Автор: W.K. Jones; G?bor Hars?nyi Название: Multichip Modules with Integrated Sensors ISBN: 9401066310 ISBN-13(EAN): 9789401066310 Издательство: Springer Рейтинг: Цена: 18167.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Proceedings of the NATO Advanced Research Workshop, Budapest, Hungary, May 18-20, 1995
Описание: This book presents a study to determine the current limitations in the area of Photovoltaics (PV) as a source of renewable energy and proposes strategies to overcome them by applying optimization approaches in three main areas, namely related to photovoltaic solar cells, modules, and systems.
Автор: Maurizio Palesi; Masoud Daneshtalab Название: Routing Algorithms in Networks-on-Chip ISBN: 1461482739 ISBN-13(EAN): 9781461482734 Издательство: Springer Рейтинг: Цена: 22203.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book provides a single-source reference to routing algorithms for Networks-on-Chip (NoCs), as well as in-depth discussions of advanced solutions applied to current and next generation, many core NoC-based Systems-on-Chip (SoCs).
Автор: Steer Michael Название: Microwave and RF Design, Volume 4: Modules ISBN: 1469656965 ISBN-13(EAN): 9781469656960 Издательство: Mare Nostrum (Eurospan) Рейтинг: Цена: 2006.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Microwave and RF Design: Modules focuses on the design of systems based on microwave modules. The use of modules has become increasingly important in RF and microwave engineering for rapidly realizing high performance microwave systems. When integration is ultimately to be used, building a system up using modules provides a rapid means of prototyping and testing system concepts. A wide variety of RF modules including amplifiers, local oscillators, switches, circulators, isolators, phase detectors, frequency multipliers and dividers, phase-locked loops, and direct digital synthesizers are considered. Detailed design strategies for synthesizing filters based on parallel coupled lines are presented. The reader will gain an appreciation of design by synthesis. This book is suitable as both an undergraduate and graduate textbook, as well as a career-long reference book.
Key Features * The fourth volume of a comprehensive series on microwave and RF design * Open access ebook editions are hosted by NC State University Libraries at https: //repository.lib.ncsu.edu/handle/1840.20/36776 * 23 worked examples * An average of 21 exercises per chapter * Answers to selected exercises * 6 case studies illustrating design procedures * Emphasis on synthesis as well as building a rich library of microwave functions * A companion book, Fundamentals of Microwave and RF Design, is suitable as a comprehensive undergraduate textbook on microwave engineering
Автор: Alan T. Sherman Название: VLSI Placement and Routing: The PI Project ISBN: 1461396603 ISBN-13(EAN): 9781461396604 Издательство: Springer Рейтинг: Цена: 16769.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book provides a superb introduction to and overview of the MIT PI System for custom VLSI placement and routing. work (primarily on the place- ment problem) in the context of the overall design of PI and the contributions of the many other PI team members.
Автор: Martins Название: Analog Integrated Circuit Design Automation ISBN: 331934059X ISBN-13(EAN): 9783319340593 Издательство: Springer Рейтинг: Цена: 16070.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book introduces readers to a variety of tools for analog layout design automation. After discussing the placement and routing problem in electronic design automation (EDA), the authors overview a variety of automatic layout generation tools, as well as the most recent advances in analog layout-aware circuit sizing. The discussion includes different methods for automatic placement (a template-based Placer and an optimization-based Placer), a fully-automatic Router and an empirical-based Parasitic Extractor. The concepts and algorithms of all the modules are thoroughly described, enabling readers to reproduce the methodologies, improve the quality of their designs, or use them as starting point for a new tool. All the methods described are applied to practical examples for a 130nm design process, as well as placement and routing benchmark sets.
Автор: Carl Sechen Название: VLSI Placement and Global Routing Using Simulated Annealing ISBN: 1461289572 ISBN-13(EAN): 9781461289579 Издательство: Springer Рейтинг: Цена: 19591.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Alberto Sangiovanni-Vincentelli, my UC Berkeley advisor, had been a consultant at IBM, I re- ceived a copy of the original IBM internal report on simulated annealing approximately the day of its release.
Автор: Ulrich H. P. Fischer-Hirchert Название: Photonic Packaging Sourcebook ISBN: 3662521350 ISBN-13(EAN): 9783662521359 Издательство: Springer Рейтинг: Цена: 15672.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Guiding readers all the way from basic calculations to optimizing fiber-chip coupling efficiency, this volume reflects the diversity of the field of packaging photonic devices and is the first and only comprehensive sourcebook on photonic assembly techniques.
Автор: S. P. Anbuudayasankar; K. Ganesh; Sanjay Mohapatra Название: Models for Practical Routing Problems in Logistics ISBN: 3319050346 ISBN-13(EAN): 9783319050348 Издательство: Springer Рейтинг: Цена: 15372.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book deals with complex variants of Travelling Salesman Problem (TSP) and Vehicle Routing Problem (VRP) within the manufacturing and service industries.
Автор: Mysore Sriram; Sung-Mo (Steve) Kang Название: Physical Design for Multichip Modules ISBN: 079239450X ISBN-13(EAN): 9780792394501 Издательство: Springer Рейтинг: Цена: 26546.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Presents research work that has been conducted in the area of Multichip Module (MCM) design. This book presents an overview of the different MCM technologies. It discusses the various approaches to interconnect analysis. It also discuss the problems of partitioning, placement, and multilayer routing, with an emphasis on timing performance.
Автор: Jameel Ahmed; Mohammed Yakoob Siyal; Muhammad Tayy Название: RFID-WSN Integrated Architecture for Energy and Delay- Aware Routing ISBN: 9812874135 ISBN-13(EAN): 9789812874139 Издательство: Springer Рейтинг: Цена: 9141.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The book identifies the performance challenges concerning Wireless Sensor Networks (WSN) and Radio Frequency Identification (RFID) and analyzes their impact on the performance of routing protocols.
Автор: Rick Sturdivant and Mike Harris Название: Transmit Receive Modules for Radar and Communication Systems ISBN: 1608079791 ISBN-13(EAN): 9781608079797 Издательство: Artech House Рейтинг: Цена: 17741.00 р. Наличие на складе: Нет в наличии.
Описание: The use of electronically scanned phased arrays is increasing in systems such as radar, wireless networks, and satellite ground terminals. An important and necessary component for these systems is the transmit receive (T/R) module, which provides the amplification and electronic beam steering that is required for proper function. This new resource presents a comprehensive overview of all design, fabrication, integration, and implementation issues associated with T/R modules for radar and communications. This book provides engineers and researchers with practical designs and 44 examples of analysis, circuits, and components used in T/R modules. It also provides a solid explanation of the theory for how T/R modules operate and how they can be optimized. In addition, this book shows how the latest technical advances in silicon germanium (SiGe) and gallium nitride (GaN) are allowing levels of performance that were previously unachievable. The book concludes with informative chapters on testing, cost considerations, and the future of next generation T/R modules.
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