Introduction to Layout Design and Automation of Photonic Integrated Circuits, Farsaei
Автор: Mikael Sahrling Название: Layout Techniques for Integrated Circuit Designers ISBN: 1630819107 ISBN-13(EAN): 9781630819101 Издательство: Artech House Рейтинг: Цена: 17371.00 р. Наличие на складе: Нет в наличии.
Описание: This book provides complete step-by-step guidance on the physical implementation of modern integrated circuits, showing you their limitations and guiding you through their common remedies. The book describes today`s manufacturing techniques and how they impact design rules. You will understand how to build common high frequency devices such as inductors, capacitors and T-coils, and will also learn strategies for dealing with high-speed routing both on package level and on-chip applications. Numerous algorithms implemented in Python are provided to guide you through how extraction, netlist comparison and design rule checkers can be built. The book also helps you unravel complexities that effect circuit design, including signal integrity, matching, IR drop, parasitic impedance and more, saving you time in addressing these effects directly. You will also find detailed descriptions of software tools used to analyze a layout database, showing you how devices can be recognized and connectivity accurately assessed. The book removes much of fog that often hides the inner workings of layout related software tools and helps you better understand: the physics of advanced nodes, high speed techniques used in modern integrated technologies, and the inner working of software used to analyze layout databases. This is an excellent resource for circuit designers implementing a schematic in a layout database, especially those involved in deep submicron designs, as well as layout designers wishing to deepen their understanding of modern layout rules.
Название: Integrated Microsystems ISBN: 1138076228 ISBN-13(EAN): 9781138076228 Издательство: Taylor&Francis Рейтинг: Цена: 15312.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание:
As rapid technological developments occur in electronics, photonics, mechanics, chemistry, and biology, the demand for portable, lightweight integrated microsystems is relentless. These devices are getting exponentially smaller, increasingly used in everything from video games, hearing aids, and pacemakers to more intricate biomedical engineering and military applications.
Edited by Kris Iniewski, a revolutionary in the field of advanced semiconductor materials, Integrated Microsystems: Electronics, Photonics, and Biotechnology focuses on techniques for optimized design and fabrication of these intelligent miniaturized devices and systems. Composed of contributions from experts in academia and industry around the world, this reference covers processes compatible with CMOS integrated circuits, which combine computation, communications, sensing, and actuation capabilities.
Light on math and physics, with a greater emphasis on microsystem design and configuration and electrical engineering, this book is organized in three sections--Microelectronics and Biosystems, Photonics and Imaging, and Biotechnology and MEMs. It addresses key topics, including physical and chemical sensing, imaging, smart actuation, and data fusion and management. Using tables, figures, and equations to help illustrate concepts, contributors examine and explain the potential of emerging applications for areas including biology, nanotechnology, micro-electromechanical systems (MEMS), microfluidics, and photonics.
Автор: Iniewski, Krzysztof Название: Integrated Microsystems ISBN: 1439836205 ISBN-13(EAN): 9781439836200 Издательство: Taylor&Francis Рейтинг: Цена: 38280.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Автор: Olav Solgaard Название: Photonic Microsystems ISBN: 1441939679 ISBN-13(EAN): 9781441939678 Издательство: Springer Рейтинг: Цена: 18167.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Describes Microelectromechanical systems (MEMS) technology and demonstrates how MEMS allow miniaturization, parallel fabrication, and efficient packaging of optics, as well as integration of optics and electronics. This book shows how the characteristics of MEMS enable practical implementations of a variety of applications.
Автор: Ulrich H. P. Fischer-Hirchert Название: Photonic Packaging Sourcebook ISBN: 3662521350 ISBN-13(EAN): 9783662521359 Издательство: Springer Рейтинг: Цена: 15672.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Guiding readers all the way from basic calculations to optimizing fiber-chip coupling efficiency, this volume reflects the diversity of the field of packaging photonic devices and is the first and only comprehensive sourcebook on photonic assembly techniques.
Автор: Wong C. P., Moon Kyoung-Sik (Jack), Li Yi Название: Nano-Bio- Electronic, Photonic and Mems Packaging ISBN: 3030499901 ISBN-13(EAN): 9783030499907 Издательство: Springer Цена: 25155.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание:
Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials into the device level. "Nano and Bio Electronics Packaging" discusses how nanofabrication techniques can be used to customize packaging for nano devices with applications to biological and biomedical research and products. Covering such topics as nano bio sensing electronics, bio device packaging, NEMs for Bio Devices and much more.
