Tin and Solder Plating in the Semiconductor Industry, A.C. Tan

Автор: Mohd N. Tamin; Norhashimah M. Shaffiar
Название: Solder Joint Reliability Assessment
ISBN: 3319343017 ISBN-13(EAN): 9783319343013
Издательство: Springer
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Цена: 15672.00 р.
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Описание: This book offers a systematic approach to assessing reliability of solder joints using Finite Element simulation, including problems in solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, mechanisms of joint fatigue and more.

Автор: King-Ning Tu
Название: Solder Joint Technology
ISBN: 1441922849 ISBN-13(EAN): 9781441922847
Издательство: Springer
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Цена: 26120.00 р.
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Описание: The European Union`s directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders.

Автор: Haldar, S. K.
Название: Platinum-Nickel-Chromium Deposits
ISBN: 0128020415 ISBN-13(EAN): 9780128020418
Издательство: Elsevier Science
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Цена: 14820.00 р.
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Описание: Platinum-Nickel-Chromium Deposits: Geology, Exploration, and Reserve Base is the first reference book to combine information on the discovery of numerous minerals within existing deposits. This book recognizes the close affinity and great natural coexistence of platinum, palladium, chromium, nickel, copper, gold, and silver hosted by unique stratigraphy (mafic-ultramafic intrusive of layered ingenious complex) in a diverse structural set up. The chapters are organized in a logical sequence of introductory physical and chemical properties, demand-supply scenario, price trend, substitution-recycling and uses of these metals, stratigraphy and host rocks, geochemistry, global distribution of existing deposits in six mega continents, genetic system, reserves-resources overview, common characteristic features aiding as exploration guides for new targets, hazards, and sustainable development. This reference book is a must for students, research scholars, teachers, and professional explorers in economic geology, geography, and allied subjects.

Автор: David H. Kirkwood; Michel Su?ry; Plato Kapranos; H
Название: Semi-solid Processing of Alloys
ISBN: 3642007058 ISBN-13(EAN): 9783642007057
Издательство: Springer
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Цена: 19591.00 р.
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Описание: This book presents the state of the art concerning the fundamental aspects of semi-solid processing of alloys and composites, together with the industrial applications. It gives particular consideration to recent developments in slurry formation.

Автор: Jennie Hwang
Название: Solder Paste in Electronics Packaging
ISBN: 0442013531 ISBN-13(EAN): 9780442013530
Издательство: Springer
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Цена: 14673.00 р.
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Описание: Aims to provide a working understanding of the latest solder paste principles and applications, enabling engineers to take advantage of current surface mount technology. Coverage includes basic technologies, application techniques, reliability and solutions to specific problems.

Автор: Mohd N. Tamin; Norhashimah M. Shaffiar
Название: Solder Joint Reliability Assessment
ISBN: 3319000918 ISBN-13(EAN): 9783319000916
Издательство: Springer
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Цена: 18284.00 р.
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Описание: This book offers a systematic approach to assessing reliability of solder joints using Finite Element simulation, including problems in solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, mechanisms of joint fatigue and more.

Автор: G?nter Grossmann; Christian Zardini
Название: The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
ISBN: 1447158407 ISBN-13(EAN): 9781447158400
Издательство: Springer
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Цена: 18284.00 р.
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Описание: This book brings together contributions from the leading European experts in lead-free soldering. It offers comprehensive coverage of the scientific background and its applications in reliability testing of lead-free solder joints.

Автор: Andrew E. Perkins; Suresh K. Sitaraman
Название: Solder Joint Reliability Prediction for Multiple Environments
ISBN: 1441946349 ISBN-13(EAN): 9781441946348
Издательство: Springer
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Цена: 15672.00 р.
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Описание: Here is a text that will provide industry engineers, graduate students, academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments.

Автор: M. Ivanyi; M. Skaloud
Название: Steel Plated Structures
ISBN: 3211827420 ISBN-13(EAN): 9783211827420
Издательство: Springer
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Цена: 12157.00 р.
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Описание: This volume on the scientific background, research advances and recommendations for advanced design of steel and steel-concrete composite plated structures takes account of their ultimate load behaviour, buckling, shear lag, "breathing" and fatigue.

Автор: Fathi Zereini; Clare L.S. Wiseman
Название: Platinum Metals in the Environment
ISBN: 366252385X ISBN-13(EAN): 9783662523858
Издательство: Springer
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Цена: 19589.00 р.
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Автор: Mass Soldal Lund; Bj?rnar Solhaug; Ketil St?len
Название: Model-Driven Risk Analysis
ISBN: 3642447015 ISBN-13(EAN): 9783642447013
Издательство: Springer
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Цена: 13974.00 р.
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Описание: As well as providing an introduction to risk analysis in general, this study looks at a particular approach known as CORAS, a model-driven method for defensive risk analysis featuring a tool-supported modelling language specially designed to model risks.

Автор: Andr? Platzer
Название: Logical Foundations of Cyber-Physical Systems
ISBN: 3319635875 ISBN-13(EAN): 9783319635873
Издательство: Springer
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Цена: 6288.00 р.
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Описание: Cyberphysical systems (CPSs) combine cyber capabilities, such as computation or communication, with physical capabilities, such as motion or other physical processes.