C?sar A.C. Sequeira; Michael J. Hudson Название: Multifunctional Mesoporous Inorganic Solids ISBN: 904814275X ISBN-13(EAN): 9789048142750 Издательство: Springer Рейтинг: Цена: 49613.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Proceedings of the NATO Advanced Study Institute, Sintra, Portugal, April 5-17, 1992
Автор: Vallet-Reg?, Mar?a , Garc?a, Miguel Manzano , Co Название: Biomedical Applications of Mesoporous Ceramics ISBN: 0367380609 ISBN-13(EAN): 9780367380601 Издательство: Taylor&Francis Рейтинг: Цена: 9798.00 р. Наличие на складе: Поставка под заказ.
Описание:
Developments in mesoporous ceramics in drug delivery, nanomedicine, and bone tissue regeneration have opened promising developments in biomedical research, many applicable in the clinic in the near future. Due to the ability to fine-tune the physicochemical properties of these materials, the field has experienced an impressive burst in the number of publications. As controlled drug delivery systems are one of the most promising applications for human health care, it is now necessary to set the milestones of this technology, from the very basic to the most advanced.
Biomedical Applications of Mesoporous Ceramics: Drug Delivery, Smart Materials and Bone Tissue Engineering is a comprehensive overview of silica-based mesoporous materials with special attention given to their use in drug delivery systems, sophisticated stimuli-responsive materials, and bone tissue engineering. The book provides a comprehensive overview of the basic aspects of the properties of mesoporous materials, with a focus on textural properties such as surface and porosity. Starting from this consolidated knowledge, it then addresses various aspects of more sophisticated stimuli-responsive materials and bone tissue engineering, detailing the research and development of these biomedical applications.
Описание: As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allowed by copper interconnects.
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