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Progress in Adhesion Adhesives, Volume 5, Mittal K. L.


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Автор: Mittal K. L.
Название:  Progress in Adhesion Adhesives, Volume 5
ISBN: 9781119748069
Издательство: Wiley
Классификация:

ISBN-10: 1119748062
Обложка/Формат: Hardcover
Страницы: 480
Вес: 0.45 кг.
Дата издания: 01.09.2020
Язык: English
Размер: 0.99 x 0.99 x 0.99 cm
Читательская аудитория: Professional & vocational
Ссылка на Издательство: Link
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Поставляется из: Англии
Описание:

A solid collection of interdisciplinary review articles on the latest developments in adhesion science and adhesives technology

With the ever-increasing amount of research being published, it is a Herculean task to be fully conversant with the latest research developments in any field, and the arena of adhesion and adhesives is no exception. Thus, topical review articles provide an alternate and very efficient way to stay abreast of the state-of-the-art in many subjects representing the field of adhesion science and adhesives.

Based on the success of the preceding volumes in this series Progress in Adhesion and Adhesives, the present volume comprises 13 review articles published in Volume 7 (2019) of Reviews of Adhesion and Adhesives.The subject of these reviews fall into the following general areas.

1. Adhesively bonded joints
2. Adhesives (including bioadhesives) and their applications
3. Nanocomposite polymer adhesives
4. Polymer surface modification
5. Wettability and surface free energy
6. Adhesion of bacteria.

The topics covered include: Adhesion behavior of plasma treated steel and its alloys; debonding on demand of adhesively bonded joints; bioadhesive polymers; adhesives in the footwear industry; nanocomposite polymer adhesives; ion beam treatment of polymer surfaces to enhance adhesion; natural to artificial non-wettable surfaces and applications; plasma oxidation of polyolefins; wettability and surface free energy characterization of textiles; bioadhesive nanoformulations; laser-assisted tailoring of surface wettability; functionally graded adhesively bonded joints; adhesion of colloids and bacteria to porous media.




Adhesives Technology for Electronic Applications: Materials, Processing, Reliability

Автор: Licari James J., Swanson Dale W.
Название: Adhesives Technology for Electronic Applications: Materials, Processing, Reliability
ISBN: 0128103701 ISBN-13(EAN): 9780128103708
Издательство: Elsevier Science
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Цена: 23244.00 р.
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Описание: Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups. The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this book particularly important for engineers and managers alike.The third edition has been updated throughout and includes new sections on nanomaterials, environmental impacts and new environmentally friendly ‘green’ adhesives. Information about regulations and compliance has been brought fully up-to-date.As well as providing full coverage of standard adhesive types, Licari explores the most recent developments in fields such as: Tamper-proof adhesives for electronic security devices. Bio-compatible adhesives for implantable medical devices. Electrically conductive adhesives to replace toxic tin-lead solders in printed circuit assembly – as required by regulatory regimes, e.g. the EU’s Restriction of Hazardous Substances Directive or RoHS (compliance is required for all products placed on the European market). Nano-fillers in adhesives, used to increase the thermal conductivity of current adhesives for cooling electronic devices.

Adhesion and Adhesives Technology 4e: An Introduction

Автор: Pocius Alphonsus V.
Название: Adhesion and Adhesives Technology 4e: An Introduction
ISBN: 1569908559 ISBN-13(EAN): 9781569908556
Издательство: Mare Nostrum (Eurospan)
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Цена: 27587.00 р.
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Описание: This book describes, in clear understandable language, the three main disciplines of adhesion technology: 1) mechanics of the adhesive bond, 2) chemistry of adhesives, and 3) surface science.Some knowledge of physical and organic chemistry is assumed, but no familiarity with the science of adhesion is required. The emphasis is on understanding adhesion, how surfaces can be prepared and modified, and how adhesives can be formulated to perform a given task. Throughout the book, the author provides a broad view of the field, with a consistent style that leads the reader from one step to the next in gaining an understanding of the science. The 4th edition has additional content covering sustainability (use of natural products in adhesives) and bonding of composite materials. There are also updates and small improvements throughout, together with some new review questions aprovided at the end of the chapters.

Advanced Adhesives in Electronics: Materials, Properties and Applications

Автор: Alam M. O., Bailey C., Bailey Christopher
Название: Advanced Adhesives in Electronics: Materials, Properties and Applications
ISBN: 0081017324 ISBN-13(EAN): 9780081017326
Издательство: Elsevier Science
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Цена: 23580.00 р.
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Описание: Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties.The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics.With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field.

Progress in Adhesion and Adhesives, Volume 3

Автор: Mittal
Название: Progress in Adhesion and Adhesives, Volume 3
ISBN: 1119526299 ISBN-13(EAN): 9781119526292
Издательство: Wiley
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Цена: 31038.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание:

A solid collection of interdisciplinary review articles on the latest developments in adhesion science and adhesives technology

With the ever-increasing amount of research being published, it is a Herculean task to be fully conversant with the latest research developments in any field, and the arena of adhesion and adhesives is no exception. Thus, topical review articles provide an alternate and very efficient way to stay abreast of the state-of-the-art in many subjects representing the field of adhesion science and adhesives.

