Delays and Interconnections: Methodology, Algorithms and Applications, Giorgio Valmorbida; Alexandre Seuret; Islam Boussa
Автор: Andrew B. Kahng; Gabriel Robins Название: On Optimal Interconnections for VLSI ISBN: 0792394836 ISBN-13(EAN): 9780792394839 Издательство: Springer Рейтинг: Цена: 30606.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Describes, from a geometric perspective, algorithms for high-performance, high-density interconnections during the global and detailed routing phases of circuit layout. This book addresses area minimization, with a focus on near-optimal approximation algorithms for minimum-cost Steiner routing.
Автор: G.G. Harman; Pavel Mach Название: Microelectronic Interconnections and Assembly ISBN: 9401061599 ISBN-13(EAN): 9789401061599 Издательство: Springer Рейтинг: Цена: 12157.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Proceedings of the NATO Advanced Research Workshop, Prague, Czech Republic, 18-21 May 1996
Описание: This book offers a thorough understanding of the applications of finite element method (FEM) to reliability modeling and an appreciation of the strengths and weaknesses of various numerical models for interconnect reliability.
Автор: Tan Cher Ming Название: Electromigration In Ulsi Interconnections ISBN: 9814273325 ISBN-13(EAN): 9789814273329 Издательство: World Scientific Publishing Рейтинг: Цена: 15840.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Presents a description of the electro migration in integrated circuits. This book examines the various interconnected systems and their evolution employed in integrated circuit technology. It is suitable for readers on electro migration in ULSI interconnections.
Описание: This book discusses some research results for CMOS-compatible silicon-based optical devices and interconnections. With accurate simulation and experimental demonstration, it provides insights on silicon-based modulation, advanced multiplexing, polarization and efficient coupling controlling technologies, which are widely used in silicon photonics. Researchers, scientists, engineers and especially students in the field of silicon photonics can benefit from the book. This book provides valuable knowledge, useful methods and practical design that can be considered in emerging silicon-based optical interconnections and communications. And it also give some guidance to student how to organize and complete an good dissertation.
Автор: William Greig Название: Integrated Circuit Packaging, Assembly and Interconnections ISBN: 1441939237 ISBN-13(EAN): 9781441939234 Издательство: Springer Рейтинг: Цена: 15672.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing.
Автор: Andrew B. Kahng; Gabriel Robins Название: On Optimal Interconnections for VLSI ISBN: 1441951458 ISBN-13(EAN): 9781441951458 Издательство: Springer Рейтинг: Цена: 30606.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Recent minimum-delay constructions are highlighted, including provably good cost-radius tradeoffs, critical-sink routing algorithms, Elmore delay-optimal routing, graph Steiner arborescences, non-tree routing, and wiresizing.
Автор: Raif O. Onvural; Arne Nilsson Название: Local Area Network Interconnection ISBN: 1461362822 ISBN-13(EAN): 9781461362821 Издательство: Springer Рейтинг: Цена: 6986.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Proceedings of the First International Conference held in Research Triangle Park, North Carolina, October 20-22, 1993
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