Автор: P. Singh; Puligandla Viswanadham Название: Failure Modes and Mechanisms in Electronic Packages ISBN: 1461377633 ISBN-13(EAN): 9781461377634 Издательство: Springer Рейтинг: Цена: 26122.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.
The Finite Element Method and Applications with ANSYS(R) provides the reader with theoretical and practical knowledge of the finite element method and with the skills required to analyze engineering problems with ANSYS(R), a commercially available FEA program. This self-contained, introductory text minimizes the need for additional reference material, covering the fundamental topics in finite element methods as well as advanced topics concerning modeling and analysis with ANSYS(R). These topics are introduced through extensive examples from various engineering disciplines, presented in a step-by-step fashion. The book focuses on the use of ANSYS(R) through both the Graphics User Interface (GUI) and the ANSYS(R) Parametric Design Language (APDL).
The text details more than 40 example problems, with solutions demonstrated in a step-by-step fashion, primarily through the use of GUI and, to a lesser extent, APDL.
Furthermore, it includes a CD-ROM with the "input" files for the example problems so that readers can regenerate them on their own computers, as well as the colored figures and screen shots.
Students, researchers, and practicing engineers will find this an essential reference for use in predicting and simulating the physical behavior of complex engineering systems using ANSYS(R).
Описание: Renowned for its superb illustrations and highly practical information, the third edition of this classic reference reflects the very latest in state-of-the-art imaging technology. Together with Volumes 1 and 2, this compact and portable book provides a highly specialized navigational tool for clinicians seeking to master the ability to recognize anatomical structures and accurately interpret CT and MR images. Highlights of Volume 3: New CT and MR images of the highest quality Didactic organization using two-page units, with radiographs on one page and full-color illustrations on the next Concise, easy-to-read labeling on all figures Color-coded, schematic diagrams that indicate the level of each section Sectional enlargements for detailed classification of the anatomical structure Comprehensive, compact, and portable, this popular book is ideal for use in both the classroom and clinical setting.
Описание: Leaching tests are conducted according to different standards, pro- cedures or recommendations, generally under conditions different from those of the disposal media.
Описание: Presents the reader with theoretical and practical knowledge of the finite element method and with the skills required to analyze engineering problems with ANSYS[registered], an FEA program. This book focuses on the use of ANSYS[registered] through both the Graphics User Interface (GUI) and the ANSYS[registered] Parametric Design Language (APDL).
Описание: Deals with understanding the complex stress distributions, transfer mechanisms, warpage, and potential failures arising from the encapsulation of devices in plastic. This book emphasises on the correct use of finite element tools for these problems.
Автор: X.J. Fan; E. Suhir Название: Moisture Sensitivity of Plastic Packages of IC Devices ISBN: 1461426251 ISBN-13(EAN): 9781461426257 Издательство: Springer Рейтинг: Цена: 34937.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. It includes numerous industrial applications, along with the results of the most recent research and development efforts.
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