Описание: This book provides up-to-date information relevant to analysis and design of adhesively bonded joints made up Fibre Reinforced Polymer (FRP) composites using Functionally Graded Adhesive (FGA). Damage behaviours have been addressed and joint configurations have been modelled using special finite elements including 3D finite element analyses.
Автор: Akhavan-Safar Alireza, Marques Eduardo A. S., Carbas Ricardo J. C. Название: Cohesive Zone Modelling for Fatigue Life Analysis of Adhesive Joints ISBN: 3030931412 ISBN-13(EAN): 9783030931414 Издательство: Springer Рейтинг: Цена: 9083.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book explains the numerical method for fatigue life analysis of adhesive joints using the CZM technique. CZM is a robust approach that is widely used for failure analysis of adhesive joints exposed to various stress conditions including fatigue. In this book, various aspects of the numerical evaluation of adhesive bonds using CZM are discussed. First of all, it is explained how different load and environmental parameters influence the service life of adhesive connections. Various types of CZM shapes and their applications are then discussed. It was answered how different parameters of a CZM should be defined. It is also discussed which CZM form should be used for each condition. The book then describes how the CZM parameters should be degraded to simulate the cyclic loading behavior of bonded structures. Various CZM strategies for the fatigue life assessment of adhesive joints are discussed. The book presents various techniques that can be followed for the simulation of load cycles for both high-cycle and low-cycle fatigue regimes based on the concepts of the CZM. Details of numerical methods to be considered in the FE software for the fatigue life assessment of adhesives with CZM are also described in this book. Finally, some numerical examples using CZM are also provided.
Описание: This book presents an analytical framework for calculating the fracture toughness of generally layered beam structures with an elastically coupled response and hygrothermal stresses. The beam under study features several peculiarities: it consists of multiple layers of dissimilar materials, features bending-extension coupling, and contains residual hygrothermal stresses. Here, a generic analytical model is proposed to compute the energy release rate and the mode mixity. Mechanics of composite materials, crack closure integral, and energetic methods are among the theoretical tools employed for developing the model. A wealth of new closed-form expressions is presented, together with their validation through finite element analyses, which enables investigating various material systems and testing configurations. Experimentalists will find directions for the design and interpretation of delamination tests on laminated composites with uncommon stacking sequences. At the same time, theoreticians can exploit the analytical solution as a benchmark test for more refined analytical and numerical models. Furthermore, the book gives novel insights into the fracture behavior of a titanium-to-CFRP adhesive joint, which is intended for application in the hybrid laminar flow control of a future aircraft. It reports on experiments and theoretical analyses that help understand the behavior of this novel joint. All in all, this book offers extensive updates on methods for fracture analysis of materials with an elastically coupled behavior and residual stresses. It addresses students, researchers, and engineers alike.
Описание: Introduction.- Adhesive bonding.- Non-destructive evaluation.- The physics and implementation of thermography.- Preliminary results.- Numerical modelling.- Kissing defects.- Practical application of PT/PPT.- Industrial applications.- Conclusions and future work.
Автор: Lucas F. M. da Silva; Chiaki Sato Название: Design of Adhesive Joints Under Humid Conditions ISBN: 3642376134 ISBN-13(EAN): 9783642376139 Издательство: Springer Рейтинг: Цена: 16979.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book describes advances and limitations concerning the design of adhesive joints under humid conditions. It presents approaches to predict the failure load after exposure to load, temperature and humidity over a long period of time.
Автор: Liyong Tong; Grant P. Steven Название: Analysis and Design of Structural Bonded Joints ISBN: 0792384946 ISBN-13(EAN): 9780792384946 Издательство: Springer Рейтинг: Цена: 30745.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: While it is easy for everyone to identify examples of adhesive bonding in the world around us, analysis and design of structural bonded joints represent one of the most challenging jobs in structural design and manufacturing.
Описание: This book provides an overview of eco-friendly resins and their composite materials covering their synthesis, sources, structures and properties for different industrial applications to support the ongoing research and development in eco-friendly and renewable commercial products.
Автор: Alam M. O., Bailey C., Bailey Christopher Название: Advanced Adhesives in Electronics: Materials, Properties and Applications ISBN: 0081017324 ISBN-13(EAN): 9780081017326 Издательство: Elsevier Science Рейтинг: Цена: 23580.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties.The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics.With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field.
Автор: Wong, C. P. Li, Yi Lu, Daniel Название: Electrical conductive adhesives with nanotechnologies ISBN: 0387887822 ISBN-13(EAN): 9780387887821 Издательство: Springer Рейтинг: Цена: 22203.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Offers an overview of electronic packaging, and discusses the various adhesives options, including lead-free solder and Electrically Conductive Adhesives. This title discusses how nano techniques can be applied to conductive adhesives, including research and development of nano component adhesives/nano component films.
Автор: Dillard David, Dillard D., Dillard Da Название: Advances in Structural Adhesive Bonding ISBN: 0081014465 ISBN-13(EAN): 9780081014462 Издательство: Elsevier Science Рейтинг: Цена: 31160.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Adhesive bonding is often effective, efficient, and often necessary way to join mechanical structures. This important book reviews the most recent improvements in adhesive bonding and their wide-ranging potential in structural engineering.Part one reviews advances in the most commonly used groups of structural adhesives with chapters covering topics such as epoxy, polyurethane, silicone, cyanoacrylate, and acrylic adhesives. The second set of chapters covers the various types of adherends and pre-treatment methods for a range of structural materials such as metals, composites and plastics. Chapters in Part three analyse methods and techniques with topics on joint design, life prediction, fracture mechanics and testing. The final group of chapters gives useful and practical insights into the problems and solutions of adhesive bonding in a variety of hostile environments such as chemical, wet and extreme temperatures.With its distinguished editor and international team of contributors, Advances in structural adhesive bonding is a standard reference for structural and chemical engineers in industry and the academic sector.
Описание: Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups. The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this book particularly important for engineers and managers alike.The third edition has been updated throughout and includes new sections on nanomaterials, environmental impacts and new environmentally friendly ‘green’ adhesives. Information about regulations and compliance has been brought fully up-to-date.As well as providing full coverage of standard adhesive types, Licari explores the most recent developments in fields such as: Tamper-proof adhesives for electronic security devices. Bio-compatible adhesives for implantable medical devices. Electrically conductive adhesives to replace toxic tin-lead solders in printed circuit assembly – as required by regulatory regimes, e.g. the EU’s Restriction of Hazardous Substances Directive or RoHS (compliance is required for all products placed on the European market). Nano-fillers in adhesives, used to increase the thermal conductivity of current adhesives for cooling electronic devices.
Автор: L.H. Lee Название: Adhesive Bonding ISBN: 1475790082 ISBN-13(EAN): 9781475790085 Издательство: Springer Рейтинг: Цена: 26122.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: For several years, I have been responsible for organizing and teaching in the fall a short course on "Fundamentals of Adhesion: Theory, Practice, and Applications" at the State University of New York at New Paltz.
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