Описание: The increasing demand for more content, services, and security drives the development of high-speed wireless technologies, optical communication, automotive radar, imaging and sensing systems and many other mm-wave and THz applications. S-parameter measurement at mm-wave and sub-mm wave frequencies plays a crucial role in the modern IC design debug. Most importantly, however, is the step of device characterization for development and optimization of device model parameters for new technologies. Accurate characterization of the intrinsic device in its entire operation frequency range becomes extremely important and this task is very challenging. This book presents solutions for accurate mm-wave characterization of advanced semiconductor devices. It guides through the process of development, implementation and verification of the in-situ calibration methods optimized for high-performance silicon technologies. Technical topics discussed in the book include: Specifics of S-parameter measurements of planar structures Complete mathematical solution for lumped-standard based calibration methods, including the transfer Thru-Match-Reflect (TMR) algorithms Design guideline and examples for the on-wafer calibration standards realized in both advanced SiGe BiCMOS and RF CMOS processes Methods for verification of electrical characteristics of calibration standards and accuracy of the in-situ calibration results Comparison of the new technique vs. conventional approaches: the probe-tip calibration and the pad parasitic de-embedding for various device types, geometries and model parameters New aspects of the on-wafer RF measurements at mmWave frequency range and calibration assurance.
Автор: Seiter Название: Automatic Methods for the Refinement of System Models ISBN: 3319414798 ISBN-13(EAN): 9783319414799 Издательство: Springer Рейтинг: Цена: 7685.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book provides a comprehensive overview of automatic model refinement, which helps readers close the gap between initial textual specification and its desired implementation. The authors enable readers to follow two “directions” for refinement: Vertical refinement, for adding detail and precision to single description for a given model and Horizontal refinement, which considers several views on one level of abstraction, refining the system specification by dedicated descriptions for structure or behavior. The discussion includes several methods which support designers of electronic systems in this refinement process, including verification methods to check automatically whether a refinement has been conducted as intended.
Автор: Stuart K. Tewksbury Название: Wafer-Level Integrated Systems ISBN: 0792390067 ISBN-13(EAN): 9780792390060 Издательство: Springer Рейтинг: Цена: 30606.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: From the perspective of complex systems, conventional Ie`s can be regarded as "discrete" devices interconnected according to system design objectives imposed at the circuit board level and higher levels in the system implementation hierarchy.
Автор: Earl E. Swartzlander Jr. Название: Wafer Scale Integration ISBN: 0792390032 ISBN-13(EAN): 9780792390039 Издательство: Springer Рейтинг: Цена: 41787.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Wafer Scale Integration (WSI) is the culmination of the quest for larger integrated circuits. In contrast in WSI, a wafer is fabricated with several types of circuits (generally referred to as cells), with multiple instances of each cell type, the cells are tested, and good cells are interconnected to realize a system on the wafer.
Автор: Jeffrey Lang Название: Multi-Wafer Rotating MEMS Machines ISBN: 1461424593 ISBN-13(EAN): 9781461424598 Издательство: Springer Рейтинг: Цена: 20962.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The collaboration and research that was developed to produce the MIT Gas Turbine Engine are described in this book. The book discusses the technical details that have gone into producing the engine and the overall systems-level tradeoffs, in particular its motor compressors and turbine generators, and the decisions that have been made.
Автор: Earl E. Swartzlander Jr. Название: Wafer Scale Integration ISBN: 1461288967 ISBN-13(EAN): 9781461288961 Издательство: Springer Рейтинг: Цена: 36197.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Wafer Scale Integration (WSI) is the culmination of the quest for larger integrated circuits. In contrast in WSI, a wafer is fabricated with several types of circuits (generally referred to as cells), with multiple instances of each cell type, the cells are tested, and good cells are interconnected to realize a system on the wafer.
Автор: John H. Lau Название: Fan-Out Wafer-Level Packaging ISBN: 9811342660 ISBN-13(EAN): 9789811342660 Издательство: Springer Рейтинг: Цена: 13974.00 р. Наличие на складе: Поставка под заказ.
Описание: This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple’s iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP – such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. – are not well understood. Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP.
Автор: Chuan Seng Tan; Ronald J. Gutmann; L. Rafael Reif Название: Wafer Level 3-D ICs Process Technology ISBN: 1441945628 ISBN-13(EAN): 9781441945624 Издательство: Springer Рейтинг: Цена: 26120.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology.
Автор: Marin Alexe; Ulrich G?sele Название: Wafer Bonding ISBN: 3642059155 ISBN-13(EAN): 9783642059155 Издательство: Springer Рейтинг: Цена: 32651.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off.
Автор: Shichun Qu; Yong Liu Название: Wafer-Level Chip-Scale Packaging ISBN: 149391555X ISBN-13(EAN): 9781493915552 Издательство: Springer Рейтинг: Цена: 19564.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling.
Автор: Keser Название: Embedded and Fan-Out Wafer Level Packaging Technol ogies ISBN: 1119314135 ISBN-13(EAN): 9781119314134 Издательство: Wiley Рейтинг: Цена: 18525.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание:
Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges
Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons.
Filled with contributions from some of the field's leading experts, Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions.
Discusses specific company standards and their development results
Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging
Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.
Автор: Stuart K. Tewksbury Название: Wafer-Level Integrated Systems ISBN: 1461288983 ISBN-13(EAN): 9781461288985 Издательство: Springer Рейтинг: Цена: 30606.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: From the perspective of complex systems, conventional Ie`s can be regarded as "discrete" devices interconnected according to system design objectives imposed at the circuit board level and higher levels in the system implementation hierarchy.
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