The Mechanics of Solder Alloy Wetting and Spreading, Michael Hosking; Frederick G. Yost

Автор: Andrew E. Perkins; Suresh K. Sitaraman
Название: Solder Joint Reliability Prediction for Multiple Environments
ISBN: 0387793933 ISBN-13(EAN): 9780387793931
Издательство: Springer
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Цена: 18284.00 р.
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Описание: Here is a text that will provide industry engineers, graduate students, academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments.

Автор: King-Ning Tu
Название: Solder Joint Technology
ISBN: 1441922849 ISBN-13(EAN): 9781441922847
Издательство: Springer
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Цена: 26120.00 р.
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Описание: The European Union`s directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders.

Автор: Andrew E. Perkins; Suresh K. Sitaraman
Название: Solder Joint Reliability Prediction for Multiple Environments
ISBN: 1441946349 ISBN-13(EAN): 9781441946348
Издательство: Springer
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Цена: 15672.00 р.
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Описание: Here is a text that will provide industry engineers, graduate students, academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments.

Автор: Tae-Kyu Lee; Thomas R. Bieler; Choong-Un Kim; Hong
Название: Fundamentals of Lead-Free Solder Interconnect Technology
ISBN: 1461492653 ISBN-13(EAN): 9781461492658
Издательство: Springer
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Цена: 18284.00 р.
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Описание: This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys.

Автор: John H. Lau
Название: Solder Joint Reliability
ISBN: 1461367433 ISBN-13(EAN): 9781461367437
Издательство: Springer
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Цена: 36570.00 р.
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Описание: New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them.

Автор: Jennie Hwang
Название: Solder Paste in Electronics Packaging
ISBN: 0442013531 ISBN-13(EAN): 9780442013530
Издательство: Springer
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Цена: 14673.00 р.
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Описание: Aims to provide a working understanding of the latest solder paste principles and applications, enabling engineers to take advantage of current surface mount technology. Coverage includes basic technologies, application techniques, reliability and solutions to specific problems.

Автор: G?nter Grossmann; Christian Zardini
Название: The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
ISBN: 1447158407 ISBN-13(EAN): 9781447158400
Издательство: Springer
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Цена: 18284.00 р.
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Описание: This book brings together contributions from the leading European experts in lead-free soldering. It offers comprehensive coverage of the scientific background and its applications in reliability testing of lead-free solder joints.

Автор: John Hock Lye Pang
Название: Lead Free Solder
ISBN: 1489991166 ISBN-13(EAN): 9781489991164
Издательство: Springer
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Цена: 15672.00 р.
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Описание: Lead-free solders play a crucial role in the electronics industry. Featuring in-depth design and reliability information on lead-free deformation and failure analysis, this book covers a wide range of topics including advanced material mechanics theory.

Автор: Jennie S. Hwang
Название: Solder Paste in Electronics Packaging
ISBN: 940116052X ISBN-13(EAN): 9789401160520
Издательство: Springer
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Цена: 6986.00 р.
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Описание: One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech- nology.

Автор: E.W. Collings
Название: A Sourcebook of Titanium Alloy Superconductivity
ISBN: 1461337054 ISBN-13(EAN): 9781461337058
Издательство: Springer
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Цена: 12157.00 р.
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Описание: In less than two decades the concept of supercon- In every field of science there are one or two ductivity has been transformed from a laboratory individuals whose dedication, combined with an innate curiosity to usable large-scale applications.

Автор: Marc Frappier; Uwe Gl?sser; Sarfraz Khurshid; R?gi
Название: Abstract State Machines, Alloy, B and Z
ISBN: 3642118100 ISBN-13(EAN): 9783642118104
Издательство: Springer
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Цена: 12577.00 р.
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Описание: Constitutes the proceedings of the Second International Conference on Abstract State Machines, B and Z, which took place in Orford, QC, Canada, in February 2010. This book presents the 26 full papers that were reviewed and selected from 60 submissions. It also contains two invited talks and abstracts of 18 short papers.

Автор: R. Saravanan; M. Prema Rani
Название: Metal and Alloy Bonding - An Experimental Analysis
ISBN: 1447161785 ISBN-13(EAN): 9781447161783
Издательство: Springer
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Цена: 13059.00 р.
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Описание: This volume elucidates the structural details of materials using the X-ray diffraction technique. Analyses of the charge density and the local and average structure are given to reveal the structural properties of technologically important materials.