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Photonic Interconnects for Computing Systems, NIKDAST, NICOLESCU, BEUX & XU


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Автор: NIKDAST, NICOLESCU, BEUX & XU
Название:  Photonic Interconnects for Computing Systems
ISBN: 9788793519800
Издательство: Taylor&Francis
Классификация:


ISBN-10: 879351980X
Обложка/Формат: Hardback
Страницы: 360
Вес: 0.81 кг.
Дата издания: 30.05.2017
Серия: River publishers series in optics and photonics
Язык: English
Размер: 234 x 156 x 25
Читательская аудитория: Postgraduate, research & scholarly
Ключевые слова: Electronic devices & materials,Computer networking & communications, COMPUTERS / Networking / General,TECHNOLOGY & ENGINEERING / Electronics / Optoelectronics
Подзаголовок: Understanding and pushing design challenges
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Поставляется из: Европейский союз
Описание: In recent years, there has been a considerable amount of effort, both in industry and academia, focusing on the design, implementation, performance analysis, evaluation and prediction of silicon photonic interconnects for inter- and intra-chip communication, paving the way for the design and dimensioning of the next and future generation of high-performance computing systems. Photonic Interconnects for Computing Systems provides a comprehensive overview of the current state-of-the-art technology and research achievements in employing silicon photonics for interconnection networks and high-performance computing, summarizing main opportunities and some challenges. The majority of the chapters were collected from presentations made at the International Workshop on Optical/Photonic Interconnects for Computing Systems (OPTICS) held over the past two years. The workshop invites internationally recognized speakers on the range of topics relevant to silicon photonics and computing systems. Technical topics discussed in the book include: Design and Implementation of Chip-Scale Photonic Interconnects;  Developing Design Automation Solutions for Chip-Scale Photonic Interconnects;  Design Space Exploration in Chip-Scale Photonic Interconnects;  Thermal Analysis and Modeling in Photonic Interconnects;  Design for Reliability; Fabrication Non-Uniformity in Photonic Interconnects; Photonic Interconnects for Computing Systems presents a compilation of outstanding contributions from leading research groups in the field. It presents a comprehensive overview of the design, advantages, challenges, and requirements of photonic interconnects for computing systems. The selected contributions present important discussions and approaches related to the design and development of novel photonic interconnect architectures, as well as various design solutions to improve the performance of such systems while considering different challenges. The book is ideal for personnel in computer/photonic industries as well as academic staff and master/graduate students in computer science and engineering, electronic engineering, electrical engineering and photonics.


Photonics : linear and nonlinear interactions of laser light and matter

Автор: Menzel
Название: Photonics : linear and nonlinear interactions of laser light and matter
ISBN: 3540231609 ISBN-13(EAN): 9783540231608
Издательство: Springer
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Цена: 18167.00 р.
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Описание: The definition of "photonics" has been broadened in recent years to include nonlinear and quantum optics, today usually based on laser light. This book covers the fundamental properties of photon and light beams, both experimentally and theoretically. It covers the essentials of linear interactions and most of the nonlinear interactions between light and matter in both the transparent and absorbing cases. It also provides a basic knowledge of modern lasers, as well as the principles of nonlinear optical spectroscopy. It is self-consistent and enriched by a large number of calculated illustrations, examples, and descriptive tables. Graduate students in physics and electrical engineering, as well as other sciences, will find this book a thorough introduction to the field, while for lecturers and scientists it offers a rich source of useful information and a ready-to-hand reference. About 4000 references open access to original literature.The second edition is completely revised and enlarged. 

Variation Tolerant On-Chip Interconnects

Автор: Ethiopia Enideg Nigussie
Название: Variation Tolerant On-Chip Interconnects
ISBN: 1489990860 ISBN-13(EAN): 9781489990860
Издательство: Springer
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Цена: 18167.00 р.
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Описание: This book presents design techniques, analysis and implementation of high performance and power efficient, variation tolerant on-chip interconnects. It is for anyone concerned with the design of next generation, high-performance electronics systems.

