Контакты/Проезд  Доставка и Оплата Помощь/Возврат
История
  +7(495) 980-12-10
  пн-пт: 10-18 сб,вс: 11-18
  shop@logobook.ru
   
    Поиск книг                    Поиск по списку ISBN Расширенный поиск    
Найти
  Зарубежные издательства Российские издательства  
Авторы | Каталог книг | Издательства | Новинки | Учебная литература | Акции | Хиты | |
 

Reliability of MEMS - Testing of Materials and Devices, Tabata


Варианты приобретения
Цена: 12822.00р.
Кол-во:
 о цене
Наличие: Отсутствует. Возможна поставка под заказ.

При оформлении заказа до: 2025-08-04
Ориентировочная дата поставки: Август-начало Сентября
При условии наличия книги у поставщика.

Добавить в корзину
в Мои желания

Автор: Tabata
Название:  Reliability of MEMS - Testing of Materials and Devices
ISBN: 9783527335015
Издательство: Wiley
Классификация:

ISBN-10: 3527335013
Обложка/Формат: Paperback
Страницы: 324
Вес: 0.65 кг.
Дата издания: 2013
Язык: English
Размер: 241 x 172 x 16
Читательская аудитория: Professional & vocational
Основная тема: MEMS and Nanoelectronics
Подзаголовок: Testing of materials and devices
Ссылка на Издательство: Link
Рейтинг:
Поставляется из: Англии


The Art of Electronics

Автор: Horowitz
Название: The Art of Electronics
ISBN: 0521809266 ISBN-13(EAN): 9780521809269
Издательство: Cambridge Academ
Рейтинг:
Цена: 13622.00 р.
Наличие на складе: Заказано в издательстве.

Описание: At long last, here is the thoroughly revised and updated, and long-anticipated, third edition of the hugely successful The Art of Electronics. Widely accepted as the best single authoritative text on electronic circuit design, it will be an indispensable reference and the gold standard for anyone in the field.

Автор: Horowitz Paul
Название: The art of electronics The x Chapters
ISBN: 1108499945 ISBN-13(EAN): 9781108499941
Издательство: Cambridge Academ
Рейтинг:
Цена: 8870.00 р.
Наличие на складе: Заказано в издательстве.

Описание: The x-Chapters is the missing pieces of The Art of Electronics, to be used either as its complement, or as a direct route to exploring some of the most exciting and oft-overlooked topics in advanced electronic engineering. Students, researchers and practitioners will find here techniques and circuits that are unavailable elsewhere.

Bioelectronics and Medical Devices

Автор: Pal Kunal
Название: Bioelectronics and Medical Devices
ISBN: 0081024207 ISBN-13(EAN): 9780081024201
Издательство: Elsevier Science
Рейтинг:
Цена: 31834.00 р. 45477.00 -30%
Наличие на складе: Есть (1 шт.)
Описание:

Bioelectronics and Medical Devices: From Materials to Devices-Fabrication, Applications and Reliability reviews the latest research on electronic devices used in the healthcare sector, from materials, to applications, including biosensors, rehabilitation devices, drug delivery devices, and devices based on wireless technology. This information is presented from the unique interdisciplinary perspective of the editors and contributors, all with materials science, biomedical engineering, physics, and chemistry backgrounds. Each applicable chapter includes a discussion of these devices, from materials and fabrication, to reliability and technology applications. Case studies, future research directions and recommendations for additional readings are also included.

The book addresses hot topics, such as the latest, state-of the-art biosensing devices that have the ability for early detection of life-threatening diseases, such as tuberculosis, HIV and cancer. It covers rehabilitation devices and advancements, such as the devices that could be utilized by advanced-stage ALS patients to improve their interactions with the environment. In addition, electronic controlled delivery systems are reviewed, including those that are based on artificial intelligences.

  • Presents the latest topics, including MEMS-based fabrication of biomedical sensors, Internet of Things, certification of medical and drug delivery devices, and electrical safety considerations
  • Presents the interdisciplinary perspective of materials scientists, biomedical engineers, physicists and chemists on biomedical electronic devices
  • Features systematic coverage in each chapter, including recent advancements in the field, case studies, future research directions, and recommendations for additional readings
Self-Cleaning of Surfaces and Water Droplet Mobility

Автор: Yilbas, Bekir
Название: Self-Cleaning of Surfaces and Water Droplet Mobility
ISBN: 0128147768 ISBN-13(EAN): 9780128147764
Издательство: Elsevier Science
Рейтинг:
Цена: 36213.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание:

Self-Cleaning of Surfaces and Water Droplet Mobility deals with the self-cleaning of hydrophobic surfaces. Chapters cover the basics of wetting states of fluids and surface characteristics in terms of texture topology and free energy. The self-cleaning aspects of surfaces, such as various synthesizing and fabrication processes are then introduced and discussed, along with environmental dust properties, including elemental compositions, particle sizes and shapes, and their chemo-mechanics characteristics. In addition, mud formation in humid air, as well as ambient and dry mud adhesion on optically transparent surfaces is explored, as is water droplet dynamics on hydrophilic and hydrophobic surfaces, amongst other topics.

The book fills the gap between the physical fundamentals of surface energy and texture characteristics for practical applications of surface cleaning and provides a basic understanding of the self-cleaning of surfaces that will be idea for academics, researchers and students.

