Advanced Materials for Printed Flexible Electronics, Tong
Автор: Horowitz Название: The Art of Electronics ISBN: 0521809266 ISBN-13(EAN): 9780521809269 Издательство: Cambridge Academ Рейтинг: Цена: 13622.00 р. Наличие на складе: Заказано в издательстве.
Описание: At long last, here is the thoroughly revised and updated, and long-anticipated, third edition of the hugely successful The Art of Electronics. Widely accepted as the best single authoritative text on electronic circuit design, it will be an indispensable reference and the gold standard for anyone in the field.
Автор: Horowitz Paul Название: The art of electronics The x Chapters ISBN: 1108499945 ISBN-13(EAN): 9781108499941 Издательство: Cambridge Academ Рейтинг: Цена: 8870.00 р. Наличие на складе: Заказано в издательстве.
Описание: The x-Chapters is the missing pieces of The Art of Electronics, to be used either as its complement, or as a direct route to exploring some of the most exciting and oft-overlooked topics in advanced electronic engineering. Students, researchers and practitioners will find here techniques and circuits that are unavailable elsewhere.
Автор: Hayes Название: Learning the Art of Electronics ISBN: 0521177235 ISBN-13(EAN): 9780521177238 Издательство: Cambridge Academ Рейтинг: Цена: 17195.00 р. Наличие на складе: Нет в наличии.
Описание: Turn to this book if you want to learn about different types of circuits and their behavior. You will gain a deep and intuitive understanding of circuit operation, be exposed to advanced circuit designs, and learn to build analog and digital devices from first principles using basic components.
Автор: Carl T. F. Ross Название: Strength of Materials and Structures, 4 ed. ISBN: 0340719206 ISBN-13(EAN): 9780340719206 Издательство: Elsevier Science Рейтинг: Цена: 13474.00 р. 16843.00-20% Наличие на складе: Есть (2 шт.) Описание: Introduces modern numerical techniques such as matrix and finite element methods. This work also contains material on composite materials, thick shells, flat plates and the vibrations of complex structures. It is also illustrated with worked examples, and provides numerous problems for students to attempt.
Описание: Most existing robust design books address design for static systems, or achieve robust design from experimental data via the Taguchi method. Little work considers model information for robust design particularly for the dynamic system.
Автор: M. A. Meyers Название: Nano and Microstructural Design of Advanced Materials, ISBN: 0080443737 ISBN-13(EAN): 9780080443737 Издательство: Elsevier Science Рейтинг: Цена: 29476.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Advanced characterization and fabrication methods are enabling scientists to build structures atom-by-atom or molecule-by molecule. This title focuses on the effective use of such advanced analysis and characterization techniques in the design of materials. It contains examples of materials in which such design concepts have been applied.
Автор: Maciej Jaroszewski, Sabu Thomas, Ajay V. Rane Название: Advanced Materials for EMI Shielding ISBN: 1119128617 ISBN-13(EAN): 9781119128618 Издательство: Wiley Рейтинг: Цена: 29613.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: A comprehensive review of the field of materials that shield people and sensitive electronic devices from electromagnetic fields Advanced Materials for Electromagnetic Shielding offers a thorough review of the most recent advances in the processing and characterization of the electromagnetic shielding materials. In this groundbreaking book, the authorsnoted experts in the fielddiscuss the fundamentals of shielding theory as well as the practice of electromagnetic field measuring techniques and systems. They also explore applications of shielding materials used as absorbers of electromagnetic radiation, or as magnetic shields and explore coverage of new advancedmaterials for EMI shielding in aerospace applications. In addition, the text contains methods of preparation and applicability of metal foams. This comprehensive text examines the influence of technology on the micro-and macrostructure of polymers enabling their use in screening technology, technologies of shielding materials based on textiles, and analyses of its effectiveness in screening. The book also details the method of producing nanowires and their applications in EM shielding. This important resource: Explores the burgeoning market of electromagnetic shielding materials as we create, depend upon, and are exposed to more electronic devices than ever Addresses the most comprehensive issues relating to electromagnetic fields Contains information on the manufacturing, characterization methods, and properties of materials used to protect against them Discusses the important characterization techniques compared with one another, thus allowing scientists to select the best approach to a problem Written for materials scientists, electrical and electronics engineers, physicists, and industrial researchers, Advanced Materials for Electromagnetic Shielding explores all aspects in the area of electromagnetic shielding materials and examines the current state-of-the-art and new challenges in this rapidly growing area.
Автор: Zhang, Hengyun Название: Modeling, Analysis and Design for Advanced Electronics Packaging ISBN: 0081025327 ISBN-13(EAN): 9780081025321 Издательство: Elsevier Science Рейтинг: Цена: 31160.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and test for 2.5D/3D and interconnects to the system integration and testing. The book addresses important topics including electrically and thermally induced issues such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. Not only are the basic principles in electrical, thermal and mechanical areas presented in detail, but also practical design and test techniques for packages and systems such as 2.5D/3D packages. On-package thermal and mechanical management systems are involved and discussed.
Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging
Features experimental characterization and qualifications for analysis and verification of electronic packaging design
Provides multiphysics modeling and analysis techniques of electronic packaging
Self-healing materials are an emerging class of smart materials that are capable of repairing themselves from damage, either spontaneously or under a stimulus such as light, heat, or the application of a solvent. Intended for an audience of researchers in academia and industry, this book addresses a wide range of self-healing materials and processes, with emphasis on their performance in the space environment.
This revised, expanded and updated second edition addresses the key concepts of self-healing processes, from their occurrences in nature through to recent advances in academic and industrial research. It includes a detailed description and explanation of a wide range of materials and applications such as polymeric, anticorrosion, smart paints, and carbon nanotubes. Emphasis is given to performance in the space environment, addressing vacuum, thermal gradients, mechanical vibrations, and space radiation. Innovations in controlling self-healing materials for space debris mitigation are also covered. The book concludes with a comprehensive outlook into the future developments and applications of self-healing materials.
Автор: William S. Wong; Alberto Salleo Название: Flexible Electronics ISBN: 144194494X ISBN-13(EAN): 9781441944948 Издательство: Springer Рейтинг: Цена: 20896.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Covers a range of materials used for flexible electronics, including semiconductors, dielectrics, and metals. This title includes fundamental issues for both organic and inorganic materials systems. It presents a corresponding overview of technological applications, based on each materials system.
Автор: Alam M. O., Bailey C., Bailey Christopher Название: Advanced Adhesives in Electronics: Materials, Properties and Applications ISBN: 0081017324 ISBN-13(EAN): 9780081017326 Издательство: Elsevier Science Рейтинг: Цена: 23580.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties.The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics.With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field.
Описание: Organic flexible electronics represent a highly promising technology that will provide increased functionality and the potential to meet future challenges of scalability, flexibility, low power consumption, light weight, and reduced cost. They will find new applications because they can be used with curved surfaces and incorporated in to a number of products that could not support traditional electronics. The book covers device physics, processing and manufacturing technologies, circuits and packaging, metrology and diagnostic tools, architectures, and systems engineering. Part one covers the production, properties and characterisation of flexible organic materials and part two looks at applications for flexible organic devices.
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