Design and CrossTalk Analysis in Carbon Nanotube Interconnects, Sathyakam P. Uma, Mallick Partha Sharathi

Автор: B.K. Kaushik; V. Ramesh Kumar; Amalendu Patnaik
Название: Crosstalk in Modern On-Chip Interconnects
ISBN: 9811007993 ISBN-13(EAN): 9789811007996
Издательство: Springer
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Цена: 9141.00 р.
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Описание: The book provides accurate FDTDmodels for on-chip interconnects, covering most recent advancements inmaterials and design. It presents thestructure, properties, and characteristics of graphene based on-chipinterconnects and the FDTD modeling of Cu based on-chip interconnects.

Автор: Pinhong Chen; Desmond A. Kirkpatrick; Kurt Keutzer
Название: Static Crosstalk-Noise Analysis
ISBN: 1475779496 ISBN-13(EAN): 9781475779493
Издательство: Springer
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Цена: 13974.00 р.
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Автор: Jean-Pierre Bourguignon; Jean-Claude Carel; Yves C
Название: Brain Crosstalk in Puberty and Adolescence
ISBN: 3319363921 ISBN-13(EAN): 9783319363929
Издательство: Springer
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Цена: 16977.00 р.
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Описание: This volume provides the reader with a pathophysiological perspective on the role of CNS in puberty and adolescence, starting from genetic/molecular aspects, going through structural/imaging changes and leading to physical/behavioral characteristics.

Автор: Khalid Rehman Hakeem; Reiaz Ul Rehman; Inayatullah
Название: Plant signaling: Understanding the molecular crosstalk
ISBN: 8132215419 ISBN-13(EAN): 9788132215417
Издательство: Springer
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Цена: 26122.00 р.
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Описание: ГЇВїВЅ Plant signalling has emerged as an integrated field which has become indispensable in recent times to study any biological process. It is now possible to view the different information`s in a systems biology approach which has unravelled the association/ new processes and thus helped us enormously in understanding of the biological processes.

Автор: Brajesh Kumar Kaushik; Manoj Kumar Majumder
Название: Carbon Nanotube Based VLSI Interconnects
ISBN: 8132220463 ISBN-13(EAN): 9788132220466
Издательство: Springer
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Цена: 8489.00 р.
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Описание: The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects.

Автор: Todri-Sanial Aida, Dijon Jean, Maffucci Antonio
Название: Carbon Nanotubes for Interconnects: Process, Design and Applications
ISBN: 3319806424 ISBN-13(EAN): 9783319806426
Издательство: Springer
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Цена: 13974.00 р.
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Описание: This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects.

Автор: Todri-Sanial
Название: Carbon Nanotubes for Interconnects
ISBN: 3319297449 ISBN-13(EAN): 9783319297446
Издательство: Springer
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Цена: 16070.00 р.
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Описание: This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.

Автор: Yoshimura, Tetsuzo
Название: Self-Organized 3D Integrated Optical Interconnects
ISBN: 9814877042 ISBN-13(EAN): 9789814877046
Издательство: Taylor&Francis
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Цена: 17762.00 р.
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Описание: This book proposes the concept of self-organized 3D integrated optical interconnects and the strategy to reduce optics excess in intra-box optical interconnects. Currently, light waves are ready to come into boxes of computers in high-performance computing systems.

Автор: Chunjie Duan; Brock J. LaMeres
Название: On and Off-Chip Crosstalk Avoidance in VLSI Design
ISBN: 1489983279 ISBN-13(EAN): 9781489983275
Издательство: Springer
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Цена: 18284.00 р.
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Описание: Crosstalk is a major challenge that Deep Submicron processes present to VLSI circuit designers. This book covers crosstalk avoidance with bus encoding, a technique that mitigates crosstalk and improves the speed and power consumption of the bus interconnect.

Автор: Hartmut Grabinski
Название: Interconnects in VLSI Design
ISBN: 1461369541 ISBN-13(EAN): 9781461369547
Издательство: Springer
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Цена: 20962.00 р.
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Описание: This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999.

Автор: Prabhakar Hemanshu, Gupta Nidhi
Название: Brain and Kidney CrossTalk
ISBN: 981152324X ISBN-13(EAN): 9789811523243
Издательство: Springer
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Цена: 20962.00 р.
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Описание: This book discusses normal brain physiology and renal physiology, as well as the interactions between the two. The book addresses the basic aspects of neurophysiology and renal physiology in three broad sections, the first of which covers the basic principles of cerebral physiology and neural regulation of the renal system.

Автор: Brydon Diana, Dvořak Marta
Название: CrossTalk: Canadian and Global Imaginaries in Dialogue
ISBN: 1554583020 ISBN-13(EAN): 9781554583027
Издательство: Gazelle Book Services
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Описание: In negotiating aesthetic and political approaches to Canadian cultural production within contexts of global circulation, this collection argues for the value of attending to narratorial, lyric, and theatrical conventions in dialogue with questions of epistemological and social justice.