Описание: An understanding of high speed interconnect phenomena is necessary for modern designs such as routing and layout of computer motherboards. Computers have reached speeds where digital design must provide for these effects. The problem is that most engineers active today have not been trained in this subject.
Описание: Realizing maximum performance from high bit-rate and RF circuits requires close attention to IC technology, circuit-to-circuit interconnections (i.e., the `interconnect`) and circuit design. Many practical circuit examples are included to demonstrate the interplay between technology, interconnect and circuit design.
Автор: Michel Dubois; Shreekant S. Thakkar Название: Cache and Interconnect Architectures in Multiprocessors ISBN: 0792390741 ISBN-13(EAN): 9780792390749 Издательство: Springer Рейтинг: Цена: 20956.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Cache And Interconnect Architectures In Multiprocessors Eilat, Israel May 25-261989 Michel Dubois UniversityofSouthernCalifornia Shreekant S. Thakkar SequentComputerSystems The aim of the workshop was to bring together researchers working on cache coherence protocols for shared-memory multiprocessors with various interconnect architectures. Shared-memory multiprocessors have become viable systems for many applications. Bus- based shared-memory systems (Eg. Sequent's Symmetry, Encore's Multimax) are currently limited to 32 processors. The fIrst goal of the workshop was to learn about the performance ofapplications on current cache-based systems. The second goal was to learn about new network architectures and protocols for future scalable systems. These protocols and interconnects would allow shared-memory architectures to scale beyond current imitations. The workshop had 20 speakers who talked about their current research. The discussions were lively and cordial enough to keep the participants away from the wonderful sand and sun for two days. The participants got to know each other well and were able to share their thoughts in an informal manner. The workshop was organized into several sessions. The summary of each session is described below. This book presents revisions of some of the papers presented at the workshop.
Автор: Konstantin Moiseev; Avinoam Kolodny; Shmuel Wimer Название: Multi-Net Optimization of VLSI Interconnect ISBN: 149394262X ISBN-13(EAN): 9781493942626 Издательство: Springer Рейтинг: Цена: 13059.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book examines design and migration methodologies for optimizing multi-net wire structures in advanced VLSI interconnects, covering scaling-dependent models for interconnect power, interconnect delay and crosstalk noise, plus design optimization problems.
Автор: Philippe Lalanne; Pierre Chavel Название: Perspectives for Parallel Optical Interconnects ISBN: 3642492665 ISBN-13(EAN): 9783642492662 Издательство: Springer Рейтинг: Цена: 11878.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Metakides Table of contents 1 Perspectives for parallel optical interconnects: introduction . 1 Optical Interconnects and ESPRIT BRA WOIT . 3 Schemes for parallel optical interconnects . 1 Passive interconnect components 2 Free space interconnects . 1 Introduction: 3D optical interconnects . 2 Two Qasic interconnect setups .
Автор: Sandeep Saini Название: Low Power Interconnect Design ISBN: 1461413222 ISBN-13(EAN): 9781461413226 Издательство: Springer Рейтинг: Цена: 15372.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: As well as offering practical solutions for delay and power reduction for on-chip interconnects and buses, this book provides in-depth descriptions of the problem of signal delay and extra power consumption and possible solutions for delays and glitches.
Автор: Todri-Sanial Название: Carbon Nanotubes for Interconnects ISBN: 3319297449 ISBN-13(EAN): 9783319297446 Издательство: Springer Рейтинг: Цена: 16070.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.
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