Solder Paste in Electronics Packaging, Jennie Hwang

Автор: Jennie S. Hwang
Название: Solder Paste in Electronics Packaging
ISBN: 940116052X ISBN-13(EAN): 9789401160520
Издательство: Springer
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Цена: 6986.00 р.
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Описание: One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech- nology.

Автор: Mohd N. Tamin; Norhashimah M. Shaffiar
Название: Solder Joint Reliability Assessment
ISBN: 3319000918 ISBN-13(EAN): 9783319000916
Издательство: Springer
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Цена: 18284.00 р.
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Описание: This book offers a systematic approach to assessing reliability of solder joints using Finite Element simulation, including problems in solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, mechanisms of joint fatigue and more.

Автор: G?nter Grossmann; Christian Zardini
Название: The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
ISBN: 1447158407 ISBN-13(EAN): 9781447158400
Издательство: Springer
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Цена: 18284.00 р.
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Описание: This book brings together contributions from the leading European experts in lead-free soldering. It offers comprehensive coverage of the scientific background and its applications in reliability testing of lead-free solder joints.

Автор: A.C. Tan
Название: Tin and Solder Plating in the Semiconductor Industry
ISBN: 0412482401 ISBN-13(EAN): 9780412482403
Издательство: Springer
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Цена: 28734.00 р.
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Описание: Provides coverage of the theory and practice of plating semiconductor devices. This book introduces the principal concepts of plating and discusses its practice. It is designed to help electroplaters achieve `zero-defect` plating by providing an understanding of the plating chemistry and the handling of the plated parts.

Автор: Subramanian K.N.
Название: Lead-Free Electronic Solders / A Special Issue of the Journal of Materials Science: Materials in Electronics
ISBN: 0387484310 ISBN-13(EAN): 9780387484310
Издательство: Springer
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Цена: 30606.00 р.
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Описание: Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in electronics until recently. It collects the work of researchers recognized for their significant scientific contributions in the area.

Автор: King-Ning Tu
Название: Solder Joint Technology
ISBN: 1441922849 ISBN-13(EAN): 9781441922847
Издательство: Springer
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Цена: 26120.00 р.
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Описание: The European Union`s directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders.

Автор: Michael Hosking; Frederick G. Yost
Название: The Mechanics of Solder Alloy Wetting and Spreading
ISBN: 1468414429 ISBN-13(EAN): 9781468414424
Издательство: Springer
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Цена: 13974.00 р.
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Описание: In 1992 Congress passed the Defense Manufacturing Engineering Education Act with the intent of encouraging academic institutions to increase their emphasis on manufacturing curricula.

Автор: Mohd N. Tamin; Norhashimah M. Shaffiar
Название: Solder Joint Reliability Assessment
ISBN: 3319343017 ISBN-13(EAN): 9783319343013
Издательство: Springer
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Цена: 15672.00 р.
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Описание: This book offers a systematic approach to assessing reliability of solder joints using Finite Element simulation, including problems in solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, mechanisms of joint fatigue and more.

Автор: Andrew E. Perkins; Suresh K. Sitaraman
Название: Solder Joint Reliability Prediction for Multiple Environments
ISBN: 1441946349 ISBN-13(EAN): 9781441946348
Издательство: Springer
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Цена: 15672.00 р.
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Описание: Here is a text that will provide industry engineers, graduate students, academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments.

Автор: John Hock Lye Pang
Название: Lead Free Solder
ISBN: 1489991166 ISBN-13(EAN): 9781489991164
Издательство: Springer
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Цена: 15672.00 р.
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Описание: Lead-free solders play a crucial role in the electronics industry. Featuring in-depth design and reliability information on lead-free deformation and failure analysis, this book covers a wide range of topics including advanced material mechanics theory.

Автор: Mass Soldal Lund; Bj?rnar Solhaug; Ketil St?len
Название: Model-Driven Risk Analysis
ISBN: 3642447015 ISBN-13(EAN): 9783642447013
Издательство: Springer
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Цена: 13974.00 р.
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Описание: As well as providing an introduction to risk analysis in general, this study looks at a particular approach known as CORAS, a model-driven method for defensive risk analysis featuring a tool-supported modelling language specially designed to model risks.

Автор: John H. Lau
Название: Solder Joint Reliability
ISBN: 1461367433 ISBN-13(EAN): 9781461367437
Издательство: Springer
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Цена: 36570.00 р.
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Описание: New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them.