Selection of Engineering Materials and Adhesives, Fisher, P.E.
Автор: Mittal Название: Progress in Adhesion and Adhesives, Volume 3 ISBN: 1119526299 ISBN-13(EAN): 9781119526292 Издательство: Wiley Рейтинг: Цена: 31038.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание:
A solid collection of interdisciplinary review articles on the latest developments in adhesion science and adhesives technology
With the ever-increasing amount of research being published, it is a Herculean task to be fully conversant with the latest research developments in any field, and the arena of adhesion and adhesives is no exception. Thus, topical review articles provide an alternate and very efficient way to stay abreast of the state-of-the-art in many subjects representing the field of adhesion science and adhesives.
Based on the success of the preceding volumes in this series Progress in Adhesion and Adhesives), the present volume comprises 12 review articles published in Volume 5 (2017) of Reviews of Adhesion and Adhesives.
The subject of these 12 reviews fall into the following general areas:
1. Nanoparticles in reinforced polymeric composites.
2. Wettability behavior and its modification, including superhydrophobic surfaces.
3. Ways to promote adhesion, including rubber adhesion.
4. Adhesives and adhesive joints
5. Dental adhesion.
The topics covered include: Nanoparticles as interphase modifiers in fiber reinforced polymeric composites; fabrication of micro/nano patterns on polymeric substrates to control wettability behavior; plasma processing of aluminum alloys to promote adhesion; UV-curing of adhesives; functionally graded adhesively bonded joints; adhesion between unvulgarized elastomers; electrowetting for digital microfluidics; control of biofilm at the tooth-restoration bonding interface; easy-to-clean superhydrophobic coatings; cyanoacrylates; promotion of resin-dentin bond longevity in adhesive dentistry; and effects of nanoparticles on nanocomposites Mode I and Mode II fractures.
Описание: Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups. The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this book particularly important for engineers and managers alike.The third edition has been updated throughout and includes new sections on nanomaterials, environmental impacts and new environmentally friendly ‘green’ adhesives. Information about regulations and compliance has been brought fully up-to-date.As well as providing full coverage of standard adhesive types, Licari explores the most recent developments in fields such as: Tamper-proof adhesives for electronic security devices. Bio-compatible adhesives for implantable medical devices. Electrically conductive adhesives to replace toxic tin-lead solders in printed circuit assembly – as required by regulatory regimes, e.g. the EU’s Restriction of Hazardous Substances Directive or RoHS (compliance is required for all products placed on the European market). Nano-fillers in adhesives, used to increase the thermal conductivity of current adhesives for cooling electronic devices.
Автор: Alam M. O., Bailey C., Bailey Christopher Название: Advanced Adhesives in Electronics: Materials, Properties and Applications ISBN: 0081017324 ISBN-13(EAN): 9780081017326 Издательство: Elsevier Science Рейтинг: Цена: 23580.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties.The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics.With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field.
Автор: Pizzi, A. Название: Advanced Wood Adhesives Technology ISBN: 0367401991 ISBN-13(EAN): 9780367401993 Издательство: Taylor&Francis Рейтинг: Цена: 9798.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This work discusses the latest innovations in the manufacture of wood adhesives, and shows how to test their composition. Methods of varying parameters to obtain particular effects are explained, and background summaries of each class of adhesives are provided.
Автор: S.R. Hartshorn Название: Structural Adhesives ISBN: 1468477838 ISBN-13(EAN): 9781468477832 Издательство: Springer Рейтинг: Цена: 18284.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Adhesives in general and structural adhesives in particular are the subjects of much academic interest as well as commercial importance. The purpose of Structural Adhesives: Chemistry and Technology is to review the major classes of structural adhesives and the principles of adhesion and bonding as these relate to structural joints.
Автор: Wong, C. P. Li, Yi Lu, Daniel Название: Electrical conductive adhesives with nanotechnologies ISBN: 0387887822 ISBN-13(EAN): 9780387887821 Издательство: Springer Рейтинг: Цена: 22203.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Offers an overview of electronic packaging, and discusses the various adhesives options, including lead-free solder and Electrically Conductive Adhesives. This title discusses how nano techniques can be applied to conductive adhesives, including research and development of nano component adhesives/nano component films.
Автор: Haviland, G. S. Название: Machinery Adhesives for Locking, Retaining, and Sealing ISBN: 0367451654 ISBN-13(EAN): 9780367451653 Издательство: Taylor&Francis Рейтинг: Цена: 9645.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book guides designers, process engineers, or mechanics to select and use anaerobic machinery adhesives for sealing flanged joints, designing threaded connections for security and sealing, and designing adhesive assists for more durable shrink, press, and slip fitted assemblies.
Название: Bio-inspired structured adhesives ISBN: 3319591134 ISBN-13(EAN): 9783319591131 Издательство: Springer Рейтинг: Цена: 20962.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание:
This book deals with the adhesion, friction and contact mechanics of living organisms. Further, it presents the remarkable adhesive abilities of the living organisms which inspired the design of novel micro- and nanostructured adhesives that can be used in various applications, such as climbing robots, reusable tapes, and biomedical bandages. The technologies for both the synthesis and construction of bio-inspired adhesive micro- and nanostructures, as well as their performance, are discussed in detail.
Representatives of several animal groups, such as insects, spiders, tree frogs, and lizards, are able to walk on (and therefore attach to) tilted, vertical surfaces, and even ceilings in different environments. Studies have demonstrated that their highly specialized micro- and nanostructures, in combination with particular surface chemistries, are responsible for this impressive and reversible adhesion. These structures can maximize the formation of large effective contact areas on surfaces of varying roughness and chemical composition under different environmental conditions.
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