Interconnect-Centric Design for Advanced SOC and NOC, Jari Nurmi; H. Tenhunen; J. Isoaho; Axel Jantsch
Автор: Sandeep Saini Название: Low Power Interconnect Design ISBN: 1461413222 ISBN-13(EAN): 9781461413226 Издательство: Springer Рейтинг: Цена: 15372.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: As well as offering practical solutions for delay and power reduction for on-chip interconnects and buses, this book provides in-depth descriptions of the problem of signal delay and extra power consumption and possible solutions for delays and glitches.
Описание: An understanding of high speed interconnect phenomena is necessary for modern designs such as routing and layout of computer motherboards. Computers have reached speeds where digital design must provide for these effects. The problem is that most engineers active today have not been trained in this subject.
Описание: Realizing maximum performance from high bit-rate and RF circuits requires close attention to IC technology, circuit-to-circuit interconnections (i.e., the `interconnect`) and circuit design. Many practical circuit examples are included to demonstrate the interplay between technology, interconnect and circuit design.
Автор: Jeffrey A. Davis; James D. Meindl Название: Interconnect Technology and Design for Gigascale Integration ISBN: 1461350883 ISBN-13(EAN): 9781461350880 Издательство: Springer Рейтинг: Цена: 20962.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book is jointly authored by leading academic and industry researchers. The material is unique in that it spans IC interconnect topics ranging from IBM`s revolutionary copper process to an in-depth exploration into interconnect-aware computer architectures.
Автор: Sam Fuller Название: RapidIO: The Embedded System Interconnect ISBN: 0470092912 ISBN-13(EAN): 9780470092910 Издательство: Wiley Рейтинг: Цена: 18366.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Aims to bring together one useful volume on RapidIO interconnect technology, providing a reference work for the evaluation and understanding of RapidIO. Covering useful aspects of the specification, this title also answers most usage questions from both hardware and software engineers.
Автор: Tapan Gupta Название: Copper Interconnect Technology ISBN: 1489985115 ISBN-13(EAN): 9781489985118 Издательство: Springer Рейтинг: Цена: 22201.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of Cu-interconnect technology.
Автор: Tae-Kyu Lee; Thomas R. Bieler; Choong-Un Kim; Hong Название: Fundamentals of Lead-Free Solder Interconnect Technology ISBN: 1461492653 ISBN-13(EAN): 9781461492658 Издательство: Springer Рейтинг: Цена: 18284.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys.
Автор: Konstantin Moiseev; Avinoam Kolodny; Shmuel Wimer Название: Multi-Net Optimization of VLSI Interconnect ISBN: 149394262X ISBN-13(EAN): 9781493942626 Издательство: Springer Рейтинг: Цена: 13059.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book examines design and migration methodologies for optimizing multi-net wire structures in advanced VLSI interconnects, covering scaling-dependent models for interconnect power, interconnect delay and crosstalk noise, plus design optimization problems.
Автор: Ian O`Connor; Gabriela Nicolescu Название: Integrated Optical Interconnect Architectures for Embedded Systems ISBN: 1489992049 ISBN-13(EAN): 9781489992048 Издательство: Springer Рейтинг: Цена: 16977.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book highlights current research in optical interconnect technologies and architectures. Particular emphasis is given to the ways photonic components are assembled into architectures to address the needs of data-intensive on-chip communication.
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