Автор: John Hock Lye Pang Название: Lead Free Solder ISBN: 1489991166 ISBN-13(EAN): 9781489991164 Издательство: Springer Рейтинг: Цена: 15672.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Lead-free solders play a crucial role in the electronics industry. Featuring in-depth design and reliability information on lead-free deformation and failure analysis, this book covers a wide range of topics including advanced material mechanics theory.
Автор: KV Subramanian Название: Lead-Free Electronic Solders ISBN: 1441943021 ISBN-13(EAN): 9781441943026 Издательство: Springer Рейтинг: Цена: 30606.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in electronics until recently. It collects the work of researchers recognized for their significant scientific contributions in the area.
Описание: Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in electronics until recently. It collects the work of researchers recognized for their significant scientific contributions in the area.
Автор: Mohd N. Tamin; Norhashimah M. Shaffiar Название: Solder Joint Reliability Assessment ISBN: 3319343017 ISBN-13(EAN): 9783319343013 Издательство: Springer Рейтинг: Цена: 15672.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book offers a systematic approach to assessing reliability of solder joints using Finite Element simulation, including problems in solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, mechanisms of joint fatigue and more.
Автор: Evans John W., Kwon Dong-il, Engelmaier Werner Название: A Guide to Lead-free Solders / Physical Metallurgy and Reliability ISBN: 1846283094 ISBN-13(EAN): 9781846283093 Издательство: Springer Рейтинг: Цена: 17462.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The transition to lead-free solders seems to be a foregone conclusion with Japan and Europe leading the way. Indeed some key companies will move to lead free soon and the WEEE Directive 2002/96/EC on Waste Electrical and Electronic Equipment will require all companies doing business in the EU to transition to lead-free. Compliance with forthcoming lead-free regulations will ultimately fall to individual companies and the engineers responsible for design and prod- tion of electronic products and they must be prepared with adequate knowledge of the materials that are leading candidates and they must be prepared to fill the gaps in the data base for their own products. Research worldwide over the past 10 years has produced data and direction for choosing an alloy to substitute for near-eutectic SnPb alloys. This book will provide a valuable resource for engineers involved in the transition to products. Basic theory is presented on the physical metallurgy of soldering technology including elements of assembly, surface finishes and solder-paste technology, wetting and solidification, microstructural instability and intermetallic c- pounds and mechanical, creep and fatigue behavior. Techniques for measuring and testing are discussed and data on SnPb and various lead-free solders are presented and compared. If lead-free solder data are not available on the re- vant topic, information is presented on near-eutectic SnPb, so as to show where the gaps in knowledge need to be filled.
Описание: This book brings together contributions from the leading European experts in lead-free soldering. It offers comprehensive coverage of the scientific background and its applications in reliability testing of lead-free solder joints.
Автор: Theodorus van de Ven, Armand Soldera Название: Advanced Materials ISBN: 3110537656 ISBN-13(EAN): 9783110537659 Издательство: Walter de Gruyter Цена: 14867.00 р. Наличие на складе: Нет в наличии.
Описание: Advanced Materials gives an unique insight into the specialized materials that are required to run our modern society. Provided within are the fundamental theories and applications of advanced materials for metals, glasses, polymers, composites, and nanomaterials. This book is ideal for scientists and engineers of materials science, chemistry, physics, and engineering, and students of these disciplines.
Автор: Mohd N. Tamin; Norhashimah M. Shaffiar Название: Solder Joint Reliability Assessment ISBN: 3319000918 ISBN-13(EAN): 9783319000916 Издательство: Springer Рейтинг: Цена: 18284.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book offers a systematic approach to assessing reliability of solder joints using Finite Element simulation, including problems in solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, mechanisms of joint fatigue and more.
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