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Handbook of Silicon Wafer Cleaning Technology, Reinhardt, Karen


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Автор: Reinhardt, Karen   (Карен Рейнхардт)
Название:  Handbook of Silicon Wafer Cleaning Technology
Перевод названия: Карен Рейнхардт: Справочник по технологии очистки кремниевых пластин
ISBN: 9780323510844
Издательство: Elsevier Science
Классификация:
ISBN-10: 0323510841
Обложка/Формат: Paperback
Страницы: 760
Вес: 1.14 кг.
Дата издания: 13.10.2017
Язык: English
Издание: 3 ed
Размер: 152 x 229 x 41
Основная тема: Electrical Engineering
Ссылка на Издательство: Link
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Поставляется из: Европейский союз
Описание:

Handbook of Silicon Wafer Cleaning Technology, Third Edition, provides an in-depth discussion of cleaning, etching and surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet and plasma processing are reviewed, including surface and colloidal aspects. This revised edition includes the developments of the last ten years to accommodate a continually involving industry, addressing new technologies and materials, such as germanium and III-V compound semiconductors, and reviewing the various techniques and methods for cleaning and surface conditioning. Chapters include numerous examples of cleaning technique and their results.

The book helps the reader understand the process they are using for their cleaning application and why the selected process works. For example, discussion of the mechanism and physics of contamination, metal, particle and organic includes information on particle removal, metal passivation, hydrogen-terminated silicon and other processes that engineers experience in their working environment. In addition, the handbook assists the reader in understanding analytical methods for evaluating contamination.

The book is arranged in an order that segments the various cleaning techniques, aqueous and dry processing. Sections include theory, chemistry and physics first, then go into detail for the various methods of cleaning, specifically particle removal and metal removal, amongst others.

  • Focuses on cleaning techniques including wet, plasma and other surface conditioning techniques used to manufacture integrated circuits
  • Reliable reference for anyone that manufactures integrated circuits or supplies the semiconductor and microelectronics industries
  • Covers processes and equipment, as well as new materials and changes required for the surface conditioning process



      Старое издание
Handbook Of Silicon Wafer Cleaning Technology

Автор: Reinhardt, Karen
Название: Handbook Of Silicon Wafer Cleaning Technology
ISBN: 0815515545 ISBN-13(EAN): 9780815515548
Издательство: Elsevier Science
Цена: 36213.00 р.
Наличие на складе: Поставка под заказ.
Описание: Intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits, this handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue, and photoresist from wafer surfaces. It covers both the process and the equipment.


Handbook of Sputter Deposition Technology,

Автор: Kiyotaka Wasa
Название: Handbook of Sputter Deposition Technology,
ISBN: 1437734839 ISBN-13(EAN): 9781437734836
Издательство: Elsevier Science
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Цена: 21054.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: Faetures a team of contributing authors with backgrounds specializing in the various new applications of sputtering technology. This book introduces the fundamentals of thin films and sputtering deposition, explores the theory and practices of this field, and also covers new technology such as nano-functional materials and MEMS.

Developments in Surface Contamination and Cleaning, Volume 4: Detection, Characterization, and Analysis of Contaminants

Автор: Kohli Rajiv, Mittal Kashmiri L.
Название: Developments in Surface Contamination and Cleaning, Volume 4: Detection, Characterization, and Analysis of Contaminants
ISBN: 012810368X ISBN-13(EAN): 9780128103685
Издательство: Elsevier Science
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Цена: 29476.00 р.
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Описание: In this series Rajiv Kohli and Kash Mittal have brought together the work of experts from different industry sectors and backgrounds to provide a state-of-the-art survey and best-practice guidance for scientists and engineers engaged in surface cleaning or handling the consequences of surface contamination. The expert contributions in this volume cover important fundamental aspects of surface contamination that are key to understanding the behavior of specific types of contaminants. This understanding is essential to develop preventative and mitigation methods for contamination control. The coverage complements the treatment of surface contamination in vol.1, Fundamental and Applied Aspects. This volume covers: Sources and Generation of Particles; Manipulation Techniques for Particles on Surfaces; Particle Deposition and Rebound; Particle Behavior in Liquid Systems; Biological and Metallic Contamination; and includes a comprehensive list of current standards and resources.

Wafer Level 3-D ICs Process Technology

Автор: Chuan Seng Tan; Ronald J. Gutmann; L. Rafael Reif
Название: Wafer Level 3-D ICs Process Technology
ISBN: 1441945628 ISBN-13(EAN): 9781441945624
Издательство: Springer
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Цена: 26120.00 р.
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Описание: This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology.

Wafer-Level Chip-Scale Packaging

Автор: Shichun Qu; Yong Liu
Название: Wafer-Level Chip-Scale Packaging
ISBN: 149391555X ISBN-13(EAN): 9781493915552
Издательство: Springer
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Цена: 19564.00 р.
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Описание: Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling.

Mm-Wave Silicon Technology: 60 GHz and Beyond

Название: Mm-Wave Silicon Technology: 60 GHz and Beyond
ISBN: 0387765581 ISBN-13(EAN): 9780387765587
Издательство: Springer
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Цена: 30745.00 р.
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Описание: This book compiles and presents the research results from the past five years in mm-wave Silicon circuits. This area has received a great deal of interest from the research community including several university and research groups. The book covers device modeling, circuit building blocks, phased array systems, and antennas and packaging.


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