Test Generation of Crosstalk Delay Faults in VLSI Circuits, S. Jayanthy; M.C. Bhuvaneswari
Автор: S. Jayanthy; M.C. Bhuvaneswari Название: Test Generation of Crosstalk Delay Faults in VLSI Circuits ISBN: 9811324921 ISBN-13(EAN): 9789811324925 Издательство: Springer Рейтинг: Цена: 19564.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание:
This book describes a variety of test generation algorithms for testing crosstalk delay faults in VLSI circuits. It introduces readers to the various crosstalk effects and describes both deterministic and simulation-based methods for testing crosstalk delay faults. The book begins with a focus on currently available crosstalk delay models, test generation algorithms for delay faults and crosstalk delay faults, before moving on to deterministic algorithms and simulation-based algorithms used to test crosstalk delay faults. Given its depth of coverage, the book will be of interest to design engineers and researchers in the field of VLSI Testing.
Автор: Chunjie Duan; Brock J. LaMeres Название: On and Off-Chip Crosstalk Avoidance in VLSI Design ISBN: 1489983279 ISBN-13(EAN): 9781489983275 Издательство: Springer Рейтинг: Цена: 18284.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Crosstalk is a major challenge that Deep Submicron processes present to VLSI circuit designers. This book covers crosstalk avoidance with bus encoding, a technique that mitigates crosstalk and improves the speed and power consumption of the bus interconnect.
Автор: Pinhong Chen; Desmond A. Kirkpatrick; Kurt Keutzer Название: Static Crosstalk-Noise Analysis ISBN: 1475779496 ISBN-13(EAN): 9781475779493 Издательство: Springer Рейтинг: Цена: 13974.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Автор: B.K. Kaushik; V. Ramesh Kumar; Amalendu Patnaik Название: Crosstalk in Modern On-Chip Interconnects ISBN: 9811007993 ISBN-13(EAN): 9789811007996 Издательство: Springer Рейтинг: Цена: 9141.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The book provides accurate FDTDmodels for on-chip interconnects, covering most recent advancements inmaterials and design. It presents thestructure, properties, and characteristics of graphene based on-chipinterconnects and the FDTD modeling of Cu based on-chip interconnects.
Автор: Angela Krstic; Kwang-Ting (Tim) Cheng Название: Delay Fault Testing for VLSI Circuits ISBN: 1461375614 ISBN-13(EAN): 9781461375616 Издательство: Springer Рейтинг: Цена: 19591.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: In that sense, this book is the best x DELAY FAULT TESTING FOR VLSI CIRCUITS available guide for an engineer designing or testing VLSI systems. Tech- niques for path delay testing and for use of slower test equipment to test high-speed circuits are of particular interest.
Автор: Mrozek Название: Multi-run Memory Tests for Pattern Sensitive Faults ISBN: 3319912038 ISBN-13(EAN): 9783319912035 Издательство: Springer Рейтинг: Цена: 6986.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book describes efficient techniques for production testing as well as for periodic maintenance testing (specifically in terms of multi-cell faults) in modern semiconductor memory. Formal methods for multi-run test generation and many solutions to increase their efficiency are described in detail.
Описание: This book describes fault tolerance techniques based on software and hardware to create hybrid techniques. The authors then discuss the best trade-off between software-based and hardware-based techniques and introduce novel hybrid techniques.
Автор: Jitendra B. Khare; Wojciech Maly Название: From Contamination to Defects, Faults and Yield Loss ISBN: 146128595X ISBN-13(EAN): 9781461285953 Издательство: Springer Рейтинг: Цена: 16979.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Given such a high level of investment, it is critical for IC manufacturers to reduce manufacturing costs and get a better return on their investment. The most obvious method of reducing the manufacturing cost per die is to improve manufacturing yield.
Автор: Jitendra B. Khare; Wojciech Maly Название: From Contamination to Defects, Faults and Yield Loss ISBN: 0792397142 ISBN-13(EAN): 9780792397144 Издательство: Springer Рейтинг: Цена: 19591.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Given such a high level of investment, it is critical for IC manufacturers to reduce manufacturing costs and get a better return on their investment. The most obvious method of reducing the manufacturing cost per die is to improve manufacturing yield.
Автор: Ireneusz Mrozek Название: Multi-run Memory Tests for Pattern Sensitive Faults ISBN: 3030081982 ISBN-13(EAN): 9783030081980 Издательство: Springer Рейтинг: Цена: 12577.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book describes efficient techniques for production testing as well as for periodic maintenance testing (specifically in terms of multi-cell faults) in modern semiconductor memory. The author discusses background selection and address reordering algorithms in multi-run transparent march testing processes. Formal methods for multi-run test generation and many solutions to increase their efficiency are described in detail. All methods presented ideas are verified by both analytical investigations and numerical simulations.Provides the first book related exclusively to the problem of multi-cell fault detection by multi-run tests in memory testing process;Presents practical algorithms for design and implementation of efficient multi-run tests;Demonstrates methods verified by analytical and experimental investigations.
Автор: Mohammad Tehranipoor; Ke Peng; Krishnendu Chakraba Название: Test and Diagnosis for Small-Delay Defects ISBN: 1489989528 ISBN-13(EAN): 9781489989529 Издательство: Springer Рейтинг: Цена: 15672.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book introduces new techniques for detecting and diagnosing small-delay defects in integrated circuits. It details effective and scalable methodologies for screening and diagnosing small-delay defects.
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