Описание: An understanding of high speed interconnect phenomena is necessary for modern designs such as routing and layout of computer motherboards. Computers have reached speeds where digital design must provide for these effects. The problem is that most engineers active today have not been trained in this subject.
Автор: Tae-Kyu Lee; Thomas R. Bieler; Choong-Un Kim; Hong Название: Fundamentals of Lead-Free Solder Interconnect Technology ISBN: 1461492653 ISBN-13(EAN): 9781461492658 Издательство: Springer Рейтинг: Цена: 18284.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys.
Автор: Tapan Gupta Название: Copper Interconnect Technology ISBN: 1489985115 ISBN-13(EAN): 9781489985118 Издательство: Springer Рейтинг: Цена: 22201.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of Cu-interconnect technology.
Автор: Sandeep Saini Название: Low Power Interconnect Design ISBN: 1461413222 ISBN-13(EAN): 9781461413226 Издательство: Springer Рейтинг: Цена: 15372.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: As well as offering practical solutions for delay and power reduction for on-chip interconnects and buses, this book provides in-depth descriptions of the problem of signal delay and extra power consumption and possible solutions for delays and glitches.
Описание: Realizing maximum performance from high bit-rate and RF circuits requires close attention to IC technology, circuit-to-circuit interconnections (i.e., the `interconnect`) and circuit design. Many practical circuit examples are included to demonstrate the interplay between technology, interconnect and circuit design.
Автор: Jari Nurmi; H. Tenhunen; J. Isoaho; Axel Jantsch Название: Interconnect-Centric Design for Advanced SOC and NOC ISBN: 1441954422 ISBN-13(EAN): 9781441954428 Издательство: Springer Рейтинг: Цена: 26120.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: In Interconnect-centric Design for Advanced SoC and NoC, we have tried to create a comprehensive understanding about on-chip interconnect characteristics, design methodologies, layered views on different abstraction levels and finally about applying the interconnect-centric design in system-on-chip design.
Автор: Konstantin Moiseev; Avinoam Kolodny; Shmuel Wimer Название: Multi-Net Optimization of VLSI Interconnect ISBN: 1461408202 ISBN-13(EAN): 9781461408208 Издательство: Springer Рейтинг: Цена: 15372.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Автор: John Bainbridge Название: Asynchronous System-on-Chip Interconnect ISBN: 1447111125 ISBN-13(EAN): 9781447111122 Издательство: Springer Рейтинг: Цена: 12157.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: In this book, John Bainbridge investigates the design of an asynchronous on-chip interconnect, looking at all the stages of the design from the choice of wiring layout, through asynchronous signalling protocols to the higher level problems involved in supporting split transactions.
Автор: Mustafa Celik; Larry Pileggi; Altan Odabasioglu Название: IC Interconnect Analysis ISBN: 1475776748 ISBN-13(EAN): 9781475776744 Издательство: Springer Рейтинг: Цена: 19564.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: As integrated circuit (IC) feature sizes scaled below a quarter of a micron, thereby defining the deep submicron (DSM) era, there began a gradual shift in the impact on performance due to the metal interconnections among the active circuit components.
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