Integrated Optical Interconnect Architectures for Embedded Systems, Ian O`Connor; Gabriela Nicolescu

Автор: Sam Fuller
Название: RapidIO: The Embedded System Interconnect
ISBN: 0470092912 ISBN-13(EAN): 9780470092910
Издательство: Wiley
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Цена: 18366.00 р.
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Описание: Aims to bring together one useful volume on RapidIO interconnect technology, providing a reference work for the evaluation and understanding of RapidIO. Covering useful aspects of the specification, this title also answers most usage questions from both hardware and software engineers.

Автор: Konstantin Moiseev; Avinoam Kolodny; Shmuel Wimer
Название: Multi-Net Optimization of VLSI Interconnect
ISBN: 149394262X ISBN-13(EAN): 9781493942626
Издательство: Springer
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Цена: 13059.00 р.
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Описание: This book examines design and migration methodologies for optimizing multi-net wire structures in advanced VLSI interconnects, covering scaling-dependent models for interconnect power, interconnect delay and crosstalk noise, plus design optimization problems.

Автор: Tapan Gupta
Название: Copper Interconnect Technology
ISBN: 1489985115 ISBN-13(EAN): 9781489985118
Издательство: Springer
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Цена: 22201.00 р.
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Описание: In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of Cu-interconnect technology.

Автор: Andreas Hansson; Kees Goossens
Название: On-Chip Interconnect with aelite
ISBN: 1461427118 ISBN-13(EAN): 9781461427117
Издательство: Springer
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Цена: 18284.00 р.
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Описание: This book provides a comprehensive description and implementation methodology for the Philips/NXP Aethereal/aelite Network-on-Chip. It uses real-world illustrations in the form of case studies and examples that communicate the power of the methods presented.

Автор: Stephen H. Hall
Название: High-Speed Digital System Design: A Handbook of Interconnect Theory and Design Practices
ISBN: 0471360902 ISBN-13(EAN): 9780471360902
Издательство: Wiley
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Цена: 22010.00 р.
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Описание: An understanding of high speed interconnect phenomena is necessary for modern designs such as routing and layout of computer motherboards. Computers have reached speeds where digital design must provide for these effects. The problem is that most engineers active today have not been trained in this subject.

Автор: Mustafa Celik; Larry Pileggi; Altan Odabasioglu
Название: IC Interconnect Analysis
ISBN: 1475776748 ISBN-13(EAN): 9781475776744
Издательство: Springer
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Цена: 19564.00 р.
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Описание: As integrated circuit (IC) feature sizes scaled below a quarter of a micron, thereby defining the deep submicron (DSM) era, there began a gradual shift in the impact on performance due to the metal interconnections among the active circuit components.

Автор: Sandeep Saini
Название: Low Power Interconnect Design
ISBN: 1461413222 ISBN-13(EAN): 9781461413226
Издательство: Springer
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Цена: 15372.00 р.
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Описание: As well as offering practical solutions for delay and power reduction for on-chip interconnects and buses, this book provides in-depth descriptions of the problem of signal delay and extra power consumption and possible solutions for delays and glitches.

Автор: John Bainbridge
Название: Asynchronous System-on-Chip Interconnect
ISBN: 1447111125 ISBN-13(EAN): 9781447111122
Издательство: Springer
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Цена: 12157.00 р.
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Описание: In this book, John Bainbridge investigates the design of an asynchronous on-chip interconnect, looking at all the stages of the design from the choice of wiring layout, through asynchronous signalling protocols to the higher level problems involved in supporting split transactions.

Автор: Jie Cheng
Название: Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
ISBN: 9811061645 ISBN-13(EAN): 9789811061646
Издательство: Springer
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Цена: 18167.00 р.
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Описание: This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material.

Автор: Hugo Veenstra; John R. Long
Название: Circuit and Interconnect Design for RF and High Bit-rate Applications
ISBN: 9048177502 ISBN-13(EAN): 9789048177509
Издательство: Springer
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Цена: 19589.00 р.
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Описание: Realizing maximum performance from high bit-rate and RF circuits requires close attention to IC technology, circuit-to-circuit interconnections (i.e., the `interconnect`) and circuit design. Many practical circuit examples are included to demonstrate the interplay between technology, interconnect and circuit design.