Asme 2020 proceedings of the international technical conference and exhibition on packaging and integration of electronic and photonic microsystems (interpack2020), Shugart, Matthew S (distinguished Professor Emeritus, Distinguished Professor Emeritus, University Of California, Davis) Bergman, Matthew E (post-doct
Описание: This book showcases the state of the art in the field of sensors and microsystems, revealing the impressive potential of novel methodologies and technologies.
Описание: Presents 65 papers from the 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems featuring subjects such as Servers of the Future, Edge, and Cloud Computing, Autonomous, Hybrid and Electric Vehicles, and Power Electronics.
Описание: Explores the exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. Presents 76 papers from the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
Описание: This book will discuss the relationship between Business Intelligence (BI) and Human Resource Management (HRM). It will also discuss how BI can be used as a strategic decision-making tool for the sustainable growth of an organization or business.
Описание: A printed collection of 90 full-length, peer-reviewed technical papers. Topics include Autonomous, Hybrid, and Electric Vehicles; Energy Conversion and Storage; Flexible and Wearable Electronics; Heterogeneous Integration; Photonics and Optics; and Power Electronics.
Автор: Olav Solgaard Название: Photonic Microsystems ISBN: 1441939679 ISBN-13(EAN): 9781441939678 Издательство: Springer Рейтинг: Цена: 18167.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Describes Microelectromechanical systems (MEMS) technology and demonstrates how MEMS allow miniaturization, parallel fabrication, and efficient packaging of optics, as well as integration of optics and electronics. This book shows how the characteristics of MEMS enable practical implementations of a variety of applications.
Описание: This book showcases the state of the art in the field of sensors and microsystems, revealing the impressive potential of novel methodologies and technologies.
Описание: This book showcases the state of the art in the field of sensors and microsystems, revealing the impressive potential of novel methodologies and technologies. It covers a broad range of aspects, including: bio-, physical and chemical sensors, actuators, micro- and nano-structured materials, mechanisms of interaction and signal transduction, polymers and biomaterials, sensor electronics and instrumentation, analytical microsystems, recognition systems and signal analysis and sensor networks as well as manufacturing technologies, environmental, food, energy and biomedical applications. The book gathers a selection of papers presented at the AISEM Regional Workshop on Sensors and Microsystems, held in Portici (Naples), Italy in February 2020.
Описание: Situates the discussion of the Amazon and its inhabitants at the intersections of identity politics, debates about socioeconomic sovereignty, and processes of place making. Editing Eden focuses on case studies from Amazonian Brazil, Colombia, and Ecuador regarding the themes of indigeneity, community making, development politics, and the transcendence of indigenous/nonindigenous divides.
Автор: Wong C. P. (Ching-Ping), Moon Kyoung-Sik (Jack), Li Yi Название: Nano-Bio- Electronic, Photonic and MEMS Packaging ISBN: 3030499936 ISBN-13(EAN): 9783030499938 Издательство: Springer Рейтинг: Цена: 25155.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Part1. Electronics (electrical interconnections and thermal management).- Chapter 1.Nanomaterials for Microelectronics, Biomedical, MEMS, and Energy Devices Packaging.- Chapter 2. Nano-conductive Adhesives for Nano-electronics Interconnection.- Chapter 3. Applications of Carbon Nanomaterials as Electrical Interconnects and Thermal Interface Materials.- Chapter 4. Nanomaterials via Nano Spray Combustion Chemical Vapor Condensation, and Their Electronic Applications.- Chapter 5. Nanolead-Free Solder Pastes for Low Processing Temperature Interconnect Applications in Microelectronic Packaging.- Chapter 6. Introduction to Nanoparticle-Based Integrated Passives.- Chapter 7. Thermally Conductive Nanocomposites.- Chapter 8. Physical Properties and Mechanical Behavior of CarbonNano-tubes (CNTs) and Carbon Nano-fibers (CNFs) as Thermal Interface Materials (TIMs) for High-Power Integrated Circuit (IC)Packages: Review and Extension.- Chapter 9. On-Chip Thermal Management and Hot-Spot Remediation.- Chapter 10. Some Aspects of Microchannel Heat Transfer.- Part II.BioMEMs packaging.- Chapter 11. Nanoprobes for Live-Cell Gene Detection.- Chapter 12. Packaging for Bio-micro-electro-mechanical Systems (BioMEMS) and Microfluidic Chips.- Chapter 13. Packaging of Biomolecular and Chemical Microsensors.- Chapter 14. Nanobiosensing Electronics and Nanochemistry for Biosensor Packaging.- Chapter 15. Biomimetic Lotus Effect Surfaces for Nanopackaging.- Part III. Wearable devices packaging and materials.- Chapter 16. Soft Material-Enabled Packaging for Stretchable and Flexible Hybrid Electronics.- Part IV. Biomedical devices packaging.- Chapter 17. Evolution of Advanced Miniaturization for Active Implantable Medical Devices.- Part V. Optical device packaging.- Chapter 18. An introduction of the phosphor converted white LED packaging and its reliability.- Part VI. Energy harvesting.- Chapter 19. Mechanical Energy Harvesting Using Wurtzite Nanowires.- Chapter 20. 1D Nanowire Electrode Materials for Power Sources of Microelectronics.- Part VII. Energy storage (LIB battery).- Chapter 21. Graphene-based materials with tailored nanostructures for lithium-ion batteries.- Part VIII. Energy storage (supercapacitor).- Chapter 22. Fe-Based Anode Materials for Asymmetric Supercapacitors.- Part XI. Metrology.- Chapter 23. Nanoscale Deformation and Strain Analysis by AFM/DIC Technique.- Part X. Computational.- Chapter 24. Molecular Dynamics Applications in Packaging.- Chapter 25. Nano-Scale and Atomistic-Scale Modeling of Advanced Materials.
Автор: Wong C. P., Moon Kyoung-Sik (Jack), Li Yi Название: Nano-Bio- Electronic, Photonic and Mems Packaging ISBN: 3030499901 ISBN-13(EAN): 9783030499907 Издательство: Springer Цена: 25155.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание:
Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials into the device level. "Nano and Bio Electronics Packaging" discusses how nanofabrication techniques can be used to customize packaging for nano devices with applications to biological and biomedical research and products. Covering such topics as nano bio sensing electronics, bio device packaging, NEMs for Bio Devices and much more.
ООО "Логосфера " Тел:+7(495) 980-12-10 www.logobook.ru
