Investigation on SiGe Selective Epitaxy for Source and Drain Engineering in 22 nm CMOS Technology Node and Beyond, Guilei Wang
Автор: Morton B. Panish; Henryk Temkin Название: Gas Source Molecular Beam Epitaxy ISBN: 3642781292 ISBN-13(EAN): 9783642781292 Издательство: Springer Рейтинг: Цена: 15672.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The first book to present a unified treatment of hybrid source MBE and metalorganic MBE. Since metalorganic MBE permits selective area growth, the latest information on its application to the INP/GaInAs(P) system is presented.
Автор: Pilar Gonzalez Ruiz; Kristin De Meyer; Ann Witvrou Название: Poly-SiGe for MEMS-above-CMOS Sensors ISBN: 9401781400 ISBN-13(EAN): 9789401781404 Издательство: Springer Рейтинг: Цена: 13059.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Poly-SiGe for MEMS-above-CMOS sensors demonstrates the compatibility of poly-SiGe with post-processing above the advanced CMOS technology nodes through the successful fabrication of an integrated poly-SiGe piezoresistive pressure sensor, directly fabricated above 0.13 ГЇВїВЅ ГЇВїВЅm Cu-backend CMOS.
Описание: This book explores the reliability of novel (Si)Ge channel quantum well pMOSFET technology. It proposes a physical model to understand the intrinsically superior reliability of the MOS system consisting of a Ge-based channel and a SiO2/HfO2 dielectric stack.
Описание: Introduction.- Strain technology of Si-based materials.- SiGe Epitaxial Growth and material characterization.- SiGe Source and Drain Integration and transistor performance investigation.- Pattern Dependency behavior of SiGe Selective Epitaxy.- Summary and final words.
Автор: Pilar Gonzalez Ruiz; Kristin De Meyer; Ann Witvrou Название: Poly-SiGe for MEMS-above-CMOS Sensors ISBN: 9400767986 ISBN-13(EAN): 9789400767980 Издательство: Springer Рейтинг: Цена: 16769.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Poly-SiGe for MEMS-above-CMOS sensors demonstrates the compatibility of poly-SiGe with post-processing above the advanced CMOS technology nodes through the successful fabrication of an integrated poly-SiGe piezoresistive pressure sensor, directly fabricated above 0.13 ГЇВїВЅ ГЇВїВЅm Cu-backend CMOS.
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