Advances in Chemical Mechanical Planarization, S V Babu
Автор: Heslehurst Название: Engineered Repairs Of Composite Str ISBN: 1498726267 ISBN-13(EAN): 9781498726269 Издательство: Taylor&Francis Рейтинг: Цена: 23734.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book provides a detailed discussion, analysis, and procedure for effective and efficient repair design. It discusses identifying damage types and the effect on structural integrity in composite structures. This leads to the design of a repair scheme that suits the restoration of the structural integrity and damage tolerance.
Описание: Introduces advanced mathematical tools for the modeling, simulation, and analysis of chemical non-equilibrium phenomena in combustion and flows, following a detailed explanation of the basics of thermodynamics and chemical kinetics of reactive mixtures. Researchers, practitioners, lecturers, and graduate students will find this work valuable.
Автор: Suryadevara Babu Название: Advances in Chemical Mechanical Planarization (CMP) ISBN: 0081001657 ISBN-13(EAN): 9780081001653 Издательство: Elsevier Science Рейтинг: Цена: 35202.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. . This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. . Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction.
Автор: M.R. Oliver Название: Chemical-Mechanical Planarization of Semiconductor Materials ISBN: 3642077382 ISBN-13(EAN): 9783642077388 Издательство: Springer Рейтинг: Цена: 28732.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
Описание: Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example.
Автор: Liang, Hong , Craven, David Название: Tribology In Chemical-Mechanical Planarization ISBN: 0367393255 ISBN-13(EAN): 9780367393250 Издательство: Taylor&Francis Рейтинг: Цена: 10104.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание:
The role that friction and contact play in the processes of wear and planarization on material surfaces is central to the understanding of Chemical-Mechanical planarization (CMP) technology, particularly when applied to nanosurfaces. Tribology in Chemical-Mechanical Planarization presents a detailed account of the CMP process in a language that is suitable for tribology professionals as well as chemists, materials scientists, physicists, and other applied scientists and engineers in fields of semiconductors and microelectronics. The first half of the book is devoted to CMP, while the other focuses on the fundamentals of tribology.
As the first source to integrate CMP and tribology, the book illustrates the important role that these fields play in manufacturing and technological development. It follows with an examination of tribological principles and their applications in CMP, including integrated circuits, basic concepts in surfaces of contacts, and common defects. Other topics covered in depth include basics of friction, flash temperature, lubrication fundamentals, basics of wear, polishing particles, and pad wear. The book concludes its focus with CMP practices, discussing mechanical aspects, pad materials, elastic modulus, and cell buckling. Expanding upon the science and technology of tribology to improve the reliability, maintenance, and wear of technical equipment and other material applications, Tribology in Chemical-Mechanical Planarization provides scientists and engineers with clear foresight to the future of this technology.
Описание: Production, new materials development, and mechanics are the central subjects of modern industry and advanced science. With a very broad reach across several different disciplines, selecting the most forward-thinking research to review can be a hefty task, especially for study in niche applications that receive little coverage. For those subjects, collecting the research available is of utmost importance.
The Handbook of Research on Advancements in Manufacturing, Materials, and Mechanical Engineering is an essential reference source that examines emerging obstacles in these fields of engineering and the methods and tools used to find solutions. Featuring coverage of a broad range of topics including fabricating procedures, automated control, and material selection, this book is ideally designed for academics; tribology and materials researchers; mechanical, physics, and materials engineers; professionals in related industries; scientists; and students.
Thermal, Mechanical, and Hybrid Chemical Energy Storage Systems provides unique and comprehensive guidelines on all non-battery energy storage technologies, including their technical and design details, applications, and how to make decisions and purchase them for commercial use. The book covers all short and long-term electric grid storage technologies that utilize heat or mechanical potential energy to store electricity, including their cycles, application, advantages and disadvantages, such as round-trip-efficiency, duration, cost and siting. Also discussed are hybrid technologies that utilize hydrogen as a storage medium aside from battery technology.
Readers will gain substantial knowledge on all major mechanical, thermal and hybrid energy storage technologies, their market, operational challenges, benefits, design and application criteria.
Provide a state-of-the-art, ongoing R&D review
Covers comprehensive energy storage hybridization tactics
Features standalone chapters containing technology advances, design and applications
A single-volume resource featuring state-of-the art reviews of key elements of the roll-to-roll manufacturing processing methodology
Roll-to-roll (R2R) manufacturing is an important manufacturing platform used extensively for mass-producing a host of film-type products in several traditional industries such as printing, silver-halide photography, and paper. Over the last two decades, some of the methodologies and know-how of R2R manufacturing have been extended and adapted in many new technology areas, including microelectronics, display, photovoltaics, and microfluidics. This comprehensive book presents the state-of-the-art unit operations of the R2R manufacturing platform, providing a good resource for engineers and practitioners not familiar with the fundamentals of R2R technology.
Roll-to-Roll Manufacturing: Process Elements and Recent Advances reviews new developments in areas such as flexible glass, display, and photovoltaics and covers a number of process innovations implemented recently to extend and improve the capabilities of traditional R2R lines. It covers such topics as: wet coating; drying; in-line photolithography; conveyance and roller dynamics; finishing (slitting, cutting, chopping, etc.); substrates; core-set curl and winding effects; priming and adhesion; R2R for biomedical applications; process control; in-line vacuum coating and CVD; electrostatic effects and anti-static control; and more.
Examines key elements (unit operations) of the R2R technology, and how these elements are utilized and integrated to achieve desired process efficiencies in a host of applications
Illustrates several established and novel application areas where R2R processing is utilized in current or future products
Discusses process design methodology and key advantages of R2R manufacturing process technologies
Roll-to-Roll Manufacturing: Process Elements and Recent Advances is an ideal book for undergraduate and graduate students in various science and engineering disciplines, as well as for scientists, engineers, and technical and business leaders associated in any way with the development, commercialization, and manufacture of a variety of film products.
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