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Tribology In Chemical-Mechanical Planarization, Liang, Hong , Craven, David


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Автор: Liang, Hong , Craven, David
Название:  Tribology In Chemical-Mechanical Planarization
ISBN: 9780367393250
Издательство: Taylor&Francis
Классификация:
ISBN-10: 0367393255
Обложка/Формат: Paperback
Страницы: 200
Вес: 0.81 кг.
Дата издания: 27.09.2019
Язык: English
Размер: 231 x 155 x 13
Читательская аудитория: Tertiary education (us: college)
Основная тема: Materials Science
Ссылка на Издательство: Link
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Поставляется из: Европейский союз
Описание:

The role that friction and contact play in the processes of wear and planarization on material surfaces is central to the understanding of Chemical-Mechanical planarization (CMP) technology, particularly when applied to nanosurfaces. Tribology in Chemical-Mechanical Planarization presents a detailed account of the CMP process in a language that is suitable for tribology professionals as well as chemists, materials scientists, physicists, and other applied scientists and engineers in fields of semiconductors and microelectronics. The first half of the book is devoted to CMP, while the other focuses on the fundamentals of tribology.

As the first source to integrate CMP and tribology, the book illustrates the important role that these fields play in manufacturing and technological development. It follows with an examination of tribological principles and their applications in CMP, including integrated circuits, basic concepts in surfaces of contacts, and common defects. Other topics covered in depth include basics of friction, flash temperature, lubrication fundamentals, basics of wear, polishing particles, and pad wear. The book concludes its focus with CMP practices, discussing mechanical aspects, pad materials, elastic modulus, and cell buckling.

Expanding upon the science and technology of tribology to improve the reliability, maintenance, and wear of technical equipment and other material applications, Tribology in Chemical-Mechanical Planarization provides scientists and engineers with clear foresight to the future of this technology.




Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication

Автор: Jianfeng Luo; David A. Dornfeld
Название: Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication
ISBN: 364206115X ISBN-13(EAN): 9783642061158
Издательство: Springer
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Цена: 29209.00 р.
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Описание: Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example.

Friction Wear Lubrication A Textbk

Автор: Ludema
Название: Friction Wear Lubrication A Textbk
ISBN: 1482210177 ISBN-13(EAN): 9781482210170
Издательство: Taylor&Francis
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Цена: 11023.00 р.
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Описание: This bestseller adds more on surface characterization and recent advances in the field. It offers additional descriptions of common testing methods, including diagrams and surface texturing for enhanced lubrication, and more information on rolling element bearings. It explores surface profile characterization and elastic plastic contact mechanics.

Friction, Wear, and Erosion Atlas

Автор: Budinski
Название: Friction, Wear, and Erosion Atlas
ISBN: 1138074314 ISBN-13(EAN): 9781138074316
Издательство: Taylor&Francis
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Цена: 16078.00 р.
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Описание:

Friction, wear, and erosion are major issues in mechanical engineering and materials science, resulting in major costs to businesses operating in the automotive, biomedical, petroleum/oil/gas, and structural engineering industries. The good news is, by understanding what friction, wear, or erosion mode predominates in a mechanism or device, you can take action to prevent its costly failure.

Seeing Is Believing

Containing nearly 300 photos of component failures, macro- and micrographs of surface damage, and schematics on material removal mechanisms collected over 50 years of tribology consulting and research, Friction, Wear, and Erosion Atlas is a must-have quick reference for tribology professionals and laymen alike. Complete with detailed explanations of every friction, wear, and erosion process, the atlas' catalog of images is supported by a wealth of practical guidance on:

  • Diagnosing the specific causes of part failure
  • Identifying popular modes of wear, including rolling and impact, with a special emphasis on adhesion and abrasion
  • Understanding manifestations of friction, such as force traces from a laboratory test rig for a variety of test couples
  • Recognizing liquid droplet, solid particle, slurry, equal impingement, and cavitation modes of erosion
  • Developing solutions to process-limiting problems

Featuring a glossary of tribology terms and definitions, as well as hundreds of visual representations, Friction, Wear, and Erosion Atlas is both user friendly and useful. It not only raises awareness of the importance of tribology, but provides guidance for how designers can proactively mitigate tribology concerns.

Advances in Chemical Mechanical Planarization

Автор: S V Babu
Название: Advances in Chemical Mechanical Planarization
ISBN: 012821791X ISBN-13(EAN): 9780128217917
Издательство: Elsevier Science
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Цена: 37055.00 р.
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Описание:

Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP.

This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction.

Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D.

