Описание: Deals with understanding the complex stress distributions, transfer mechanisms, warpage, and potential failures arising from the encapsulation of devices in plastic. This book emphasises on the correct use of finite element tools for these problems.
Автор: Pogaku Ravindra; Kenthorai Raman Jegannathan Название: Production of biodiesel using lipase encapsulated in ?-carrageenan ISBN: 3319108212 ISBN-13(EAN): 9783319108216 Издательство: Springer Рейтинг: Цена: 9141.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: For these reasons, immobilized enzymatic process has been developed which retains the advantages of the soluble enzymatic process and reuse of the enzyme is possible which decreases the enzyme cost, the biodiesel produced does not contain any enzyme residue and the activity of the enzyme can be increased by immobilization.
Автор: X.J. Fan; E. Suhir Название: Moisture Sensitivity of Plastic Packages of IC Devices ISBN: 1461426251 ISBN-13(EAN): 9781461426257 Издательство: Springer Рейтинг: Цена: 34937.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. It includes numerous industrial applications, along with the results of the most recent research and development efforts.
Описание: Leaching tests are conducted according to different standards, pro- cedures or recommendations, generally under conditions different from those of the disposal media.
Автор: P. Singh; Puligandla Viswanadham Название: Failure Modes and Mechanisms in Electronic Packages ISBN: 1461377633 ISBN-13(EAN): 9781461377634 Издательство: Springer Рейтинг: Цена: 26122.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.
Описание: Describes the method of fatigue life prediction of solder joints in electronic packages in detail starting from the theoretical basis. This title provides reader with an add-on software package to ANSYS that is designed for solder joint fatigue reliability analysis of electronic packages. It also discusses the steps of the analysis method.
