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Wood Adhesives, 


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Цена: 9798.00р.
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При оформлении заказа до: 2025-07-28
Ориентировочная дата поставки: Август-начало Сентября
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Название:  Wood Adhesives
ISBN: 9780367451127
Издательство: Taylor&Francis
Классификация:

ISBN-10: 0367451123
Обложка/Формат: Paperback
Страницы: 432
Вес: 0.80 кг.
Дата издания: 29.11.2019
Язык: English
Размер: 229 x 152 x 22
Читательская аудитория: Tertiary education (us: college)
Основная тема: Adhesives
Подзаголовок: Chemistry and Technology---Volume 2
Ссылка на Издательство: Link
Рейтинг:
Поставляется из: Европейский союз
Описание: This book discusses technically and economically important adhesives for wood bonding, covering their preparation and formulation, as well as techniques and suggestions for their application. It gives insight into the relationship between adhesive chemistry and technical application.


Advanced Wood Adhesives Technology

Автор: Pizzi, A.
Название: Advanced Wood Adhesives Technology
ISBN: 0367401991 ISBN-13(EAN): 9780367401993
Издательство: Taylor&Francis
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Цена: 9798.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: This work discusses the latest innovations in the manufacture of wood adhesives, and shows how to test their composition. Methods of varying parameters to obtain particular effects are explained, and background summaries of each class of adhesives are provided.

Adhesives Technology for Electronic Applications: Materials, Processing, Reliability

Автор: Licari James J., Swanson Dale W.
Название: Adhesives Technology for Electronic Applications: Materials, Processing, Reliability
ISBN: 0128103701 ISBN-13(EAN): 9780128103708
Издательство: Elsevier Science
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Цена: 23244.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups. The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this book particularly important for engineers and managers alike.The third edition has been updated throughout and includes new sections on nanomaterials, environmental impacts and new environmentally friendly ‘green’ adhesives. Information about regulations and compliance has been brought fully up-to-date.As well as providing full coverage of standard adhesive types, Licari explores the most recent developments in fields such as: Tamper-proof adhesives for electronic security devices. Bio-compatible adhesives for implantable medical devices. Electrically conductive adhesives to replace toxic tin-lead solders in printed circuit assembly – as required by regulatory regimes, e.g. the EU’s Restriction of Hazardous Substances Directive or RoHS (compliance is required for all products placed on the European market). Nano-fillers in adhesives, used to increase the thermal conductivity of current adhesives for cooling electronic devices.

Advanced Adhesives in Electronics: Materials, Properties and Applications

Автор: Alam M. O., Bailey C., Bailey Christopher
Название: Advanced Adhesives in Electronics: Materials, Properties and Applications
ISBN: 0081017324 ISBN-13(EAN): 9780081017326
Издательство: Elsevier Science
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Цена: 23580.00 р.
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Описание: Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties.The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics.With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field.

Electrical conductive adhesives with nanotechnologies

Автор: Wong, C. P. Li, Yi Lu, Daniel
Название: Electrical conductive adhesives with nanotechnologies
ISBN: 0387887822 ISBN-13(EAN): 9780387887821
Издательство: Springer
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Цена: 22203.00 р.
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Описание: Offers an overview of electronic packaging, and discusses the various adhesives options, including lead-free solder and Electrically Conductive Adhesives. This title discusses how nano techniques can be applied to conductive adhesives, including research and development of nano component adhesives/nano component films.


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