High Speed VCSELs for Optical Interconnects, Alex Mutig

Автор: Philip Moser
Название: Energy-Efficient VCSELs for Optical Interconnects
ISBN: 331924065X ISBN-13(EAN): 9783319240657
Издательство: Springer
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Цена: 16769.00 р.
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Описание: This dissertation provides the first systematic analysis of the dynamic energy efficiency of vertical-cavity surface-emitting lasers (VCSELs) for optical interconnects, a key technology to address the pressing ecological and economic issues of the exponentially growing energy consumption in data centers.

Автор: Tekin, Tolga
Название: Optical Interconnects for Data Centers
ISBN: 0081005121 ISBN-13(EAN): 9780081005125
Издательство: Elsevier Science
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Цена: 31686.00 р.
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Описание: Current data centre networks, based on electronic packet switches, are experiencing an exponential increase in network traffic due to developments such as cloud computing. Optical interconnects have emerged as a promising alternative offering high throughput and reduced power consumption. Optical Interconnects for Data Centers reviews key developments in the use of optical interconnects in data centres and the current state of the art in transforming this technology into a reality. The book discusses developments in optical materials and components (such as single and multi-mode waveguides), circuit boards and ways the technology can be deployed in data centres. . Optical Interconnects for Data Centers is a key reference text for electronics designers, optical engineers, communications engineers and R&D managers working in the communications and electronics industries as well as postgraduate researchers.

Автор: Michel S. Nakhla; Q.J. Zhang
Название: Modeling and Simulation of High Speed VLSI Interconnects
ISBN: 0792394410 ISBN-13(EAN): 9780792394419
Издательство: Springer
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Цена: 18167.00 р.
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Описание: Modeling and Simulation of High Speed VLSI Interconnects brings together in one place important contributions and state-of-the-art research results in this rapidly advancing area.

Автор: Christoforos Kachris; Keren Bergman; Ioannis Tomko
Название: Optical Interconnects for Future Data Center Networks
ISBN: 1493943758 ISBN-13(EAN): 9781493943753
Издательство: Springer
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Цена: 15672.00 р.
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Описание: This volume shows how optical interconnects can be used to provide high-bandwidth, energy-efficient interconnects for data centers of the future characterized by increased bandwidth requirements, presenting the latest and most promising technologies.

Автор: Philippe Lalanne; Pierre Chavel
Название: Perspectives for Parallel Optical Interconnects
ISBN: 3642492665 ISBN-13(EAN): 9783642492662
Издательство: Springer
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Цена: 11878.00 р.
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Описание: Metakides Table of contents 1 Perspectives for parallel optical interconnects: introduction . 1 Optical Interconnects and ESPRIT BRA WOIT . 3 Schemes for parallel optical interconnects . 1 Passive interconnect components 2 Free space interconnects . 1 Introduction: 3D optical interconnects . 2 Two Qasic interconnect setups .

Автор: B.K. Kaushik; V. Ramesh Kumar; Amalendu Patnaik
Название: Crosstalk in Modern On-Chip Interconnects
ISBN: 9811007993 ISBN-13(EAN): 9789811007996
Издательство: Springer
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Цена: 9141.00 р.
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Описание: The book provides accurate FDTDmodels for on-chip interconnects, covering most recent advancements inmaterials and design. It presents thestructure, properties, and characteristics of graphene based on-chipinterconnects and the FDTD modeling of Cu based on-chip interconnects.

Автор: Brajesh Kumar Kaushik; Manoj Kumar Majumder
Название: Carbon Nanotube Based VLSI Interconnects
ISBN: 8132220463 ISBN-13(EAN): 9788132220466
Издательство: Springer
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Цена: 8489.00 р.
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Описание: The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects.

Автор: Hartmut Grabinski
Название: Interconnects in VLSI Design
ISBN: 1461369541 ISBN-13(EAN): 9781461369547
Издательство: Springer
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Цена: 20962.00 р.
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Описание: This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999.

Автор: Rohit Dhiman; Rajeevan Chandel
Название: Compact Models and Performance Investigations for Subthreshold Interconnects
ISBN: 8132221311 ISBN-13(EAN): 9788132221319
Издательство: Springer
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Цена: 15672.00 р.
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Описание: The book provides a detailed analysis of issues related to sub-threshold interconnect performance from the perspective of analytical approach and design techniques.

Автор: Todri-Sanial
Название: Carbon Nanotubes for Interconnects
ISBN: 3319297449 ISBN-13(EAN): 9783319297446
Издательство: Springer
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Цена: 16070.00 р.
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Описание: This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.