Design, Simulation and Applications of Inductors and Transformers for Si RF ICs, Ali M. Niknejad; Robert G. Meyer

Автор: Ali M. Niknejad; Robert G. Meyer
Название: Design, Simulation and Applications of Inductors and Transformers for Si RF ICs
ISBN: 1475773668 ISBN-13(EAN): 9781475773668
Издательство: Springer
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Цена: 19591.00 р.
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Описание: These elements allow greatly improved levels of performance in Si monolithic low-noise amplifiers, power amplifiers, up-conversion and down-conversion mixers and local oscillators. Accurate knowledge of inductance values, quality factor (Q) and the influence of ad- cent elements (on-chip proximity effects) and substrate losses is essential.

Автор: Jaime Aguilera; Roc Berenguer
Название: Design and Test of Integrated Inductors for RF Applications
ISBN: 1441954112 ISBN-13(EAN): 9781441954114
Издательство: Springer
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Цена: 23757.00 р.
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Описание: Intended for engineers who are starting out in the design of integrated inductors, this book describes the whole design flow, basic selection of the geometry and optimisation of the quality by redesigning the geometry, measurement and de-embedding and characterisation.

Автор: Fei Yuan
Название: CMOS Active Inductors and Transformers
ISBN: 1441945563 ISBN-13(EAN): 9781441945563
Издательство: Springer
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Цена: 20896.00 р.
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Описание: This is a comprehensive examination of the principles and implementation of CMOS active inductors and transformers, and a review of emerging applications in high-speed analog signal processing and data communications over wire and wireless channels.

Автор: Swaminathan Madhavan
Название: Design and Modeling for 3D ICs and Interposers
ISBN: 9814508594 ISBN-13(EAN): 9789814508599
Издательство: World Scientific Publishing
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Цена: 16790.00 р.
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Описание: 3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.

Автор: Brandon Noia; Krishnendu Chakrabarty
Название: Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
ISBN: 3319023772 ISBN-13(EAN): 9783319023779
Издательство: Springer
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Цена: 16979.00 р.
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Описание: This volume encompasses the latest, innovative methods of testing three-dimensional integrated circuits, incorporating pre-bond and post-bond tests as well as the test optimization and scheduling necessary to ensure that 3D testing remains cost-effective.

Автор: Wim Claes; Willy M Sansen; Robert Puers
Название: Design of Wireless Autonomous Datalogger IC`s
ISBN: 1441952705 ISBN-13(EAN): 9781441952707
Издательство: Springer
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Цена: 19589.00 р.
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Описание: Design of Wireless Autonomous Dataloggers IC`s reveals the state of the art in the design of complex dataloggers, with a special focus on low power consumption.

Автор: X. Aragones; J.L. Gonzalez; Antonio Rubio
Название: Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs
ISBN: 0792385047 ISBN-13(EAN): 9780792385042
Издательство: Springer
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Цена: 23508.00 р.
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Описание: Takes a look at coupling through the common silicon substrate, and noise at the power supply lines. This book explains the elementary knowledge needed to understand these phenomena and presents a review of works and research results. It is suitable as an introductory material to noise-coupling problems in mixed-signal ICs.

Автор: Mihai A.T. Sanduleanu; Ed A.J.M. van Tuijl
Название: Power Trade-offs and Low-Power in Analog CMOS ICs
ISBN: 1441949437 ISBN-13(EAN): 9781441949431
Издательство: Springer
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Цена: 23757.00 р.
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Описание: This volume concerns power, noise and accuracy in CMOS Analog IC Design. The authors show that power, noise and accuracy should be treated in a unitary way, as the three are inter-related. The book discusses all possible practical power-related specs at circuit and architecture level.