Описание: Fulfilling emission limits and immunity requirements, and handling complex cases of incompatibility demands understanding of physical interrelations and of Maxwell`s theory. Based on the authors` experiences, the textbook helps solve such interferential cases.
Описание: This text describes in depth the theory and practice of designing massively parallel analog signal processing systems. Techniques are described which overcome the device and transistor mismatches which limit performance of the system.
Автор: Vladim?r Mar?k; Luis M. Camarinha-Matos; Hamideh A Название: Knowledge and Technology Integration in Production and Services ISBN: 1475756321 ISBN-13(EAN): 9781475756326 Издательство: Springer Рейтинг: Цена: 27950.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Knowledge and Technology Integration in Production and Services presents novel application scenarios for balanced distributed and integrated systems based on knowledge and up-to-date technology and provides a great opportunity for discussion of concepts, models, methodologies, technological developments, case studies, new research ideas, and other results among specialists. It comprises the proceedings of the Fifth International Conference on Information Technology for BALANCED AUTOMATION SYSTEMS in Manufacturing and Services (BASYS'02), which was sponsored by the International Federation for Information Processing (IFIP) and held in September 2002 in Cancun, Mexico. BASYS'02 aimed mainly at balancing knowledge and technology in manufacturing, services and the product life-cycle. Namely, a balance is considered between local knowledge-intensive solutions and global performance in highly distributed systems, based on diverse technologies (such as virtual organizations, holonic manufacturing systems or multi-agent systems for design and diagnostics). The contributions are focused on interoperability and standardization issues, open architectures as well as knowledge-based integration paradigms, with special attention being paid to product-service integration, customer-production integration, and product life-cycle stages integration. This book is essential reading for researchers, industrial managers, practitioners, developers, users or technology transfer experts - working in quite different fields such as automatic control, systems planning and integration, enterprise architecture, planning and scheduling, flexible manufacturing, knowledge engineering, business processes management or in the field of social impact studies.
Автор: Jeffrey A. Davis; James D. Meindl Название: Interconnect Technology and Design for Gigascale Integration ISBN: 1461350883 ISBN-13(EAN): 9781461350880 Издательство: Springer Рейтинг: Цена: 20962.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book is jointly authored by leading academic and industry researchers. The material is unique in that it spans IC interconnect topics ranging from IBM`s revolutionary copper process to an in-depth exploration into interconnect-aware computer architectures.
Описание: New trends in the fashion market dictate the need for a new approach. This book discusses such an approach, which must be a shorter cycle from conception to retail, as well as a shift from labor-intensive to technology- and knowledge-intensive manufacturing.
Автор: Garrou Philip Название: Handbook of 3d Integration V1 and 2 ISBN: 3527332650 ISBN-13(EAN): 9783527332656 Издательство: Wiley Рейтинг: Цена: 23118.00 р. Наличие на складе: Поставка под заказ.
Описание: With contributions from key players in both academia and industry, this first encompassing treatise of this important field puts the known physical limitations for classic 2D electronics into perspective with the need for further electronics developments and market necessities.
Автор: Darabi Название: Integration of Passive RF Front End Components in SoCs ISBN: 0521111269 ISBN-13(EAN): 9780521111263 Издательство: Cambridge Academ Рейтинг: Цена: 14096.00 р. Наличие на складе: Поставка под заказ.
Описание: Examining key developments in highly integrated wireless RF front ends, this book describes problems with the use of surface acoustic wave (SAW) filters, evaluates alternative solutions for on-chip high-Q filtering, and presents M-phase filters in depth. This is core reading for practitioners and researchers in RF integrated circuit design.
Автор: Garrou P Название: Handbook of 3D Integration V 3 ISBN: 3527334661 ISBN-13(EAN): 9783527334667 Издательство: Wiley Рейтинг: Цена: 22643.00 р. Наличие на складе: Поставка под заказ.
Описание: Edited by key figures in the field and written by top authors from academia and industry, this book covers the intricate details of 3D process technology from both a technological and a materials science perspective.
Автор: Kiyotaka Wasa Название: Handbook of Sputter Deposition Technology, ISBN: 1437734839 ISBN-13(EAN): 9781437734836 Издательство: Elsevier Science Рейтинг: Цена: 21054.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Faetures a team of contributing authors with backgrounds specializing in the various new applications of sputtering technology. This book introduces the fundamentals of thin films and sputtering deposition, explores the theory and practices of this field, and also covers new technology such as nano-functional materials and MEMS.
Описание: The second section describes a collection of current, relevant characterization techniques, which provide essential information of the band structure of the semiconductors and carrier dynamics at the interface semiconductor.
Описание: This book surveys the technology and applications of TFTs, covering hydrogenated amorphous silicon, poly-crystalline silicon, transparent amorphous oxide semiconductors, organic semiconductors and others that form the core of the flat panel display industry.
Название: Mm-Wave Silicon Technology: 60 GHz and Beyond ISBN: 0387765581 ISBN-13(EAN): 9780387765587 Издательство: Springer Рейтинг: Цена: 30745.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book compiles and presents the research results from the past five years in mm-wave Silicon circuits. This area has received a great deal of interest from the research community including several university and research groups. The book covers device modeling, circuit building blocks, phased array systems, and antennas and packaging.
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