  • Showcases the fundamental aspects of the self-cleaning of surfaces
  • Includes practical applications in energy and other sectors
  • Contains a review of the characterization of environmental dust on hydrophilic and hydrophobic surfaces
  • Discusses the fabrication and optimization of surfaces towards self-cleaning
  • Presents practical applications of the self-cleaning of surfaces via water droplet mobility
Micro and Nano Mechanical Testing of Materials and Devices

Автор: Fuqian Yang; James C.M. Li
Название: Micro and Nano Mechanical Testing of Materials and Devices
ISBN: 1441946209 ISBN-13(EAN): 9781441946201
Издательство: Springer
Рейтинг:
Цена: 26120.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: This volume presents the latest advances in the techniques of mechanical testing on the micro- and nanoscales which are necessary for characterizing the mechanical properties of low-dimensional materials and structures.

Silver Metallization

Автор: Daniel Adams; Terry L. Alford; James W. Mayer
Название: Silver Metallization
ISBN: 1849967059 ISBN-13(EAN): 9781849967051
Издательство: Springer
Рейтинг:
Цена: 16977.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: Anyone involved in circuit technology will find this an absolute must-read. It`s the first book to discuss the current understanding of silver metallization and its potential as a future interconnect material for integrated circuit technology.

Integrated Reliability: Condition Monitoring and Maintenance of Equipment

Автор: John Osarenren
Название: Integrated Reliability: Condition Monitoring and Maintenance of Equipment
ISBN: 1482249405 ISBN-13(EAN): 9781482249408
Издательство: Taylor&Francis
Рейтинг:
Цена: 26796.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание:

Consider a Viable and Cost-Effective Platform for the Industries of the Future (IOF)

Benefit from improved safety, performance, and product deliveries to your customers. Achieve a higher rate of equipment availability, performance, product quality, and reliability. Integrated Reliability: Condition Monitoring and Maintenance of Equipment incorporates reliable engineering and mathematical modeling to help you move toward sustainable development in reliability condition monitoring and maintenance. This text introduces a cost-effective integrated reliability growth monitor, integrated reliability degradation monitor, technological inheritance coefficient sensors, and a maintenance tool that supplies real-time information for predicting and preventing potential failures of manufacturing processes and equipment.

The author highlights five key elements that are essential to any improvement program: improving overall equipment and part effectiveness, quality, and reliability; improving process performance with maintenance efficiency and effectiveness; training all employees involved; including operators in the daily maintenance and upkeep of the equipment; and implementing early equipment management and maintenance prevention design. He offers a sustainable solution with integrated reliability condition monitoring and maintenance of manufacturing processes, parts, and equipment in the IOFs with a technological inheritance model-based program.

This book contains 15 chapters that include details on:

  • Improving the material-part-equipment system life cycle, reliability conditions, and manufacturing process productivity for wear, corrosion, and temperature resistance applications
  • Maximizing the component and system reliability growth of parts and equipment
  • Minimizing reliability degradation within the framework of a condition-based maintenance
  • Analyzing the reliability degradation, wear, and other competing failure modes of nickel-based hard alloy-coated part mating surface with a technological inheritance model-based program
  • Introducing a cost-effective integrated reliability monitor and maintenance strategy with a technological inheritance model-based software program

Integrated Reliability: Condition Monitoring and Maintenance of Equipment addresses potential failures from an asset manager, maintenance user, and operator's standpoint, and highlights the solutions to common failures and reliability problems for equipment in the IOFs.

Adhesives Technology for Electronic Applications: Materials, Processing, Reliability

Автор: Licari James J., Swanson Dale W.
Название: Adhesives Technology for Electronic Applications: Materials, Processing, Reliability
ISBN: 0128103701 ISBN-13(EAN): 9780128103708
Издательство: Elsevier Science
Рейтинг:
Цена: 23244.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups. The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this book particularly important for engineers and managers alike.The third edition has been updated throughout and includes new sections on nanomaterials, environmental impacts and new environmentally friendly ‘green’ adhesives. Information about regulations and compliance has been brought fully up-to-date.As well as providing full coverage of standard adhesive types, Licari explores the most recent developments in fields such as: Tamper-proof adhesives for electronic security devices. Bio-compatible adhesives for implantable medical devices. Electrically conductive adhesives to replace toxic tin-lead solders in printed circuit assembly – as required by regulatory regimes, e.g. the EU’s Restriction of Hazardous Substances Directive or RoHS (compliance is required for all products placed on the European market). Nano-fillers in adhesives, used to increase the thermal conductivity of current adhesives for cooling electronic devices.

Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics

Автор: Lin
Название: Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics
ISBN: 1107408717 ISBN-13(EAN): 9781107408715
Издательство: Cambridge Academ
Цена: 4277.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics.

CMOS Gate-Stack Scaling — Materials, Interfaces and Reliability Implications

Автор: Demkov
Название: CMOS Gate-Stack Scaling — Materials, Interfaces and Reliability Implications
ISBN: 1107408326 ISBN-13(EAN): 9781107408326
Издательство: Cambridge Academ
Цена: 4118.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics

Автор: Oehrlein
Название: Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics
ISBN: 110741315X ISBN-13(EAN): 9781107413153
Издательство: Cambridge Academ
Цена: 4277.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Materials Science of Microelectromechanical Systems (MEMS) Devices II

Автор: de Boer
Название: Materials Science of Microelectromechanical Systems (MEMS) Devices II
ISBN: 1107413214 ISBN-13(EAN): 9781107413214
Издательство: Cambridge Academ
Цена: 4277.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.


ООО "Логосфера " Тел:+7(495) 980-12-10 www.logobook.ru
   В Контакте     В Контакте Мед  Мобильная версия