Perspectives for Parallel Optical Interconnects, Philippe Lalanne; Pierre Chavel
Автор: Philip Moser Название: Energy-Efficient VCSELs for Optical Interconnects ISBN: 331924065X ISBN-13(EAN): 9783319240657 Издательство: Springer Рейтинг: Цена: 16769.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This dissertation provides the first systematic analysis of the dynamic energy efficiency of vertical-cavity surface-emitting lasers (VCSELs) for optical interconnects, a key technology to address the pressing ecological and economic issues of the exponentially growing energy consumption in data centers.
Автор: Sandeep Saini Название: Low Power Interconnect Design ISBN: 1461413222 ISBN-13(EAN): 9781461413226 Издательство: Springer Рейтинг: Цена: 15372.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: As well as offering practical solutions for delay and power reduction for on-chip interconnects and buses, this book provides in-depth descriptions of the problem of signal delay and extra power consumption and possible solutions for delays and glitches.
Автор: Christoforos Kachris; Keren Bergman; Ioannis Tomko Название: Optical Interconnects for Future Data Center Networks ISBN: 1493943758 ISBN-13(EAN): 9781493943753 Издательство: Springer Рейтинг: Цена: 15672.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This volume shows how optical interconnects can be used to provide high-bandwidth, energy-efficient interconnects for data centers of the future characterized by increased bandwidth requirements, presenting the latest and most promising technologies.
Автор: Tekin, Tolga Название: Optical Interconnects for Data Centers ISBN: 0081005121 ISBN-13(EAN): 9780081005125 Издательство: Elsevier Science Рейтинг: Цена: 31686.00 р. Наличие на складе: Поставка под заказ.
Описание: Current data centre networks, based on electronic packet switches, are experiencing an exponential increase in network traffic due to developments such as cloud computing. Optical interconnects have emerged as a promising alternative offering high throughput and reduced power consumption. Optical Interconnects for Data Centers reviews key developments in the use of optical interconnects in data centres and the current state of the art in transforming this technology into a reality. The book discusses developments in optical materials and components (such as single and multi-mode waveguides), circuit boards and ways the technology can be deployed in data centres. . Optical Interconnects for Data Centers is a key reference text for electronics designers, optical engineers, communications engineers and R&D managers working in the communications and electronics industries as well as postgraduate researchers.
Автор: Alex Mutig Название: High Speed VCSELs for Optical Interconnects ISBN: 3642266797 ISBN-13(EAN): 9783642266799 Издательство: Springer Рейтинг: Цена: 13974.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Systematically surveying the state of the art in vertical cavity surface emitting lasers, this thesis examines their present limitations as well as offering a catalogue of solutions through modeling, fabricating and testing at commercially crucial wavelengths.
Автор: Todri-Sanial Название: Carbon Nanotubes for Interconnects ISBN: 3319297449 ISBN-13(EAN): 9783319297446 Издательство: Springer Рейтинг: Цена: 16070.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.
Автор: Hartmut Grabinski; Petra Nordholz Название: Signal Propagation on Interconnects ISBN: 0792382757 ISBN-13(EAN): 9780792382751 Издательство: Springer Рейтинг: Цена: 19591.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Comprises a selection of representative contributions to the 1st IEEE Workshop on Signal Propagation on Interconnects that was held at Travemunde, Germany, in 1997. This book contains chapters which cover an area of research results dealing with simulation and measurement of noise and radiated emissions on boards, describing ground bounce effects.
Автор: Konstantin Moiseev; Avinoam Kolodny; Shmuel Wimer Название: Multi-Net Optimization of VLSI Interconnect ISBN: 149394262X ISBN-13(EAN): 9781493942626 Издательство: Springer Рейтинг: Цена: 13059.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book examines design and migration methodologies for optimizing multi-net wire structures in advanced VLSI interconnects, covering scaling-dependent models for interconnect power, interconnect delay and crosstalk noise, plus design optimization problems.
Описание: An understanding of high speed interconnect phenomena is necessary for modern designs such as routing and layout of computer motherboards. Computers have reached speeds where digital design must provide for these effects. The problem is that most engineers active today have not been trained in this subject.
Автор: Michel Dubois; Shreekant S. Thakkar Название: Cache and Interconnect Architectures in Multiprocessors ISBN: 0792390741 ISBN-13(EAN): 9780792390749 Издательство: Springer Рейтинг: Цена: 20956.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Cache And Interconnect Architectures In Multiprocessors Eilat, Israel May 25-261989 Michel Dubois UniversityofSouthernCalifornia Shreekant S. Thakkar SequentComputerSystems The aim of the workshop was to bring together researchers working on cache coherence protocols for shared-memory multiprocessors with various interconnect architectures. Shared-memory multiprocessors have become viable systems for many applications. Bus- based shared-memory systems (Eg. Sequent's Symmetry, Encore's Multimax) are currently limited to 32 processors. The fIrst goal of the workshop was to learn about the performance ofapplications on current cache-based systems. The second goal was to learn about new network architectures and protocols for future scalable systems. These protocols and interconnects would allow shared-memory architectures to scale beyond current imitations. The workshop had 20 speakers who talked about their current research. The discussions were lively and cordial enough to keep the participants away from the wonderful sand and sun for two days. The participants got to know each other well and were able to share their thoughts in an informal manner. The workshop was organized into several sessions. The summary of each session is described below. This book presents revisions of some of the papers presented at the workshop.
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