Optical Interconnects for Data Centers

Автор: Tekin, Tolga
Название: Optical Interconnects for Data Centers
ISBN: 0081005121 ISBN-13(EAN): 9780081005125
Издательство: Elsevier Science
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Цена: 31686.00 р.
Наличие на складе: Поставка под заказ.

Описание: Current data centre networks, based on electronic packet switches, are experiencing an exponential increase in network traffic due to developments such as cloud computing. Optical interconnects have emerged as a promising alternative offering high throughput and reduced power consumption. Optical Interconnects for Data Centers reviews key developments in the use of optical interconnects in data centres and the current state of the art in transforming this technology into a reality. The book discusses developments in optical materials and components (such as single and multi-mode waveguides), circuit boards and ways the technology can be deployed in data centres. . Optical Interconnects for Data Centers is a key reference text for electronics designers, optical engineers, communications engineers and R&D managers working in the communications and electronics industries as well as postgraduate researchers.

Carbon Nanotubes for Interconnects

Автор: Todri-Sanial
Название: Carbon Nanotubes for Interconnects
ISBN: 3319297449 ISBN-13(EAN): 9783319297446
Издательство: Springer
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Цена: 16070.00 р.
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Описание: This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.

Carbon Nanotube Based VLSI Interconnects

Автор: Brajesh Kumar Kaushik; Manoj Kumar Majumder
Название: Carbon Nanotube Based VLSI Interconnects
ISBN: 8132220463 ISBN-13(EAN): 9788132220466
Издательство: Springer
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Цена: 8489.00 р.
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Описание: The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects.

Compact Models and Performance Investigations for Subthreshold Interconnects

Автор: Rohit Dhiman; Rajeevan Chandel
Название: Compact Models and Performance Investigations for Subthreshold Interconnects
ISBN: 8132221311 ISBN-13(EAN): 9788132221319
Издательство: Springer
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Цена: 15672.00 р.
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Описание: The book provides a detailed analysis of issues related to sub-threshold interconnect performance from the perspective of analytical approach and design techniques.

Crosstalk in Modern On-Chip Interconnects

Автор: B.K. Kaushik; V. Ramesh Kumar; Amalendu Patnaik
Название: Crosstalk in Modern On-Chip Interconnects
ISBN: 9811007993 ISBN-13(EAN): 9789811007996
Издательство: Springer
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Цена: 9141.00 р.
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Описание: The book provides accurate FDTDmodels for on-chip interconnects, covering most recent advancements inmaterials and design. It presents thestructure, properties, and characteristics of graphene based on-chipinterconnects and the FDTD modeling of Cu based on-chip interconnects.

The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects

Автор: G?nter Grossmann; Christian Zardini
Название: The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
ISBN: 1447158407 ISBN-13(EAN): 9781447158400
Издательство: Springer
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Цена: 18284.00 р.
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Описание: This book brings together contributions from the leading European experts in lead-free soldering. It offers comprehensive coverage of the scientific background and its applications in reliability testing of lead-free solder joints.

Optical Interconnects for Future Data Center Networks

Автор: Christoforos Kachris; Keren Bergman; Ioannis Tomko
Название: Optical Interconnects for Future Data Center Networks
ISBN: 1493943758 ISBN-13(EAN): 9781493943753
Издательство: Springer
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Цена: 15672.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: This volume shows how optical interconnects can be used to provide high-bandwidth, energy-efficient interconnects for data centers of the future characterized by increased bandwidth requirements, presenting the latest and most promising technologies.

Compact Models and Performance Investigations for Subthreshold Interconnects

Автор: Rohit Dhiman; Rajeevan Chandel
Название: Compact Models and Performance Investigations for Subthreshold Interconnects
ISBN: 8132229975 ISBN-13(EAN): 9788132229971
Издательство: Springer
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Цена: 13059.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: The book provides a detailed analysis of issues related to sub-threshold interconnect performance from the perspective of analytical approach and design techniques.


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