Testability Concepts for Digital ICs, F.P.M. Beenker; R.G. Bennetts; A.P. Thijssen
Автор: Werner Sch?tz Название: The Testability of Distributed Real-Time Systems ISBN: 1475770006 ISBN-13(EAN): 9781475770001 Издательство: Springer Рейтинг: Цена: 13974.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Автор: Chuan Seng Tan; Ronald J. Gutmann; L. Rafael Reif Название: Wafer Level 3-D ICs Process Technology ISBN: 1441945628 ISBN-13(EAN): 9781441945624 Издательство: Springer Рейтинг: Цена: 26120.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology.
Автор: F.P.M. Beenker; R.G. Bennetts; A.P. Thijssen Название: Testability Concepts for Digital ICs ISBN: 0792396588 ISBN-13(EAN): 9780792396581 Издательство: Springer Рейтинг: Цена: 30606.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Considering the testability aspects for digital ICs, this book integrates the testability aspects into the design and manufacturing of ICs and, for each IC design project, gives a precise definition of the boundary conditions, responsibilities, interfaces and communications between persons, and quality targets.
Автор: Werner Sch?tz Название: The Testability of Distributed Real-Time Systems ISBN: 0792393864 ISBN-13(EAN): 9780792393863 Издательство: Springer Рейтинг: Цена: 20956.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Starts by collecting and analyzing many principal problems, as well as their interrelations that one has to keep in mind when testing a distributed real-time system. This book discusses them from the viewpoints of software engineering, distributed systems principles, and real-time system development.
Описание: Test and Design-for-Testability in Mixed-Signal Integrated Circuits deals with test and design for test of analog and mixed-signal integrated circuits. Besides these specification-driven testing techniques, fault-driven approaches are described as they offer potential solutions which are more similar to digital test methods.
Автор: Rohit Kapur Название: CTL for Test Information of Digital ICs ISBN: 1475778007 ISBN-13(EAN): 9781475778007 Издательство: Springer Рейтинг: Цена: 13974.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: From the reviews: "[...] a welcome addition to the literature. [...] This book promises to make a valuable contribution to the education of graduate students in electrical and computer engineering, and a very useful addition to the library of the maturer investigator in SoC designs or related fields." Microelectronics Reliability
Автор: Koons Название: The Atlas of Reality: A Complete Guide to Metaphys ics ISBN: 1119116120 ISBN-13(EAN): 9781119116127 Издательство: Wiley Рейтинг: Цена: 26128.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The Atlas of Reality: A Comprehensive Guide to Metaphysics presents an extensive examination of the key topics, concepts, and guiding principles of metaphysics.
Автор: Swaminathan Madhavan Название: Design and Modeling for 3D ICs and Interposers ISBN: 9814508594 ISBN-13(EAN): 9789814508599 Издательство: World Scientific Publishing Рейтинг: Цена: 16790.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: 3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.
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