Описание: Collects the papers presented during NATO Advanced Research Workshop `Science and technology of Semiconductor on Insulator (SOI) structures and devices operating in a harsh environment` held in Kiev 26-30 April 2004. This volume contains both reviews from invited speakers and selected papers presenting innovations in SOI materials and devices.
Автор: S. Furukawa Название: Silicon-on-Insulator ISBN: 9401088462 ISBN-13(EAN): 9789401088466 Издательство: Springer Рейтинг: Цена: 12157.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This volume contains papers presented during the US-Japan seminar on "Solid Phase Epitaxy and Interface Kinetics" held in Oiso, Japan, June 20-24, 1983.
Автор: J.-P. Colinge Название: Silicon-on-Insulator Technology ISBN: 0792391500 ISBN-13(EAN): 9780792391500 Издательство: Springer Рейтинг: Цена: 23757.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Explains the principles and the physics of SOI materials fabrication and characterization, SOI processing SOI MOSFET device physics, and the use of SOI material in novel device design. The performances of SOI circuits for VLSI/ULSI and for niche applications are also described.
Автор: J.-P. Colinge Название: Silicon-on-Insulator Technology: Materials to VLSI ISBN: 1461347955 ISBN-13(EAN): 9781461347958 Издательство: Springer Рейтинг: Цена: 23508.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Silicon-on-Insulator Technology: Materials to VLSI, Third Edition, retraces the evolution of SOI materials, devices and circuits over a period of roughly twenty years.
Автор: J.-P. Colinge Название: Silicon-on-Insulator Technology ISBN: 079238007X ISBN-13(EAN): 9780792380078 Издательство: Springer Рейтинг: Цена: 23757.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Describes the different facets of Silicon-on-Insulator technology. This title presents a review of SOI materials, devices and circuits. It discusses SOI fabrication and characterization techniques, SOI device processing, the physics of the SOI MOSFET as well as that of SOI other devices, and the performances of SOI circuits.
Описание: Collects the papers presented during NATO Advanced Research Workshop "Science and technology of Semiconductor on Insulator (SOI) structures and devices operating in a harsh environment". Presenting various innovations in SOI materials and devices, the papers focus on the reliability of SOI structures operating under harsh conditions.
Автор: J.-P. Colinge Название: Silicon-on-Insulator Technology ISBN: 1475721234 ISBN-13(EAN): 9781475721232 Издательство: Springer Рейтинг: Цена: 13974.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Автор: Alexei Nazarov; J.-P. Colinge; Francis Balestra; J Название: Semiconductor-On-Insulator Materials for Nanoelectronics Applications ISBN: 3642267084 ISBN-13(EAN): 9783642267086 Издательство: Springer Рейтинг: Цена: 26120.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Devoted to the evolving field of modern nanoelectronics, this volume presents the physics and technology of nanoelectronic devices built on semiconductor-on-insulator (SemOI) systems. Topics include new semiconductor-on-insulator materials, physics of modern SemOI devices, and MEMS on SOI.
Автор: R.A. Levy Название: Novel Silicon Based Technologies ISBN: 9401055173 ISBN-13(EAN): 9789401055178 Издательство: Springer Рейтинг: Цена: 6986.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Proceedings of the NATO Advanced Study Institute, Boca Raton, Florida, U.S.A., July 17-28, 1989
The Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on silicon as the most important starting material used in MEMS.
The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS and encapsulation of MEMS components.
Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs.
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