Food Packaging Materials, Luciano Piergiovanni; Sara Limbo

Автор: Daniel Lu; C.P. Wong
Название: Materials for Advanced Packaging
ISBN: 3319450972 ISBN-13(EAN): 9783319450971
Издательство: Springer
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Цена: 32142.00 р.
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Описание: This second edition continues to be the most comprehensive review on the developments in advanced packaging technologies. Experts in the field discuss established techniques, as well as emerging technologies, to provide readers with the most up-to-date developments in advanced packaging. Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field. New chapters have also been added on fast growing and emerging applications such as flexible and printed electronics, materials solutions to enable next generation thinner/lighter/more functional mobile devices, and functional coating for electronic devices such as anti-fingerprint coating, anti-scratch coating, and more. This book is ideal for professionals in semiconductor, digital health, and bio-medical areas as well as graduate students studying materials science and engineering.

Автор: Xingcun Colin Tong Ph.D
Название: Advanced Materials for Thermal Management of Electronic Packaging
ISBN: 1461427924 ISBN-13(EAN): 9781461427926
Издательство: Springer
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Цена: 23508.00 р.
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Описание: This book offers a comprehensive approach to advanced thermal management in electronic packaging, including the fundamentals of heat transfer, component design guidelines, materials selection, cooling, characterization, processing and manufacturing and more.