Описание: Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in electronics until recently. It collects the work of researchers recognized for their significant scientific contributions in the area.
Описание: Author Simon Monk (Raspberry Pi Cookbook) breaks down this complex subject into several topics, from using the right transistor to building and testing projects and prototypes.
Описание: Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups. The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this book particularly important for engineers and managers alike.The third edition has been updated throughout and includes new sections on nanomaterials, environmental impacts and new environmentally friendly ‘green’ adhesives. Information about regulations and compliance has been brought fully up-to-date.As well as providing full coverage of standard adhesive types, Licari explores the most recent developments in fields such as: Tamper-proof adhesives for electronic security devices. Bio-compatible adhesives for implantable medical devices. Electrically conductive adhesives to replace toxic tin-lead solders in printed circuit assembly – as required by regulatory regimes, e.g. the EU’s Restriction of Hazardous Substances Directive or RoHS (compliance is required for all products placed on the European market). Nano-fillers in adhesives, used to increase the thermal conductivity of current adhesives for cooling electronic devices.
Автор: Sarkar Название: Foundation of Digital Electronics and Logic Design ISBN: 9814364584 ISBN-13(EAN): 9789814364584 Издательство: Taylor&Francis Рейтинг: Цена: 11636.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book focuses on the basic principles of digital electronics and logic design. It is designed as a textbook for undergraduate students of electronics, electrical engineering, computer science, physics, and information technology. The text covers the syllabi of several Indian and foreign universities. It depicts the comprehensive resources on the recent ideas in the area of digital electronics explored by leading experts from both industry and academia. A good number of diagrams are provided to illustrate the concepts related to digital electronics so that students can easily comprehend the subject. Solved examples within the text explain the concepts discussed and exercises are provided at the end of each chapter.
Автор: Frank Riley; Electronic Packaging and Production Название: The Electronics Assembly Handbook ISBN: 3662131633 ISBN-13(EAN): 9783662131633 Издательство: Springer Рейтинг: Цена: 16979.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly.
Автор: Luc Martens Название: High-Frequency Characterization of Electronic Packaging ISBN: 0792383079 ISBN-13(EAN): 9780792383079 Издательство: Springer Рейтинг: Цена: 19591.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Offers an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models.
Описание: Understanding and limiting electromigration in thin films is essential to the continued development of advanced copper interconnects for integrated circuits. Electromigration in thin films and electronic devices provides an up-to-date review of key topics in this commercially important area.Part one consists of three introductory chapters, covering modelling of electromigration phenomena, modelling electromigration using the peridynamics approach and simulation and x-ray microbeam studies of electromigration. Part two deals with electromigration issues in copper interconnects, including x-ray microbeam analysis, voiding, microstructural evolution and electromigration failure. Finally, part three covers electromigration in solder, with chapters discussing topics such as electromigration-induced microstructural evolution and electromigration in flip-chip solder joints.With its distinguished editor and international team of contributors, Electromigration in thin films and electronic devices is an essential reference for materials scientists and engineers in the microelectronics, packaging and interconnects industries, as well as all those with an academic research interest in the field.
ООО "Логосфера " Тел:+7(495) 980-12-10 www.logobook.ru
