Fine Particles Science and Technology, E. PELIZZETTI

Автор: Phil Marcoux
Название: Fine Pitch Surface Mount Technology
ISBN: 1461365678 ISBN-13(EAN): 9781461365679
Издательство: Springer
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Цена: 20896.00 р.
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Описание: The knowledge of the terms and demands of FPT currently exceed the usage of FPT packaged components, but this is changing rapidly because of the size, performance, and cost savings of FPT.

Автор: Kiyotaka Wasa
Название: Handbook of Sputter Deposition Technology,
ISBN: 1437734839 ISBN-13(EAN): 9781437734836
Издательство: Elsevier Science
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Цена: 21054.00 р.
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Описание: Faetures a team of contributing authors with backgrounds specializing in the various new applications of sputtering technology. This book introduces the fundamentals of thin films and sputtering deposition, explores the theory and practices of this field, and also covers new technology such as nano-functional materials and MEMS.

Автор: E. PELIZZETTI
Название: Fine Particles Science and Technology
ISBN: 0792340477 ISBN-13(EAN): 9780792340478
Издательство: Springer
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Цена: 66943.00 р.
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Описание: Proceedings of the NATO Advanced Research Workshop, Acquafredda di Maratea, Italy, July 15-21, 1995

Автор: Phil Marcoux
Название: Fine Pitch Surface Mount Technology
ISBN: 0442008627 ISBN-13(EAN): 9780442008628
Издательство: Springer
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Цена: 28732.00 р.
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Описание: Fine pitch technology (FPT) is an assembly technology for dealing with high lead count integrated circuits. This guide to FPT emphasizes its quality implementation, detailing the pros, cons, and practicality of various FPT processes and automation methods from the practitioner`s viewpoint.

Автор: Vladimir Anikeev
Название: Supercritical Fluid Technology for Energy and Environmental Appli
ISBN: 0444626964 ISBN-13(EAN): 9780444626967
Издательство: Elsevier Science
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Цена: 23244.00 р.
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Описание: Covers the fundamental principles involved in the preparation and characterization of supercritical fluids (SCFs) used in the energy production and other environmental applications. This book features the basics of sub- and supercritical fluids, like thermodynamics of phase and chemical equilibria, mathematical modeling, and process calculations.

Автор: S.D. Brotherton
Название: Introduction to Thin Film Transistors: Physics and Technology of TFTs
ISBN: 3319000012 ISBN-13(EAN): 9783319000015
Издательство: Springer
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Цена: 10480.00 р.
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Описание: This book surveys the technology and applications of TFTs, covering hydrogenated amorphous silicon, poly-crystalline silicon, transparent amorphous oxide semiconductors, organic semiconductors and others that form the core of the flat panel display industry.

Автор: Hinds, William C.
Название: Aerosol technology 2 ed.
ISBN: 0471194107 ISBN-13(EAN): 9780471194101
Издательство: Wiley
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Цена: 26128.00 р.
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Описание: `Aerosol Technology` is aimed at students and professionals who need to acquire a thorough working knowledge of modern aerosol theory and applications.

Название: Mm-Wave Silicon Technology: 60 GHz and Beyond
ISBN: 0387765581 ISBN-13(EAN): 9780387765587
Издательство: Springer
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Цена: 30745.00 р.
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Описание: This book compiles and presents the research results from the past five years in mm-wave Silicon circuits. This area has received a great deal of interest from the research community including several university and research groups. The book covers device modeling, circuit building blocks, phased array systems, and antennas and packaging.

Автор: Donald Watson; David Tinsley
Название: Integrating Information Technology into Education
ISBN: 1475755279 ISBN-13(EAN): 9781475755275
Издательство: Springer
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Цена: 27950.00 р.
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Описание: In order to help focus the papers and discussion we identified 7 themes: * Current developments in society and education influencing integration;

Автор: Jeffrey A. Davis; James D. Meindl
Название: Interconnect Technology and Design for Gigascale Integration
ISBN: 1461350883 ISBN-13(EAN): 9781461350880
Издательство: Springer
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Цена: 20962.00 р.
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Описание: This book is jointly authored by leading academic and industry researchers. The material is unique in that it spans IC interconnect topics ranging from IBM`s revolutionary copper process to an in-depth exploration into interconnect-aware computer architectures.