Compact Models and Performance Investigations for Subthreshold Interconnects, Rohit Dhiman; Rajeevan Chandel
Автор: B.K. Kaushik; V. Ramesh Kumar; Amalendu Patnaik Название: Crosstalk in Modern On-Chip Interconnects ISBN: 9811007993 ISBN-13(EAN): 9789811007996 Издательство: Springer Рейтинг: Цена: 9141.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The book provides accurate FDTDmodels for on-chip interconnects, covering most recent advancements inmaterials and design. It presents thestructure, properties, and characteristics of graphene based on-chipinterconnects and the FDTD modeling of Cu based on-chip interconnects.
Описание: The book provides a detailed analysis of issues related to sub-threshold interconnect performance from the perspective of analytical approach and design techniques.
Автор: Tekin, Tolga Название: Optical Interconnects for Data Centers ISBN: 0081005121 ISBN-13(EAN): 9780081005125 Издательство: Elsevier Science Рейтинг: Цена: 31686.00 р. Наличие на складе: Поставка под заказ.
Описание: Current data centre networks, based on electronic packet switches, are experiencing an exponential increase in network traffic due to developments such as cloud computing. Optical interconnects have emerged as a promising alternative offering high throughput and reduced power consumption. Optical Interconnects for Data Centers reviews key developments in the use of optical interconnects in data centres and the current state of the art in transforming this technology into a reality. The book discusses developments in optical materials and components (such as single and multi-mode waveguides), circuit boards and ways the technology can be deployed in data centres. . Optical Interconnects for Data Centers is a key reference text for electronics designers, optical engineers, communications engineers and R&D managers working in the communications and electronics industries as well as postgraduate researchers.
Автор: Todri-Sanial Название: Carbon Nanotubes for Interconnects ISBN: 3319297449 ISBN-13(EAN): 9783319297446 Издательство: Springer Рейтинг: Цена: 16070.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.
Автор: Michel S. Nakhla; Q.J. Zhang Название: Modeling and Simulation of High Speed VLSI Interconnects ISBN: 0792394410 ISBN-13(EAN): 9780792394419 Издательство: Springer Рейтинг: Цена: 18167.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Modeling and Simulation of High Speed VLSI Interconnects brings together in one place important contributions and state-of-the-art research results in this rapidly advancing area.
Автор: Ethiopia Enideg Nigussie Название: Variation Tolerant On-Chip Interconnects ISBN: 1489990860 ISBN-13(EAN): 9781489990860 Издательство: Springer Рейтинг: Цена: 18167.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book presents design techniques, analysis and implementation of high performance and power efficient, variation tolerant on-chip interconnects. It is for anyone concerned with the design of next generation, high-performance electronics systems.
Автор: Alex Mutig Название: High Speed VCSELs for Optical Interconnects ISBN: 3642266797 ISBN-13(EAN): 9783642266799 Издательство: Springer Рейтинг: Цена: 13974.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Systematically surveying the state of the art in vertical cavity surface emitting lasers, this thesis examines their present limitations as well as offering a catalogue of solutions through modeling, fabricating and testing at commercially crucial wavelengths.
Описание: This book brings together contributions from the leading European experts in lead-free soldering. It offers comprehensive coverage of the scientific background and its applications in reliability testing of lead-free solder joints.
Автор: Christoforos Kachris; Keren Bergman; Ioannis Tomko Название: Optical Interconnects for Future Data Center Networks ISBN: 1493943758 ISBN-13(EAN): 9781493943753 Издательство: Springer Рейтинг: Цена: 15672.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This volume shows how optical interconnects can be used to provide high-bandwidth, energy-efficient interconnects for data centers of the future characterized by increased bandwidth requirements, presenting the latest and most promising technologies.
Автор: Yosi Shacham-Diamand; Tetsuya Osaka; Madhav Datta; Название: Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications ISBN: 1461497442 ISBN-13(EAN): 9781461497448 Издательство: Springer Рейтинг: Цена: 32004.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Electromechanical processes for Ultra-large-Scale Integration technology for Integrated Circuits applications is a new frontier in electrochemistry and science. This book details copper based interconnect technology for ULSI technology to ICs application.
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