Based on the success of the preceding volumes in this series Progress in Adhesion and Adhesives), the present volume comprises 12 review articles published in Volume 5 (2017) of Reviews of Adhesion and Adhesives.

The subject of these 12 reviews fall into the following general areas:

1. Nanoparticles in reinforced polymeric composites.

2. Wettability behavior and its modification, including superhydrophobic surfaces.

3. Ways to promote adhesion, including rubber adhesion.

4. Adhesives and adhesive joints

5. Dental adhesion.

The topics covered include: Nanoparticles as interphase modifiers in fiber reinforced polymeric composites; fabrication of micro/nano patterns on polymeric substrates to control wettability behavior; plasma processing of aluminum alloys to promote adhesion; UV-curing of adhesives; functionally graded adhesively bonded joints; adhesion between unvulgarized elastomers; electrowetting for digital microfluidics; control of biofilm at the tooth-restoration bonding interface; easy-to-clean superhydrophobic coatings; cyanoacrylates; promotion of resin-dentin bond longevity in adhesive dentistry; and effects of nanoparticles on nanocomposites Mode I and Mode II fractures.

Adhesion and Adhesives

Автор: Anthony J. Kinloch
Название: Adhesion and Adhesives
ISBN: 904814003X ISBN-13(EAN): 9789048140039
Издательство: Springer
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Цена: 28732.00 р.
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Описание: Over the last decade, or so, the growth in the use of adhesives, especially in ever more technically demanding applications, has been rapid and many major developments in the technology of adhesives have been reported. This growth has also led to attention being focused on somewhat more basic studies of the science of adhesion and adhesives, and in recent years our level of fundamental knowledge concerning the formation and mechanical performance of adhesive joints has increased dramatically. Such studies have, of course, been aided greatly by the development of the tools at the disposal of the investigators. For example, specific surface analytical techniques, such as X-ray photoelectron and secondary-ion mass spectroscopy, and the increasingly sophisticated methods of stress analysis and fracture mechanics have been put to good use in furthering our understanding of the science of adhesion and adhesives. The present book attempts to review the multidisciplined subject of adhesion and adhesives, considering both the science and technology involved in the formation and mechanical performance of adhesive joints. The author would like to thank his friends and colleagues for useful discus- sions and help in the preparation of this book. I am particularly grateful to P. Cawley, J. Comyn, W. A. Lees, A. C. Roulin-Moloney, W. C. Wake, J. G. Williams and R. J. Young who have read and commented on various chapters and P. Farr for preparing the diagrams.

Bio-inspired structured adhesives

Название: Bio-inspired structured adhesives
ISBN: 3319591134 ISBN-13(EAN): 9783319591131
Издательство: Springer
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Цена: 20962.00 р.
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Описание:

This book deals with the adhesion, friction and contact mechanics of living organisms. Further, it presents the remarkable adhesive abilities of the living organisms which inspired the design of novel micro- and nanostructured adhesives that can be used in various applications, such as climbing robots, reusable tapes, and biomedical bandages. The technologies for both the synthesis and construction of bio-inspired adhesive micro- and nanostructures, as well as their performance, are discussed in detail.

Representatives of several animal groups, such as insects, spiders, tree frogs, and lizards, are able to walk on (and therefore attach to) tilted, vertical surfaces, and even ceilings in different environments. Studies have demonstrated that their highly specialized micro- and nanostructures, in combination with particular surface chemistries, are responsible for this impressive and reversible adhesion. These structures can maximize the formation of large effective contact areas on surfaces of varying roughness and chemical composition under different environmental conditions.

Selection of Engineering Materials and Adhesives

Автор: Fisher, P.E.
Название: Selection of Engineering Materials and Adhesives
ISBN: 036739300X ISBN-13(EAN): 9780367393007
Издательство: Taylor&Francis
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Цена: 10104.00 р.
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Описание:

Insufficient knowledge, time limitations, and budget constraints often result in poor material selection and implementation, which can lead to uncertain performance and premature failure of mechanical and electro-mechanical products. Selection of Engineering Materials and Adhesives is a professional guide to choosing the most appropriate materials and adhesives for product development applications from the onset.

This text emphasizes material properties and classifications, fabrication and processing considerations, performance objectives, and selection based on specific application requirements, such as frequency of use (duty cycle) and operating environment. Each chapter focuses on a particular material family, covering ferrous and non-ferrous metals, including steels, cast-iron, aluminum, and titanium, as well as plastics such as PVC, acrylics, and nylons. Unique to this book on material selection, the final chapter discusses critical aspects of adhesives, including cure methods and joint configurations.

Selection of Engineering Materials and Adhesives presents materials that are most often used for selection processes and applications in product development. This book is an ideal text for senior level undergraduate or graduate courses in mechanical engineering and materials science as well as recent graduates or managers who are tasked with the daunting job of selecting a material for a new application or justifying a long-used material in a specific application. It embodies the author's own experience and lectures on this subject, taught at UCLA Extension, and provides students as well as practicing engineers the tools to systematically select the most appropriate materials and adhesives for their design work.


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