Описание: Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups. The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this book particularly important for engineers and managers alike.The third edition has been updated throughout and includes new sections on nanomaterials, environmental impacts and new environmentally friendly ‘green’ adhesives. Information about regulations and compliance has been brought fully up-to-date.As well as providing full coverage of standard adhesive types, Licari explores the most recent developments in fields such as: Tamper-proof adhesives for electronic security devices. Bio-compatible adhesives for implantable medical devices. Electrically conductive adhesives to replace toxic tin-lead solders in printed circuit assembly – as required by regulatory regimes, e.g. the EU’s Restriction of Hazardous Substances Directive or RoHS (compliance is required for all products placed on the European market). Nano-fillers in adhesives, used to increase the thermal conductivity of current adhesives for cooling electronic devices.
Название: Bio-inspired structured adhesives ISBN: 3319591134 ISBN-13(EAN): 9783319591131 Издательство: Springer Рейтинг: Цена: 20962.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание:
This book deals with the adhesion, friction and contact mechanics of living organisms. Further, it presents the remarkable adhesive abilities of the living organisms which inspired the design of novel micro- and nanostructured adhesives that can be used in various applications, such as climbing robots, reusable tapes, and biomedical bandages. The technologies for both the synthesis and construction of bio-inspired adhesive micro- and nanostructures, as well as their performance, are discussed in detail.
Representatives of several animal groups, such as insects, spiders, tree frogs, and lizards, are able to walk on (and therefore attach to) tilted, vertical surfaces, and even ceilings in different environments. Studies have demonstrated that their highly specialized micro- and nanostructures, in combination with particular surface chemistries, are responsible for this impressive and reversible adhesion. These structures can maximize the formation of large effective contact areas on surfaces of varying roughness and chemical composition under different environmental conditions.
Автор: Wong, C. P. Li, Yi Lu, Daniel Название: Electrical conductive adhesives with nanotechnologies ISBN: 0387887822 ISBN-13(EAN): 9780387887821 Издательство: Springer Рейтинг: Цена: 22203.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Offers an overview of electronic packaging, and discusses the various adhesives options, including lead-free solder and Electrically Conductive Adhesives. This title discusses how nano techniques can be applied to conductive adhesives, including research and development of nano component adhesives/nano component films.
Автор: Alam M. O., Bailey C., Bailey Christopher Название: Advanced Adhesives in Electronics: Materials, Properties and Applications ISBN: 0081017324 ISBN-13(EAN): 9780081017326 Издательство: Elsevier Science Рейтинг: Цена: 23580.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties.The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics.With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field.
Автор: Anthony J. Kinloch Название: Adhesion and Adhesives ISBN: 904814003X ISBN-13(EAN): 9789048140039 Издательство: Springer Рейтинг: Цена: 28732.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Over the last decade, or so, the growth in the use of adhesives, especially in ever more technically demanding applications, has been rapid and many major developments in the technology of adhesives have been reported. This growth has also led to attention being focused on somewhat more basic studies of the science of adhesion and adhesives, and in recent years our level of fundamental knowledge concerning the formation and mechanical performance of adhesive joints has increased dramatically. Such studies have, of course, been aided greatly by the development of the tools at the disposal of the investigators. For example, specific surface analytical techniques, such as X-ray photoelectron and secondary-ion mass spectroscopy, and the increasingly sophisticated methods of stress analysis and fracture mechanics have been put to good use in furthering our understanding of the science of adhesion and adhesives. The present book attempts to review the multidisciplined subject of adhesion and adhesives, considering both the science and technology involved in the formation and mechanical performance of adhesive joints. The author would like to thank his friends and colleagues for useful discus- sions and help in the preparation of this book. I am particularly grateful to P. Cawley, J. Comyn, W. A. Lees, A. C. Roulin-Moloney, W. C. Wake, J. G. Williams and R. J. Young who have read and commented on various chapters and P. Farr for preparing the diagrams.
Название: Wood Adhesives ISBN: 0367451123 ISBN-13(EAN): 9780367451127 Издательство: Taylor&Francis Рейтинг: Цена: 9798.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book discusses technically and economically important adhesives for wood bonding, covering their preparation and formulation, as well as techniques and suggestions for their application. It gives insight into the relationship between adhesive chemistry and technical application.
Автор: Fisher, P.E. Название: Selection of Engineering Materials and Adhesives ISBN: 036739300X ISBN-13(EAN): 9780367393007 Издательство: Taylor&Francis Рейтинг: Цена: 10104.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание:
Insufficient knowledge, time limitations, and budget constraints often result in poor material selection and implementation, which can lead to uncertain performance and premature failure of mechanical and electro-mechanical products. Selection of Engineering Materials and Adhesives is a professional guide to choosing the most appropriate materials and adhesives for product development applications from the onset.
This text emphasizes material properties and classifications, fabrication and processing considerations, performance objectives, and selection based on specific application requirements, such as frequency of use (duty cycle) and operating environment. Each chapter focuses on a particular material family, covering ferrous and non-ferrous metals, including steels, cast-iron, aluminum, and titanium, as well as plastics such as PVC, acrylics, and nylons. Unique to this book on material selection, the final chapter discusses critical aspects of adhesives, including cure methods and joint configurations. Selection of Engineering Materials and Adhesives presents materials that are most often used for selection processes and applications in product development. This book is an ideal text for senior level undergraduate or graduate courses in mechanical engineering and materials science as well as recent graduates or managers who are tasked with the daunting job of selecting a material for a new application or justifying a long-used material in a specific application. It embodies the author's own experience and lectures on this subject, taught at UCLA Extension, and provides students as well as practicing engineers the tools to systematically select the most appropriate materials and adhesives for their design work.
Автор: Industrieverband Klebstoffe e. V. Adh?sion kleben Название: Adhesives Technology Compendium 2009 ISBN: 3834809799 ISBN-13(EAN): 9783834809797 Издательство: Springer Рейтинг: Цена: 3917.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Das aktuelle Nachschlagewerk f r den Klebpraktiker bietet zuverl ssige Informationen ber Klebstoffanbieter, Ger te- und Anlagenhersteller sowie Trends aus Forschung und Entwicklung. Detailliertes Informationsverzeichnis rund um den Klebstoff, Zusammensetzung des Verbandes und dessen Gremien, statistisches Zahlenmaterial, Pr f- und Forschungseinrichtungen, Mitgliedsfirmen mit Produktionsprofilen
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