Power Trade-offs and Low-Power in Analog CMOS ICs, Mihai A.T. Sanduleanu; Ed A.J.M. van Tuijl
Автор: Toumazou Chris, Moschytz George S., Gilbert Barrie Название: Trade-Offs in Analog Circuit Design / The Designer`s Companion ISBN: 1402080468 ISBN-13(EAN): 9781402080463 Издательство: Springer Рейтинг: Цена: 30745.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: As the frequency of communication systems increases and the dimensions of transistors are reduced, more and more stringent performance requirements are placed on analog circuits. This is a trend that is bound to continue for the foreseeable future and while it does, understanding performance trade-offs will constitute a vital part of the analog design process. It is the insight and intuition obtained from a fundamental understanding of performance conflicts and trade-offs, that ultimately provides the designer with the basic tools necessary for effective and creative analog design. Trade-offs in Analog Circuit Design, which is devoted to the understanding of trade-offs in analog design, is quite unique in that it draws together fundamental material from, and identifies interrelationships within, a number of key analog circuits. The book covers ten subject areas: Design methodology, Technology, General Performance, Filters, Switched Circuits, Oscillators, Data Converters, Transceivers, Neural Processing, and Analog CAD. Within these subject areas it deals with a wide diversity of trade-offs ranging from frequency-dynamic range and power, gain-bandwidth, speed-dynamic range and phase noise, to tradeoffs in design for manufacture and IC layout. The book has by far transcended its original scope and has become both a designer's companion as well as a graduate textbook. An important feature of this book is that it promotes an intuitive approach to understanding analog circuits by explaining fundamental relationships and, in many cases, providing practical illustrative examples to demonstrate the inherent basic interrelationships and trade-offs. Trade-offs in Analog Circuit Design draws together 34 contributions from some of the world's most eminent analog circuits-and-systems designers to provide, for the first time, a comprehensive text devoted to a very important and timely approach to analog circuit design.
Описание: Takes a look at coupling through the common silicon substrate, and noise at the power supply lines. This book explains the elementary knowledge needed to understand these phenomena and presents a review of works and research results. It is suitable as an introductory material to noise-coupling problems in mixed-signal ICs.
Автор: Wim Claes; Willy M Sansen; Robert Puers Название: Design of Wireless Autonomous Datalogger IC`s ISBN: 1441952705 ISBN-13(EAN): 9781441952707 Издательство: Springer Рейтинг: Цена: 19589.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Design of Wireless Autonomous Dataloggers IC`s reveals the state of the art in the design of complex dataloggers, with a special focus on low power consumption.
Описание: Power distribution --the design of the geometric topology for the network of wires that connect the various power supplies, the widths of the indi- vidual segments for each of these wires, the number and location of the power I/O pins around the periphery of the chip --was simple because the chips were simpler.
Описание: Power distribution --the design of the geometric topology for the network of wires that connect the various power supplies, the widths of the indi- vidual segments for each of these wires, the number and location of the power I/O pins around the periphery of the chip --was simple because the chips were simpler.
Описание: These elements allow greatly improved levels of performance in Si monolithic low-noise amplifiers, power amplifiers, up-conversion and down-conversion mixers and local oscillators. Accurate knowledge of inductance values, quality factor (Q) and the influence of ad- cent elements (on-chip proximity effects) and substrate losses is essential.
Автор: Rohit Kapur Название: CTL for Test Information of Digital ICs ISBN: 1475778007 ISBN-13(EAN): 9781475778007 Издательство: Springer Рейтинг: Цена: 13974.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: From the reviews: "[...] a welcome addition to the literature. [...] This book promises to make a valuable contribution to the education of graduate students in electrical and computer engineering, and a very useful addition to the library of the maturer investigator in SoC designs or related fields." Microelectronics Reliability
Автор: Swaminathan Madhavan Название: Design and Modeling for 3D ICs and Interposers ISBN: 9814508594 ISBN-13(EAN): 9789814508599 Издательство: World Scientific Publishing Рейтинг: Цена: 16790.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: 3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.
Автор: Chuan Seng Tan; Ronald J. Gutmann; L. Rafael Reif Название: Wafer Level 3-D ICs Process Technology ISBN: 1441945628 ISBN-13(EAN): 9781441945624 Издательство: Springer Рейтинг: Цена: 26120.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology.
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