Автор: Wong C. P. (Ching-Ping), Moon Kyoung-Sik (Jack), Li Yi Название: Nano-Bio- Electronic, Photonic and MEMS Packaging ISBN: 3030499936 ISBN-13(EAN): 9783030499938 Издательство: Springer Рейтинг: Цена: 25155.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Part1. Electronics (electrical interconnections and thermal management).- Chapter 1.Nanomaterials for Microelectronics, Biomedical, MEMS, and Energy Devices Packaging.- Chapter 2. Nano-conductive Adhesives for Nano-electronics Interconnection.- Chapter 3. Applications of Carbon Nanomaterials as Electrical Interconnects and Thermal Interface Materials.- Chapter 4. Nanomaterials via Nano Spray Combustion Chemical Vapor Condensation, and Their Electronic Applications.- Chapter 5. Nanolead-Free Solder Pastes for Low Processing Temperature Interconnect Applications in Microelectronic Packaging.- Chapter 6. Introduction to Nanoparticle-Based Integrated Passives.- Chapter 7. Thermally Conductive Nanocomposites.- Chapter 8. Physical Properties and Mechanical Behavior of CarbonNano-tubes (CNTs) and Carbon Nano-fibers (CNFs) as Thermal Interface Materials (TIMs) for High-Power Integrated Circuit (IC)Packages: Review and Extension.- Chapter 9. On-Chip Thermal Management and Hot-Spot Remediation.- Chapter 10. Some Aspects of Microchannel Heat Transfer.- Part II.BioMEMs packaging.- Chapter 11. Nanoprobes for Live-Cell Gene Detection.- Chapter 12. Packaging for Bio-micro-electro-mechanical Systems (BioMEMS) and Microfluidic Chips.- Chapter 13. Packaging of Biomolecular and Chemical Microsensors.- Chapter 14. Nanobiosensing Electronics and Nanochemistry for Biosensor Packaging.- Chapter 15. Biomimetic Lotus Effect Surfaces for Nanopackaging.- Part III. Wearable devices packaging and materials.- Chapter 16. Soft Material-Enabled Packaging for Stretchable and Flexible Hybrid Electronics.- Part IV. Biomedical devices packaging.- Chapter 17. Evolution of Advanced Miniaturization for Active Implantable Medical Devices.- Part V. Optical device packaging.- Chapter 18. An introduction of the phosphor converted white LED packaging and its reliability.- Part VI. Energy harvesting.- Chapter 19. Mechanical Energy Harvesting Using Wurtzite Nanowires.- Chapter 20. 1D Nanowire Electrode Materials for Power Sources of Microelectronics.- Part VII. Energy storage (LIB battery).- Chapter 21. Graphene-based materials with tailored nanostructures for lithium-ion batteries.- Part VIII. Energy storage (supercapacitor).- Chapter 22. Fe-Based Anode Materials for Asymmetric Supercapacitors.- Part XI. Metrology.- Chapter 23. Nanoscale Deformation and Strain Analysis by AFM/DIC Technique.- Part X. Computational.- Chapter 24. Molecular Dynamics Applications in Packaging.- Chapter 25. Nano-Scale and Atomistic-Scale Modeling of Advanced Materials.
Описание: This book covers the advanced fabrication techniques, challenges, and applications of photonic crystals for next-generation systems in various applications such as high-speed networks, photonic integrated circuits, health care, sensors, energy, and environmental. This book highlights the literature and works put forward by various scientists, researchers, and academicians in photonic crystals and their real-time applications. The content of the book appeals to readers such as students, researchers, and industrial engineers who are working in the design and development of photonics-based concepts, components, and devices for various applications.
Автор: John M. Cohn; David J. Garrod; Rob A. Rutenbar; Ri Название: Analog Device-Level Layout Automation ISBN: 1461361893 ISBN-13(EAN): 9781461361893 Издательство: Springer Рейтинг: Цена: 20962.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book presents a detailed summary of research on automatic layout of device-level analog circuits that was undertaken in the late 1980s and early 1990s at Carnegie Mellon University.
Автор: Lienig Jens, Scheible Juergen Название: Fundamentals of Layout Design for Electronic Circuits ISBN: 303039283X ISBN-13(EAN): 9783030392833 Издательство: Springer Рейтинг: Цена: 11878.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book covers the fundamental knowledge of layout design from the ground up, addressing both physical design, as generally applied to digital circuits, and analog layout.
Автор: Karl J. Ebeling Название: Integrated Optoelectronics ISBN: 3642781683 ISBN-13(EAN): 9783642781681 Издательство: Springer Рейтинг: Цена: 14673.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The English edition is based upon the second edition of the German version of the book. These optical communi- cations engineering devices are becoming increasingly important for optical disk storage systems, for optical chip-chip interconnections and of course for optical fiber transmission and exchange.
Название: X-Ray Diffraction Imaging ISBN: 1498783619 ISBN-13(EAN): 9781498783613 Издательство: Taylor&Francis Рейтинг: Цена: 23734.00 р. Наличие на складе: Поставка под заказ.
Описание: Coherent scattering mechanism forms a basis of the x-ray diffraction imaging that is a subject of this book. The x-ray diffraction technology and its various applications in medical, industrial and security fields are also covered.
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