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Handbook of 3D Integration - Vol. 4: Design, Test and Thermal Management, Franzon


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Автор: Franzon
Название:  Handbook of 3D Integration - Vol. 4: Design, Test and Thermal Management
ISBN: 9783527338559
Издательство: Wiley
Классификация:

ISBN-10: 3527338551
Обложка/Формат: Hardback
Страницы: 488
Вес: 1.09 кг.
Дата издания: 2019
Язык: English
Размер: 178 x 252 x 28
Читательская аудитория: Professional & vocational
Основная тема: Nanomaterials
Подзаголовок: Design, test, and thermal management
Ссылка на Издательство: Link
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Поставляется из: Англии


Handbook of Benzoxazine Resins

Автор: Ishida, Hatsuo
Название: Handbook of Benzoxazine Resins
ISBN: 044463844X ISBN-13(EAN): 9780444638441
Издательство: Elsevier Science
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Цена: 37897.00 р.
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Описание: This handbook provides a wide overview of the field, fundamental understanding of the synthetic methods and structure/property correlation, as well as studies related to applications in a wide range of subjects. The handbook also provides 1H and 13C NMR spectra, FTIR spectra, DSC and TGA thermograms to aid in research activities. Additional tables on key NMR and FTIR frequencies unique to benzoxazine, heat of polymerization, Tg, and char yield will greatly aid in thechoice of proper benzoxazine for aspecific application.

21st Century Nanoscience – A Handbook: Nanophotonics, Nanoelectronics, and Nanoplasmonics (Volume Six)

Автор: Klaus D. Sattler
Название: 21st Century Nanoscience – A Handbook: Nanophotonics, Nanoelectronics, and Nanoplasmonics (Volume Six)
ISBN: 0815356412 ISBN-13(EAN): 9780815356417
Издательство: Taylor&Francis
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Цена: 27562.00 р.
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Описание: This up-to-date reference is the most comprehensive summary of the field of nanoscience and its applications. It begins with fundamental properties at the nanoscale and then goes well beyond into the practical aspects of the design, synthesis, and use of nanomaterials in various industries.

The Core Test Wrapper Handbook

Автор: Francisco da Silva; Teresa McLaurin; Tom Waayers
Название: The Core Test Wrapper Handbook
ISBN: 148998769X ISBN-13(EAN): 9781489987693
Издательство: Springer
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Цена: 20896.00 р.
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Описание: The Core Test Wrapper Handbook: Rationale and Application of IEEE Std. This book focuses on practical design considerations inherent to the application of IEEE Std. The authors provide background information about some of the choices and decisions made throughout the design of IEEE Std.

Three-Dimensional Integration of Semiconductors

Автор: Kazuo Kondo; Morihiro Kada; Kenji Takahashi
Название: Three-Dimensional Integration of Semiconductors
ISBN: 3319186744 ISBN-13(EAN): 9783319186740
Издательство: Springer
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Цена: 20896.00 р.
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Описание: This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations.

Microfluidic Very Large Scale Integration (VLSI)

Автор: Paul Pop; Wajid Hassan Minhass; Jan Madsen
Название: Microfluidic Very Large Scale Integration (VLSI)
ISBN: 3319295977 ISBN-13(EAN): 9783319295978
Издательство: Springer
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Цена: 16070.00 р.
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Описание: Coverage includes a topology graph-based model for the biochip architecture, and a sequencing graph to model for biochemical application, showing how the application model can be obtained from the protocol language.

Offshore Platform Integration and Floatover Technology

Автор: Gengshen Liu; Huajun Li
Название: Offshore Platform Integration and Floatover Technology
ISBN: 9811036160 ISBN-13(EAN): 9789811036163
Издательство: Springer
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Цена: 22359.00 р.
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Описание: Offshore Platform Topsides and Substructure.- Platform Integration and Stationing.- Floatover Technology.- Hideck Floatover Technology.- Unideck & Smartleg.- Catamaran Floatover.- Project Management & Planning.- Engineering Analysis and Model Test.- Operation Execution.- Evolution and New Source of Motivation.

More-than-Moore 2.5D and 3D SiP Integration

Автор: Riko Radojcic
Название: More-than-Moore 2.5D and 3D SiP Integration
ISBN: 3319525476 ISBN-13(EAN): 9783319525471
Издательство: Springer
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Цена: 15372.00 р.
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Описание: This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore`s Law regime.

Computer-Aided Design of Microfluidic Very Large Scale Integration (mVLSI) Biochips

Автор: Kai Hu; Krishnendu Chakrabarty; Tsung-Yi Ho
Название: Computer-Aided Design of Microfluidic Very Large Scale Integration (mVLSI) Biochips
ISBN: 3319562541 ISBN-13(EAN): 9783319562544
Издательство: Springer
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Цена: 16769.00 р.
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Описание: The technical contributions presented in this book will not only shorten the product development cycle, but also accelerate the adoption and further development of modern flow-based microfluidic biochips, by facilitating the full exploitation of design complexities that are possible with current fabrication techniques.

Handbook of Thermal Process Modeling Steels

Автор: Gur, Cemil Hakan
Название: Handbook of Thermal Process Modeling Steels
ISBN: 0849350190 ISBN-13(EAN): 9780849350191
Издательство: Taylor&Francis
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Цена: 36749.00 р.
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Handbook of 3d Integration V1 and 2

Автор: Garrou Philip
Название: Handbook of 3d Integration V1 and 2
ISBN: 3527332650 ISBN-13(EAN): 9783527332656
Издательство: Wiley
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Цена: 23118.00 р.
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Описание: With contributions from key players in both academia and industry, this first encompassing treatise of this important field puts the known physical limitations for classic 2D electronics into perspective with the need for further electronics developments and market necessities.

Handbook of 3D Integration V 3

Автор: Garrou P
Название: Handbook of 3D Integration V 3
ISBN: 3527334661 ISBN-13(EAN): 9783527334667
Издательство: Wiley
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Цена: 22643.00 р.
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Описание: Edited by key figures in the field and written by top authors from academia and industry, this book covers the intricate details of 3D process technology from both a technological and a materials science perspective.

Handbook of Thermal Science and Engineering

Автор: Francis A. Kulacki
Название: Handbook of Thermal Science and Engineering
ISBN: 3319266950 ISBN-13(EAN): 9783319266954
Издательство: Springer
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Цена: 167705.00 р.
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Описание: This Handbook provides researchers, faculty, design engineers in industrial R&D, and practicing engineers in the field concise treatments of advanced and more-recently established topics in thermal science and engineering, with an important emphasis on micro- and nanosystems, not covered in earlier references on applied thermal science, heat transfer or relevant aspects of mechanical/chemical engineering. Major sections address new developments in heat transfer, transport phenomena, single- and multiphase flows with energy transfer, thermal-bioengineering, thermal radiation, combined mode heat transfer, coupled heat and mass transfer, and energy systems. Energy transport at the macro-scale and micro/nano-scales is also included. The internationally recognized team of authors adopt a consistent and systematic approach and writing style, including ample cross reference among topics, offering readers a user-friendly knowledgebase greater than the sum of its parts, perfect for frequent consultation. The Handbook of Thermal Science and Engineering is ideal for academic and professional readers in the traditional and emerging areas of mechanical engineering, chemical engineering, aerospace engineering, bioengineering, electronics fabrication, energy, and manufacturing concerned with the influence thermal phenomena.


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