Chemical-Mechanical Planarization of Semiconductor Materials

Автор: M.R. Oliver
Название: Chemical-Mechanical Planarization of Semiconductor Materials
ISBN: 3642077382 ISBN-13(EAN): 9783642077388
Издательство: Springer
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Цена: 28732.00 р.
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Описание: This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Science and Technology of Chemical Mechanical Planarization (CMP)

Автор: Kumar
Название: Science and Technology of Chemical Mechanical Planarization (CMP)
ISBN: 1605111309 ISBN-13(EAN): 9781605111308
Издательство: Cambridge Academ
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Цена: 16315.00 р.
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Описание: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Micro- and Nanoscale Phenomena in Tribology

Название: Micro- and Nanoscale Phenomena in Tribology
ISBN: 1138072354 ISBN-13(EAN): 9781138072350
Издательство: Taylor&Francis
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Цена: 13014.00 р.
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Описание:

Drawn from presentations at a recent National Science Foundation Summer Institute on Nanomechanics, Nanomaterials, and Micro/Nanomanufacturing, Micro- and Nanoscale Phenomena in Tribology explores the convergence of the multiple science and engineering disciplines involved in tribology and the connection from the macro to nano world. Written by specialists from computation, materials science, mechanical engineering, surface physics, and chemistry, each chapter provides up-to-date coverage of both basic and advanced topics and includes extensive references for further study.

After discussing the evolution of tribology in the micro and nano world, the book describes contact conditions spanning between macroscale and nanoscale contacts. It presents an overview of fundamental continuum treatments of interfacial contact and lubrication under a wide range of conditions, including novel advances in contact simulation. It also gives a thorough account of the nature of surface energies and forces in nanostructures as well as adhesion in dry and wet environments. The book then explains how to perform friction measurements at the nanoscale and interpret friction data before demonstrating how micro- and nanotextured surfaces affect adhesion, friction, and wetting. The final chapters emphasize the importance of surface chemistry and molecular dynamics simulation in tribology.

With numerous examples and figures throughout, this volume presents a thorough account of important advancements in tribology that offer insight into micro- and nanoscale phenomena. By enabling a better understanding of fundamental micro- and nanoscale interactions, the book helps readers effectively design and fabricate durable tribological components for various engineering and biological systems.

Advanced High Strength Steel And Press Hardening - Proceedings Of The 2Nd International Conference (Ichsu2015)

Автор: Zhang Yisheng Et Al
Название: Advanced High Strength Steel And Press Hardening - Proceedings Of The 2Nd International Conference (Ichsu2015)
ISBN: 9813140615 ISBN-13(EAN): 9789813140615
Издательство: World Scientific Publishing
Цена: 38016.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: This proceedings brings together one hundred and ten selected papers presented at the 2nd International Conference on Advanced High Strength Steel and Press Hardening (ICHSU2015), which was held in Changsha, China, during October 15-18, 2015.

Mechanical Tribology

Название: Mechanical Tribology
ISBN: 0367394367 ISBN-13(EAN): 9780367394363
Издательство: Taylor&Francis
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Цена: 10104.00 р.
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Описание:

Studying the morphology, defects, and wear behavior of a variety of material surfaces, Mechanical Tribology examines popular and emerging surface characterization techniques for assessment of the physical, mechanical, and chemical properties of various modified surfaces, thin films, and coatings.

Its chapters explore a wide range of tribological applications while promoting reduced component deterioration and improved efficiency and reliability of mechanical systems. The book includes extensive coverage of critical technologies that are usually absent in other references on the subject, delving into procedures affecting metal cutting and forming, physicochemical issues involved in the design of fiber finishes, and recent progress in biotribological research. It provides strategies to characterize the friction and wear properties of tribological systems and procedures to assess the quality and lifetime of ceramic materials. It also outlines methods to avoid scuffing and seizure in machine operations and novel techniques to prevent oil from spreading and creeping in lubricating applications.

Mechanical Tribology is a practical guide for mechanical, industrial, chemical, process, design, and process engineers, materials scientists, and tribologists in the selection of materials, surface treatments, coatings, and environments best suited for a particular industrial application.

Advances in Chemical Mechanical Planarization (CMP)

Автор: Suryadevara Babu
Название: Advances in Chemical Mechanical Planarization (CMP)
ISBN: 0081001657 ISBN-13(EAN): 9780081001653
Издательство: Elsevier Science
Рейтинг:
Цена: 35202.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. . This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. . Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction.

Tribology of Diamond-like Carbon Films

Автор: Christophe Donnet; Ali Erdemir
Название: Tribology of Diamond-like Carbon Films
ISBN: 1441940200 ISBN-13(EAN): 9781441940209
Издательство: Springer
Рейтинг:
Цена: 19589.00 р.
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Описание: This book highlights some of the most important structural, chemical, mechanical and tribological characteristics of DLC films. The book provides reliable and up-to-date information on available industrial DLC coatings and includes clear definitions and descriptions of various DLC films and their properties.

Contact Dynamics: Methods of Differential Specific Forces

Автор: Goloshchapov
Название: Contact Dynamics: Methods of Differential Specific Forces
ISBN: 1771886838 ISBN-13(EAN): 9781771886833
Издательство: Taylor&Francis
Рейтинг:
Цена: 20059.00 р.
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Описание: This new book describes the application of the method of the differential specific forces (MDSF). By using this new method, the solutions to the problems of a dissipative viscoelastic and elastic-plastic contacts between curvilinear surfaces of two solid bodies can be found.


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