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3D Microelectronic Packaging: From Fundamentals to Applications, Li Yan, Goyal Deepak


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Автор: Li Yan, Goyal Deepak
Название:  3D Microelectronic Packaging: From Fundamentals to Applications
ISBN: 9783319830865
Издательство: Springer
Классификация:





ISBN-10: 3319830864
Обложка/Формат: Paperback
Страницы: 463
Вес: 0.66 кг.
Дата издания: 13.07.2018
Серия: Springer series in advanced microelectronics
Язык: English
Издание: Softcover reprint of
Иллюстрации: 253 illustrations, color; 78 illustrations, black and white; ix, 463 p. 331 illus., 253 illus. in color.
Размер: 23.39 x 15.60 x 2.44 cm
Читательская аудитория: General (us: trade)
Подзаголовок: From fundamentals to applications
Ссылка на Издательство: Link
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Поставляется из: Германии
Описание: This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages.


Force Sensors for Microelectronic Packaging Applications

Автор: J?rg Schwizer; Michael Mayer; Oliver Brand
Название: Force Sensors for Microelectronic Packaging Applications
ISBN: 3642060633 ISBN-13(EAN): 9783642060632
Издательство: Springer
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Цена: 20962.00 р.
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Описание: Sensor Design.- Measurement System.- Characterization.- Applications.- Conclusions and Outlook.

Thermal Design of Liquid Cooled Microelectronic Equipment

Автор: Yeh Lian-Tuu
Название: Thermal Design of Liquid Cooled Microelectronic Equipment
ISBN: 0791861937 ISBN-13(EAN): 9780791861936
Издательство: Mare Nostrum (Eurospan)
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Цена: 20097.00 р.
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Описание: Focuses on providing practical solutions to thermal issues related to high power systems where liquid cooling is required. The book serves as a general thermal design guide for any liquid cooled systems with the main focus on microelectronic equipment that includes digital and/or analogue devices.

Silicon Nitride for Microelectronic Applications

Автор: J. T. Milek
Название: Silicon Nitride for Microelectronic Applications
ISBN: 1461596114 ISBN-13(EAN): 9781461596110
Издательство: Springer
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Цена: 6986.00 р.
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Описание: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Diffusion Mask Applications . . . . . . . . . . . . `" 11 Glass-to-Metal Seals . 23 Passivation Applications . 24 Isolation . 76 Radiation Hardening Applications .

Radio-Frequency Microelectronic Circuits for Telecommunication Applications

Автор: Yannis E. Papananos
Название: Radio-Frequency Microelectronic Circuits for Telecommunication Applications
ISBN: 1441951040 ISBN-13(EAN): 9781441951045
Издательство: Springer
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Цена: 16977.00 р.
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Описание: Radio-Frequency Microelectronic Circuits for Telecommunication Applications covers the design issues of radio-frequency microelectronic circuits for telecommunication applications with emphasis on devices and circuit-level design.

Disordered Semiconductors. Physics and Application, -Cambridge  Scholars Publishing, 2018, 206 p. ISBN 9814774375  переплет  СОЕДИНЕННОЕ КОРОЛЕВСТВО

Автор: Popov A.
Название: Disordered Semiconductors. Physics and Application, -Cambridge Scholars Publishing, 2018, 206 p. ISBN 9814774375 переплет СОЕДИНЕННОЕ КОРОЛЕВСТВО
ISBN: 9814774375 ISBN-13(EAN): 9789814774376
Издательство: Taylor&Francis
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Цена: 21284.00 р.
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Описание: Devices based on disordered semiconductors have wide applications. This textbook connects characteristic features of the atomic and electronic structures of disordered semiconductors and the device design process on the basis of these materials.

Radio-Frequency Microelectronic Circuits for Telecommunication Applications

Автор: Yannis E. Papananos
Название: Radio-Frequency Microelectronic Circuits for Telecommunication Applications
ISBN: 0792386418 ISBN-13(EAN): 9780792386414
Издательство: Springer
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Цена: 20896.00 р.
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Описание: Radio-Frequency Microelectronic Circuits for Telecommunication Applications covers the design issues of radio-frequency microelectronic circuits for telecommunication applications with emphasis on devices and circuit-level design.

Defects in Microelectronic Materials and Devices

Название: Defects in Microelectronic Materials and Devices
ISBN: 0367386399 ISBN-13(EAN): 9780367386399
Издательство: Taylor&Francis
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Цена: 10104.00 р.
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Описание:

Uncover the Defects that Compromise Performance and Reliability
As microelectronics features and devices become smaller and more complex, it is critical that engineers and technologists completely understand how components can be damaged during the increasingly complicated fabrication processes required to produce them.





