Solder Joint Reliability Assessment, Mohd N. Tamin; Norhashimah M. Shaffiar
Автор: Mohd N. Tamin; Norhashimah M. Shaffiar Название: Solder Joint Reliability Assessment ISBN: 3319000918 ISBN-13(EAN): 9783319000916 Издательство: Springer Рейтинг: Цена: 18284.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book offers a systematic approach to assessing reliability of solder joints using Finite Element simulation, including problems in solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, mechanisms of joint fatigue and more.
Описание: This book brings together contributions from the leading European experts in lead-free soldering. It offers comprehensive coverage of the scientific background and its applications in reliability testing of lead-free solder joints.
Автор: Evans John W., Kwon Dong-il, Engelmaier Werner Название: A Guide to Lead-free Solders / Physical Metallurgy and Reliability ISBN: 1846283094 ISBN-13(EAN): 9781846283093 Издательство: Springer Рейтинг: Цена: 17462.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The transition to lead-free solders seems to be a foregone conclusion with Japan and Europe leading the way. Indeed some key companies will move to lead free soon and the WEEE Directive 2002/96/EC on Waste Electrical and Electronic Equipment will require all companies doing business in the EU to transition to lead-free. Compliance with forthcoming lead-free regulations will ultimately fall to individual companies and the engineers responsible for design and prod- tion of electronic products and they must be prepared with adequate knowledge of the materials that are leading candidates and they must be prepared to fill the gaps in the data base for their own products. Research worldwide over the past 10 years has produced data and direction for choosing an alloy to substitute for near-eutectic SnPb alloys. This book will provide a valuable resource for engineers involved in the transition to products. Basic theory is presented on the physical metallurgy of soldering technology including elements of assembly, surface finishes and solder-paste technology, wetting and solidification, microstructural instability and intermetallic c- pounds and mechanical, creep and fatigue behavior. Techniques for measuring and testing are discussed and data on SnPb and various lead-free solders are presented and compared. If lead-free solder data are not available on the re- vant topic, information is presented on near-eutectic SnPb, so as to show where the gaps in knowledge need to be filled.
Автор: KV Subramanian Название: Lead-Free Electronic Solders ISBN: 1441943021 ISBN-13(EAN): 9781441943026 Издательство: Springer Рейтинг: Цена: 30606.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in electronics until recently. It collects the work of researchers recognized for their significant scientific contributions in the area.
Описание: Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in electronics until recently. It collects the work of researchers recognized for their significant scientific contributions in the area.
Автор: Cepin Marko Название: Assessment of Power System Reliability ISBN: 1447161009 ISBN-13(EAN): 9781447161004 Издательство: Springer Рейтинг: Цена: 20896.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: With the aim of improving power system reliability, this volume covers the background, analytical methodology, reliability assessment, and optimization as well as their application in straightforward language that emphasizes practical implementation.
Автор: Andrew E. Perkins; Suresh K. Sitaraman Название: Solder Joint Reliability Prediction for Multiple Environments ISBN: 1441946349 ISBN-13(EAN): 9781441946348 Издательство: Springer Рейтинг: Цена: 15672.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Here is a text that will provide industry engineers, graduate students, academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments.
Автор: King-Ning Tu Название: Solder Joint Technology ISBN: 1441922849 ISBN-13(EAN): 9781441922847 Издательство: Springer Рейтинг: Цена: 26120.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The European Union`s directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders.
Автор: A.C. Tan Название: Tin and Solder Plating in the Semiconductor Industry ISBN: 0412482401 ISBN-13(EAN): 9780412482403 Издательство: Springer Рейтинг: Цена: 28734.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Provides coverage of the theory and practice of plating semiconductor devices. This book introduces the principal concepts of plating and discusses its practice. It is designed to help electroplaters achieve `zero-defect` plating by providing an understanding of the plating chemistry and the handling of the plated parts.
Автор: Mass Soldal Lund; Bj?rnar Solhaug; Ketil St?len Название: Model-Driven Risk Analysis ISBN: 3642447015 ISBN-13(EAN): 9783642447013 Издательство: Springer Рейтинг: Цена: 13974.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: As well as providing an introduction to risk analysis in general, this study looks at a particular approach known as CORAS, a model-driven method for defensive risk analysis featuring a tool-supported modelling language specially designed to model risks.
Автор: Jennie Hwang Название: Solder Paste in Electronics Packaging ISBN: 0442013531 ISBN-13(EAN): 9780442013530 Издательство: Springer Рейтинг: Цена: 14673.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Aims to provide a working understanding of the latest solder paste principles and applications, enabling engineers to take advantage of current surface mount technology. Coverage includes basic technologies, application techniques, reliability and solutions to specific problems.
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