3D Microelectronic Packaging: From Architectures to Applications, Li Yan, Goyal Deepak
Автор: Li Yan, Goyal Deepak Название: 3D Microelectronic Packaging: From Fundamentals to Applications ISBN: 3319830864 ISBN-13(EAN): 9783319830865 Издательство: Springer Рейтинг: Цена: 25155.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages.
Автор: J?rg Schwizer; Michael Mayer; Oliver Brand Название: Force Sensors for Microelectronic Packaging Applications ISBN: 3642060633 ISBN-13(EAN): 9783642060632 Издательство: Springer Рейтинг: Цена: 20962.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Sensor Design.- Measurement System.- Characterization.- Applications.- Conclusions and Outlook.
Автор: Yeh Lian-Tuu Название: Thermal Design of Liquid Cooled Microelectronic Equipment ISBN: 0791861937 ISBN-13(EAN): 9780791861936 Издательство: Mare Nostrum (Eurospan) Рейтинг: Цена: 20097.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Focuses on providing practical solutions to thermal issues related to high power systems where liquid cooling is required. The book serves as a general thermal design guide for any liquid cooled systems with the main focus on microelectronic equipment that includes digital and/or analogue devices.
Описание: Radio-Frequency Microelectronic Circuits for Telecommunication Applications covers the design issues of radio-frequency microelectronic circuits for telecommunication applications with emphasis on devices and circuit-level design.
Описание: Radio-Frequency Microelectronic Circuits for Telecommunication Applications covers the design issues of radio-frequency microelectronic circuits for telecommunication applications with emphasis on devices and circuit-level design.
Автор: J. T. Milek Название: Silicon Nitride for Microelectronic Applications ISBN: 1461596114 ISBN-13(EAN): 9781461596110 Издательство: Springer Рейтинг: Цена: 6986.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability, and testing.
Автор: R.A. Levy Название: Microelectronic Materials and Processes ISBN: 0792301544 ISBN-13(EAN): 9780792301547 Издательство: Springer Рейтинг: Цена: 48774.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Proceedings of the NATO Advanced Study Institute, Il Ciocco, Castelvecchio Pascoli, Italy, June 30-July 11, 1986
Автор: Gross Название: Chemical Perspectives of Microelectronic Materials ISBN: 1107410843 ISBN-13(EAN): 9781107410848 Издательство: Cambridge Academ Цена: 4277.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Название: Defects in Microelectronic Materials and Devices ISBN: 0367386399 ISBN-13(EAN): 9780367386399 Издательство: Taylor&Francis Рейтинг: Цена: 10104.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание:
Uncover the Defects that Compromise Performance and Reliability As microelectronics features and devices become smaller and more complex, it is critical that engineers and technologists completely understand how components can be damaged during the increasingly complicated fabrication processes required to produce them.
A comprehensive survey of defects that occur in silicon-based metal-oxide semiconductor field-effect transistor (MOSFET) technologies, this book also discusses flaws in linear bipolar technologies, silicon carbide-based devices, and gallium arsenide materials and devices. These defects can profoundly affect the yield, performance, long-term reliability, and radiation response of microelectronic devices and integrated circuits (ICs). Organizing the material to build understanding of the problems and provide a quick reference for scientists, engineers and technologists, this text reviews yield- and performance-limiting defects and impurities in the device silicon layer, in the gate insulator, and/or at the critical Si/SiO2 interface. It then examines defects that impact production yield and long-term reliability, including:
Vacancies, interstitials, and impurities (especially hydrogen)
Negative bias temperature instabilities
Defects in ultrathin oxides (SiO2 and silicon oxynitride)
Take A Proactive Approach The authors condense decades of experience and perspectives of noted experimentalists and theorists to characterize defect properties and their impact on microelectronic devices. They identify the defects, offering solutions to avoid them and methods to detect them. These include the use of 3-D imaging, as well as electrical, analytical, computational, spectroscopic, and state-of-the-art microscopic methods. This book is a valuable look at challenges to come from emerging
Автор: G.G. Harman; Pavel Mach Название: Microelectronic Interconnections and Assembly ISBN: 9401061599 ISBN-13(EAN): 9789401061599 Издательство: Springer Рейтинг: Цена: 12157.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Proceedings of the NATO Advanced Research Workshop, Prague, Czech Republic, 18-21 May 1996
To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting.
This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging.
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