Автор: Wang Ran, Chakrabarty Krishnendu Название: Testing of Interposer-Based 2.5d Integrated Circuits ISBN: 3319854615 ISBN-13(EAN): 9783319854618 Издательство: Springer Рейтинг: Цена: 15372.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies.
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