A comprehensive survey of defects that occur in silicon-based metal-oxide semiconductor field-effect transistor (MOSFET) technologies, this book also discusses flaws in linear bipolar technologies, silicon carbide-based devices, and gallium arsenide materials and devices. These defects can profoundly affect the yield, performance, long-term reliability, and radiation response of microelectronic devices and integrated circuits (ICs). Organizing the material to build understanding of the problems and provide a quick reference for scientists, engineers and technologists, this text reviews yield- and performance-limiting defects and impurities in the device silicon layer, in the gate insulator, and/or at the critical Si/SiO2 interface. It then examines defects that impact production yield and long-term reliability, including:









  • Vacancies, interstitials, and impurities (especially hydrogen)






  • Negative bias temperature instabilities






  • Defects in ultrathin oxides (SiO2 and silicon oxynitride)






Take A Proactive Approach
The authors condense decades of experience and perspectives of noted experimentalists and theorists to characterize defect properties and their impact on microelectronic devices. They identify the defects, offering solutions to avoid them and methods to detect them. These include the use of 3-D imaging, as well as electrical, analytical, computational, spectroscopic, and state-of-the-art microscopic methods. This book is a valuable look at challenges to come from emerging

Microelectronic Materials and Processes

Автор: R.A. Levy
Название: Microelectronic Materials and Processes
ISBN: 0792301544 ISBN-13(EAN): 9780792301547
Издательство: Springer
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Цена: 48774.00 р.
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Описание: Proceedings of the NATO Advanced Study Institute, Il Ciocco, Castelvecchio Pascoli, Italy, June 30-July 11, 1986

Modeling and Simulation for Microelectronic Packaging Assembly - Manufacturing, Reliability and Testing

Автор: Liu
Название: Modeling and Simulation for Microelectronic Packaging Assembly - Manufacturing, Reliability and Testing
ISBN: 0470827807 ISBN-13(EAN): 9780470827802
Издательство: Wiley
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Цена: 17416.00 р.
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Описание: An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability, and testing.

Chemical Perspectives of Microelectronic Materials

Автор: Gross
Название: Chemical Perspectives of Microelectronic Materials
ISBN: 1107410843 ISBN-13(EAN): 9781107410848
Издательство: Cambridge Academ
Цена: 4277.00 р.
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Описание: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Microelectronic Interconnections and Assembly

Автор: G.G. Harman; Pavel Mach
Название: Microelectronic Interconnections and Assembly
ISBN: 9401061599 ISBN-13(EAN): 9789401061599
Издательство: Springer
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Цена: 12157.00 р.
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Описание: Proceedings of the NATO Advanced Research Workshop, Prague, Czech Republic, 18-21 May 1996

Microelectronic circuits

Автор: Sedra, Adel S. (distinguished Professor Emeritus Of Electrical And Computer Engineering, Distinguished Professor Emeritus Of Electrical And Computer E
Название: Microelectronic circuits
ISBN: 0190853506 ISBN-13(EAN): 9780190853501
Издательство: Oxford Academ
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Цена: 20907.00 р.
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Описание: This Courseware package consist out of two publications, Agile Foundation Courseware - English and you are adviced to obtain the publication Agile for responsive organizations - A Pocket Guide. This courseware is for the Agile Foundation certification by the Agile Consortium, and follows the Certify to Inspire philosophy, enabling continuous learning and an adaptive mindset in an Agile world and corporate environment. This courseware has been reviewed by Agile Consortium board members and been accredited by Van Haren Learning Solutions.This Courseware provides a didactic journey in Agile, including teasers, energizers and many little assignments. There is also a reference to free online Agile literature and to the online Agile Foundation demo exam. The main modules of this exam are: o What is Agileo Agile Culture and Leadershipo Scrumo Methods and frameworkso Agile way of workingo Value and Continuous deliveryo Empiricism and improvementModules of this course ware:o What is Agileo Fundamental systems to Agile¢ XP¢ Crystal¢ Scrum¢ DSDMo Philosophizingo Scalingo Kanbano Lean StartupAbout the Agile Foundation CertificationThe Agile Foundation certificate is intended for those who are relatively new to the concept of "Agile" and would like to discover what it exactly entails.The idea behind this exam is that you are serious about delving into the Agility concept and related practices. How you decide to do that will be up to you. You can read books, articles, or blogs. You can also watch videos, listen to podcasts, attend events, or observe others who are working with Agile in practice. Or another possibility is to follow a course in Agile.The Agile Foundation Exam is an independent exam meaning it is not tied to a specific method. If you have the Agile Foundation certificate, you will have demonstrated you understand what Agile means and that you can identify the methods and concepts most commonly used in Agile organizations.


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