Conceptual Design of Multichip Modules and Systems, Peter A. Sandborn; Hector Moreno
Автор: Peter A. Sandborn; Hector Moreno Название: Conceptual Design of Multichip Modules and Systems ISBN: 1441951377 ISBN-13(EAN): 9781441951373 Издательство: Springer Рейтинг: Цена: 25848.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex).
Автор: Mysore Sriram; Sung-Mo (Steve) Kang Название: Physical Design for Multichip Modules ISBN: 079239450X ISBN-13(EAN): 9780792394501 Издательство: Springer Рейтинг: Цена: 26546.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Presents research work that has been conducted in the area of Multichip Module (MCM) design. This book presents an overview of the different MCM technologies. It discusses the various approaches to interconnect analysis. It also discuss the problems of partitioning, placement, and multilayer routing, with an emphasis on timing performance.
Описание: Presents methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). This book intends to point out the reasons for 3-D assemblies, the reasons for Silicon-in-a-Package multichip modules, and the commercial availability of the techniques.
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