Описание: As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allowed by copper interconnects.
Описание: This book presents an in-depth study and elucidation on the mechanisms of the micro-cutting process, with particular emphasis and a novel viewpoint on materials characterization and its influences on ultra-precision machining.
Описание: This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material.
Описание: This book is a collection of papers from the symposium honoring Professor Sidney Diamond of the School of Civil Engineering, Purdue University, one of the leading scholars in the field of concrete science.
Автор: Wilhelm A.M. Kulisch Название: Deposition of Diamond-Like Superhard Materials ISBN: 366215627X ISBN-13(EAN): 9783662156278 Издательство: Springer Рейтинг: Цена: 13974.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book deals with the deposition of a certain class of materials, namely the diamond-like superhard materials, in the form of thin films. Starting from concepts used to improve the hardness of a material, it is shown that the intrinsic hardness is highest for materials with low bond lengths, high coordination numbers, and low ionicities.
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