This book covers various aspects of optimization in design and testing of Network-on-Chip (NoC) based multicore systems. It gives a complete account of the state-of-the-art and emerging techniques for near optimal mapping and test scheduling for NoC-based multicores. The authors describe the use of the Integer Line Programming (ILP) technique for smaller benchmarks and a Particle Swarm Optimization (PSO) to get a near optimal mapping and test schedule for bigger benchmarks. The PSO-based approach is also augmented with several innovative techniques to get the best possible solution. The tradeoff between performance (communication or test time) of the system and thermal-safety is also discussed, based on designer specifications.
Provides a single-source reference to design and test for circuit and system-level approaches to (NoC) based multicore systems;
Gives a complete account of the state-of-the-art and emerging techniques for near optimal mapping and test scheduling in (NoC) based multicore systems;
Organizes chapters systematically and hierarchically, rather than in an ad hoc manner, covering aspects of optimization in design and testing of Network-on-Chip (NoC) based multicore systems.
Автор: Jari Nurmi; H. Tenhunen; J. Isoaho; Axel Jantsch Название: Interconnect-Centric Design for Advanced SOC and NOC ISBN: 1441954422 ISBN-13(EAN): 9781441954428 Издательство: Springer Рейтинг: Цена: 26120.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: In Interconnect-centric Design for Advanced SoC and NoC, we have tried to create a comprehensive understanding about on-chip interconnect characteristics, design methodologies, layered views on different abstraction levels and finally about applying the interconnect-centric design in system-on-chip design.
Introduction to Network-on-Chip Designs and Tests.- Iterative Mapping with Through Silicon Via (TSV) placement for 3D-NoC-based multicore systems.- A constructive Heuristic for integrated mapping and TSV Placement for 3D-NoC-based multicore systems.- Discrete Particle Swarm Optimization for integrated mapping and TSV Placement for 3D-NoC-based multicore systems.- Temperature-aware application mapping strategy for 2D-NoC-based multicore systems.- Temperature-aware design strategy for 3D-NoC-based multicore systems.- Temperature-aware test strategy for 2D as well as 3D-NoC-based multicore systems.
Автор: Feng Zhao; Fa Foster Dai Название: Low-Noise Low-Power Design for Phase-Locked Loops ISBN: 3319121995 ISBN-13(EAN): 9783319121994 Издательство: Springer Рейтинг: Цена: 15672.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book introduces low-noise and low-power design techniques for phase-locked loops and their building blocks. The capacitive-coupling technique has been validated through silicon implementation and can provide low phase-noise and accurate I-Q phase matching, with low power consumption from a super low supply voltage.
Описание: This overview of the circuits, architectures, and chip packaging for coupled data techniques discusses current research in chip-to-board capacitive coupling, chip-to-chip capacitive coupling, chip-to-chip inductive coupling, and chip-to-chip optical coupling.
Автор: Feng Zhao; Fa Foster Dai Название: Low-Noise Low-Power Design for Phase-Locked Loops ISBN: 331934370X ISBN-13(EAN): 9783319343709 Издательство: Springer Рейтинг: Цена: 13059.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book introduces low-noise and low-power design techniques for phase-locked loops and their building blocks. The capacitive-coupling technique has been validated through silicon implementation and can provide low phase-noise and accurate I-Q phase matching, with low power consumption from a super low supply voltage.
Описание: This book describes a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It provides full details of all key algorithms, for maximum understanding and utility.
Описание: This overview of the circuits, architectures, and chip packaging for coupled data techniques discusses current research in chip-to-board capacitive coupling, chip-to-chip capacitive coupling, chip-to-chip inductive coupling, and chip-to-chip optical coupling.
Part I. Next-Generation ADCs.- Chapter 1. Emerging ADCs.- Chapter 2. Noise-Shaping SAR ADCs.- Chapter 3. Efficient High-Resolution Nyquist ADCs.- Chapter 4. Continous-Time ADCs for Automative Applications.- Chapter 5. Continuous-Time Delta-Sigma Converters With Finite-Impulse-Response (FIR) Feedback.- Chapter 6. High-speed ADCs for Wireless Base-Stations.- Part II. High-Performance Power Management.- Chapter 7. Advanced Multiphasing: Pushing the Limits of Fully Integrated Switched-Capacitor Converters.- Chapter 8. Highly-Efficient Power Management in Wearables and IoT Devices.- Chapter 9. Current Sensing Techniques: Principles and Readouts.- Chapter 10. Wide Bandgap Integrated Circuits for High Power Management in Extreme Environments.- Chapter 11. On the Limits of Driving Wide-Bandgap Transistors.- Chapter 12. Challenges in Driving New Generations of Power Switches for Motor Drive: A dV/dt Self-Adjusting Architecture for Superjunction Power Devices.- Part III. Technology Considerations for Advanced IC.- Chapter 13. Silicon Technologies for the Next Age of Wireless Connectivity.- Chapter 14. IC Technologies for mm-Wave Applications.- Chapter 15. Accuracy: The Next Opportunity for MEMS.- Chapter 16. Robustness, Reliability and Diagnostic Aspects in Sensors for Automotive Applications: The Magnetic Sensors Case.- Chapter 17. Rad-Hard Mixed-Signal IC Design, Theory and Implementation.- Chapter 18.1-GRad-TID Effects in 28-nm Device Study for Rad-Hard Analog Design.
Описание: This book is based on the 18 tutorials presented during the 28th workshop on Advances in Analog Circuit Design. Expert designers present readers with information about a variety of topics at the frontier of analog circuit design, including next-generation analog-to-digital converters , high-performance power management systems and technology considerations for advanced IC design. For anyone involved in analog circuit research and development, this book will be a valuable summary of the state-of-the-art in these areas.Provides a summary of the state-of-the-art in analog circuit design, written by experts from industry and academia;Presents material in a tutorial-based format;Includes coverage of next-generation analog-to-digital converters, high-performance power management systems, and technology considerations for advanced IC design.
Автор: Michiel Steyaert; Arthur H.M. van Roermund; Herman Название: Analog Circuit Design ISBN: 9048180325 ISBN-13(EAN): 9789048180325 Издательство: Springer Рейтинг: Цена: 23508.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book is the seventeenth in the successful series of Analog Circuit Design. It contains eighteen tutorials, each of which covers a specific topic on new and valuable design ideas in the field.
Автор: Michiel Steyaert; Arthur H.M. van Roermund; Herman Название: Analog Circuit Design ISBN: 1402089430 ISBN-13(EAN): 9781402089435 Издательство: Springer Рейтинг: Цена: 26122.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Contains the contribution of 18 tutorials of the 17th workshop on Advances in Analog Circuit Design where each part discusses a specific topic on design ideas in the area of analog circuit design.
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