Handbook of Silicon Wafer Cleaning Technology, Reinhardt, Karen
Старое издание
Автор: Reinhardt, Karen Название: Handbook Of Silicon Wafer Cleaning Technology ISBN: 0815515545 ISBN-13(EAN): 9780815515548 Издательство: Elsevier Science Цена: 36213.00 р. Наличие на складе: Поставка под заказ. Описание: Intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits, this handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue, and photoresist from wafer surfaces. It covers both the process and the equipment.
Автор: Kiyotaka Wasa Название: Handbook of Sputter Deposition Technology, ISBN: 1437734839 ISBN-13(EAN): 9781437734836 Издательство: Elsevier Science Рейтинг: Цена: 21054.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Faetures a team of contributing authors with backgrounds specializing in the various new applications of sputtering technology. This book introduces the fundamentals of thin films and sputtering deposition, explores the theory and practices of this field, and also covers new technology such as nano-functional materials and MEMS.
Описание: In this series Rajiv Kohli and Kash Mittal have brought together the work of experts from different industry sectors and backgrounds to provide a state-of-the-art survey and best-practice guidance for scientists and engineers engaged in surface cleaning or handling the consequences of surface contamination. The expert contributions in this volume cover important fundamental aspects of surface contamination that are key to understanding the behavior of specific types of contaminants. This understanding is essential to develop preventative and mitigation methods for contamination control. The coverage complements the treatment of surface contamination in vol.1, Fundamental and Applied Aspects. This volume covers: Sources and Generation of Particles; Manipulation Techniques for Particles on Surfaces; Particle Deposition and Rebound; Particle Behavior in Liquid Systems; Biological and Metallic Contamination; and includes a comprehensive list of current standards and resources.
Автор: Chuan Seng Tan; Ronald J. Gutmann; L. Rafael Reif Название: Wafer Level 3-D ICs Process Technology ISBN: 1441945628 ISBN-13(EAN): 9781441945624 Издательство: Springer Рейтинг: Цена: 26120.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology.
Автор: Shichun Qu; Yong Liu Название: Wafer-Level Chip-Scale Packaging ISBN: 149391555X ISBN-13(EAN): 9781493915552 Издательство: Springer Рейтинг: Цена: 19564.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling.
Название: Mm-Wave Silicon Technology: 60 GHz and Beyond ISBN: 0387765581 ISBN-13(EAN): 9780387765587 Издательство: Springer Рейтинг: Цена: 30745.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book compiles and presents the research results from the past five years in mm-wave Silicon circuits. This area has received a great deal of interest from the research community including several university and research groups. The book covers device modeling, circuit building blocks, phased array systems, and antennas and packaging.
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