Автор: Evans John W., Kwon Dong-il, Engelmaier Werner Название: A Guide to Lead-free Solders / Physical Metallurgy and Reliability ISBN: 1846283094 ISBN-13(EAN): 9781846283093 Издательство: Springer Рейтинг: Цена: 17462.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The transition to lead-free solders seems to be a foregone conclusion with Japan and Europe leading the way. Indeed some key companies will move to lead free soon and the WEEE Directive 2002/96/EC on Waste Electrical and Electronic Equipment will require all companies doing business in the EU to transition to lead-free. Compliance with forthcoming lead-free regulations will ultimately fall to individual companies and the engineers responsible for design and prod- tion of electronic products and they must be prepared with adequate knowledge of the materials that are leading candidates and they must be prepared to fill the gaps in the data base for their own products. Research worldwide over the past 10 years has produced data and direction for choosing an alloy to substitute for near-eutectic SnPb alloys. This book will provide a valuable resource for engineers involved in the transition to products. Basic theory is presented on the physical metallurgy of soldering technology including elements of assembly, surface finishes and solder-paste technology, wetting and solidification, microstructural instability and intermetallic c- pounds and mechanical, creep and fatigue behavior. Techniques for measuring and testing are discussed and data on SnPb and various lead-free solders are presented and compared. If lead-free solder data are not available on the re- vant topic, information is presented on near-eutectic SnPb, so as to show where the gaps in knowledge need to be filled.
Описание: Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in electronics until recently. It collects the work of researchers recognized for their significant scientific contributions in the area.
Описание: This book introduces a model-based quantitative performance indicator methodology which is applicable for performance, cost and reliability optimization of non-volatile memory. Covers reliability and cost optimization, performance parameters and more.
Reliability Investigation of LED Devices for Public Light Applications focuses on state-of-the-art GaN-based LED technology through the study of typical failure mechanisms in public lighting applications.
Across the different chapters, the reader will explore the tools and analyses involved in the study and application of a number of different LED devices. The authors review GaN-based LED technology by focusing on the main failure mechanisms targeting polymer-based packaging, thanks to electrical and spectral models.
The proposed technology and methodologies will help those interested in the topic to further their knowledge of failure mechanisms, exploring the physical and chemical analyses involved.
Based on the work of two main Phd results in 2011 and 2014
Describes GaN technology in the state-of-the-art, focusing on the specific electrical and spectral model
Proposes the technology and methodologies to understand failure mechanisms
Автор: Andrew E. Perkins; Suresh K. Sitaraman Название: Solder Joint Reliability Prediction for Multiple Environments ISBN: 0387793933 ISBN-13(EAN): 9780387793931 Издательство: Springer Рейтинг: Цена: 18284.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Here is a text that will provide industry engineers, graduate students, academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments.
Автор: Tae-Kyu Lee; Thomas R. Bieler; Choong-Un Kim; Hong Название: Fundamentals of Lead-Free Solder Interconnect Technology ISBN: 1461492653 ISBN-13(EAN): 9781461492658 Издательство: Springer Рейтинг: Цена: 18284.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys.
Описание: An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability, and testing.
Автор: Ram Название: Advances in Reliability and System Engineering ISBN: 3319488740 ISBN-13(EAN): 9783319488745 Издательство: Springer Рейтинг: Цена: 19564.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book presents original studies describing the latest research and developments in the area of reliability and systems engineering. It helps the reader identifying gaps in the current knowledge and presents fruitful areas for further research in the field. Among others, this book covers reliability measures, reliability assessment of multi-state systems, optimization of multi-state systems, continuous multi-state systems, new computational techniques applied to multi-state systems and probabilistic and non-probabilistic safety assessment.
Описание: Understanding and limiting electromigration in thin films is essential to the continued development of advanced copper interconnects for integrated circuits. Electromigration in thin films and electronic devices provides an up-to-date review of key topics in this commercially important area.Part one consists of three introductory chapters, covering modelling of electromigration phenomena, modelling electromigration using the peridynamics approach and simulation and x-ray microbeam studies of electromigration. Part two deals with electromigration issues in copper interconnects, including x-ray microbeam analysis, voiding, microstructural evolution and electromigration failure. Finally, part three covers electromigration in solder, with chapters discussing topics such as electromigration-induced microstructural evolution and electromigration in flip-chip solder joints.With its distinguished editor and international team of contributors, Electromigration in thin films and electronic devices is an essential reference for materials scientists and engineers in the microelectronics, packaging and interconnects industries, as well as all those with an academic research interest in the field.
Автор: Deshayes, Yannick Название: Reliability and Robustness and Failure Mechanisms of Leds Devices ISBN: 1785481525 ISBN-13(EAN): 9781785481529 Издательство: Elsevier Science Рейтинг: Цена: 12801.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание:
The rapid growth of the use of optoelectronic technology in Information and Communications Technology (ICT) has seen a complementary increase in the performance of such technologies. As a result, optoelectronic technologies have replaced the technology of electronic interconnections. However, the control of manufacturing techniques for optoelectronic systems is more delicate than that of microelectronic technologies. This practical resource, divided into four chapters, examines several methods for determining the reliability of infrared LED devices. The primary interest of this book focuses on methods of extracting fundamental parameters from the electrical and optical characterization of specific zones in components. Failure mechanisms are identified based on measured performance before and after aging tests. Knowledge of failure mechanisms allows formulation of degradation laws, which in turn allow an accurate lifetime distribution for specific devices to be proposed.
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